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41. 发明授权

US10137616B2 Fabricating lightweight skin systems for large scale robotic characters 有权
公开(公告)号：US10137616B2
公开(公告)日：2018-11-27
申请号：US14040901
申请日：2013-09-30
申请人： DISNEY ENTERPRISES, INC.
发明人： Daniel Reetz , Philip John Jackson
IPC分类号： B29C59/16 , B23K26/361 , B29C44/56 , B23K26/362 , B23K26/046 , B23K103/00
摘要： A method of fabricating a skin system or its elements using a laser cutter. The laser cutter is controlled to perform multiple passes to selectively cut away layers of material on a surface of a sheet of cellular foam materials. Each layer of material to be removed is defined by a cut or texture pattern. The laser cutter is operated to cut deeper with each layer of material removed by setting a different resolution for the laser cutter for each layer. For example, a laser cutter may be selectively controlled to operate within a resolution range, and each layer defined by the same or different cut pattern is cut using a different resolution. The method includes associating lower resolution settings for the first or outer layers to remove a first depth of material from the skin sheet's surface and associating higher and higher resolution settings for additional layers.

42. 发明申请

US20180304402A1 EVALUATION JIG AND EVALUATION METHOD FOR HEIGHT POSITION DETECTION UNIT OF LASER PROCESSING APPARATUS 审中-公开
公开(公告)号：US20180304402A1
公开(公告)日：2018-10-25
申请号：US15962481
申请日：2018-04-25
申请人： DISCO CORPORATION
发明人： Kenji Furuta
IPC分类号： B23K26/03 , B23K26/046 , B23K26/08 , G01B7/02
CPC分类号： B23K26/03 , B23K26/046 , B23K26/083 , G01B7/02
摘要： Disclosed herein is an evaluation jig that is a jig to be used for evaluation of a height position detection unit that detects the height position of a holding surface of a chuck table of a laser processing apparatus. The evaluation jig includes a to-be-irradiated surface which is to be irradiated with a detection laser beam, an actuator that moves the to-be-irradiated surface in a Z-axis direction, a base section that supports the actuator and is mounted on the holding surface of the chuck table, and a control unit that controls movement of the actuator.

43. 发明申请

US20180221991A1 METHOD AND APPARATUS FOR FILAMENTATION OF WORKPIECES NOT HAVING A PLAN-PARALLEL SHAPE, AND WORKPIECE PRODUCED BY FILAMENTATION 审中-公开
公开(公告)号：US20180221991A1
公开(公告)日：2018-08-09
申请号：US15945992
申请日：2018-04-05
申请人： SCHOTT AG
发明人： Andreas ORTNER , Albrecht SEIDL , Frank-Thomas LENTES , Fabian WAGNER
IPC分类号： B23K26/53 , B23K26/08 , B23K26/0622 , B23K26/042 , B23K26/046 , B23K26/351
CPC分类号： B23K26/53 , B23K26/042 , B23K26/046 , B23K26/0624 , B23K26/0884 , B23K26/351 , B23K2101/40
摘要： A method for filamentation of a dielectric workpiece has a workpiece with a thickness between 0.5 and 20 mm is provided. The workpiece has boundary surfaces delimiting the workpiece. The thickness of the workpiece varies spatially and/or at least one of the boundary surfaces delimiting the workpiece has at least one curvature with a radius of curvature between 0.1 μm and 10 m. The dielectric workpiece can have a specially formed edge.

44. 发明授权

US09878399B2 Method and apparatus for welding dissimilar material with a high energy high power ultrafast laser 有权
公开(公告)号：US09878399B2
公开(公告)日：2018-01-30
申请号：US13835344
申请日：2013-03-15
申请人： Jian Liu
发明人： Jian Liu
IPC分类号： B23K26/00 , B23K26/32 , B23K26/03 , B23K26/046 , B23K26/26 , B23K26/323 , B23K26/211 , B23K26/082 , B23K26/0622 , B23K103/04 , B23K103/14 , B23K103/18 , B23K103/20 , B23K103/08
CPC分类号： B23K26/323 , B23K26/032 , B23K26/046 , B23K26/0624 , B23K26/082 , B23K26/211 , B23K26/26 , B23K2103/04 , B23K2103/14 , B23K2103/15 , B23K2103/18 , B23K2103/20 , B23K2103/26
摘要： Methods and systems for welding are disclosed, including generating electromagnetic radiation from an ultrashort pulse laser; coupling the electromagnetic radiation from the ultrashort pulse laser to a scanner comprising a scanning and focus range, wherein the scanner is configured to receive the electromagnetic radiation from the ultrashort laser and to scan and focus the electromagnetic radiation onto a joining interface of one or more materials; using a computer to adjust the pulse repetition rate and the average power of the ultrashort pulse laser; using one or more stages to position the joining interface; using a dichroic filter positioned between the scanner and the one or more materials; and focusing an imager and processor through the dichroic filter and onto the joining interface to monitor the joining interface of the one or more materials within the scanning and focus range of the electromagnetic radiation. Other embodiments are described and claimed.

45. 发明申请

US20170252859A1 SYSTEM FOR ASYMMETRIC OPTICAL BEAM SHAPING 审中-公开
公开(公告)号：US20170252859A1
公开(公告)日：2017-09-07
申请号：US15599720
申请日：2017-05-19
申请人： TRUMPF Laser- und Systemtechnik GmbH
发明人： Malte Kumkar , Jonas Kleiner , Daniel Grossmann , Daniel Flamm , Myriam Kaiser
IPC分类号： B23K26/00 , G02B27/09 , B23K26/046 , G02B5/00 , B23K26/042 , B23K26/06 , B23K26/073
CPC分类号： B23K26/53 , B23K26/042 , B23K26/046 , B23K26/06 , B23K26/064 , B23K26/073 , G02B5/001 , G02B27/095
摘要： For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

46. 发明授权

US09694447B1 Analytical laser ablation of solid samples for ICP, ICP-MS and FAG-MS analysis 有权
公开(公告)号：US09694447B1
公开(公告)日：2017-07-04
申请号：US14545987
申请日：2015-07-14
申请人： Steven K. Hughes , Robert C. Fry
发明人： Steven K. Hughes , Robert C. Fry
IPC分类号： G02B21/26 , B23K26/40 , B23K26/046 , B23K26/14
CPC分类号： B23K26/1405 , G01N21/718 , G02B5/0891 , G02B27/14
摘要： The present invention facilitates improvements in laser ablation of solid samples to be analyzed by an external inductively coupled plasma (ICP) emission spectrometer, ICP/mass-spectrometer (ICP-MS), or flowing afterglow (FAG) mass spectrometer (FAG-MS) for elemental analysis (ICP and ICP-MS) or molecular analysis (FAG-MS). A novel invention mirror-with-hole beam combiner eliminates chromatic aberration in the invention sample view and allows rad-hardening the laser ablation invention for use in a radiation hot cell for analysis of high activity nuclear waste. Many other novel invention rad-hardening attributes facilitate a comprehensive rad-hardened laser ablation system (the world's first). In other embodiments, invention novelties include unusually large homogeneous focused laser spot diameters, unusually long laser objective lens focal length, wide range operationally variable laser path length with built-in re-alignment, operationally variable demagnification ratio and diameter of the focused laser spot, the use of significantly higher powered SMR lasers in a large spot diameter to facilitate high sensitivity bulk analysis of solid samples, a demountable and gravitationally self-sealing stack assembly laser ablation cell, and the world's first auto-samplers (mechanized sample changers) for analytical laser ablation.

47. 发明授权

US09694443B2 Laser welding apparatus and laser welding method 有权
公开(公告)号：US09694443B2
公开(公告)日：2017-07-04
申请号：US14832275
申请日：2015-08-21
申请人： Furukawa Electric Co., Ltd.
发明人： Saburo Yagi , Takashi Shigematsu , Masaya Satou , Shinya Kojima
IPC分类号： B23K26/20 , H01R4/18 , H01R43/02 , H01R43/048 , B23K26/03 , B23K26/046 , B23K26/08 , B23K26/082 , B23K26/044 , B23K26/262 , G01B11/14 , B23K26/70 , H01R4/20 , H01R43/055 , B23K101/38
CPC分类号： B23K26/20 , B23K26/032 , B23K26/044 , B23K26/046 , B23K26/082 , B23K26/0846 , B23K26/262 , B23K26/702 , B23K2101/38 , G01B11/14 , H01R4/187 , H01R4/20 , H01R43/0221 , H01R43/048 , H01R43/055
摘要： A laser welding apparatus that welds a butted interface of a workpiece by laser light irradiation while successively feeding the workpiece having the butted interface to a welding position includes an X- and Y-axis scanner that scans laser light outputted from a laser light source in an X-axis direction and a Y-axis direction which are orthogonal to each other, a measuring device that measures a dimension along the butted interface, and a scanner control device that controls driving of the X- and Y-axis scanner so as to weld the butted interface by laser light irradiation.

48. 发明申请

US20170066079A1 Device for Mask Projection of Femtosecond and Picosecond Laser Beams with Blade, Mask, and Lens System 审中-公开
公开(公告)号：US20170066079A1
公开(公告)日：2017-03-09
申请号：US15302792
申请日：2015-05-12
申请人： Boegli Gravures SA
发明人： Günther Reisse , Steffen Weissmantel , Andy Engel , Manuel Pfeiffer , Alexander Kratsch , Charles Boegli , Matthias Kahl
IPC分类号： B23K26/066 , B23K26/046 , B23K26/12 , B23K26/14 , B23K26/0622 , B23K26/06
CPC分类号： B23K26/066 , B23K26/046 , B23K26/0624 , B23K26/0643 , B23K26/0648 , B23K26/1224 , B23K26/127 , B23K26/1462 , B23K26/16
摘要： The present application relates to a device for the mask projection of femtosecond or picosecond laser beams (2) onto a substrate surface, in which the laser beam (2) consisting of laser beam pulses is, at a location of the optical axis, formed to make laser beam pulses with an expanded laser beam cross section or laser beam pulses with a reduced laser beam cross section and said laser beam (2) has a homogeneous intensity distribution over the laser beam cross section. A stop (6) with a predetermined stop aperture geometry and a mask (7) with a predetermined mask aperture geometry are positioned in succession in the beam (2) path at the location. The device contains a field lens system (8) and an imaging lens (10), which are positioned in such a way that the non-diffracted and diffracted beam components of the laser beam (2) pulses transmitted by the stop (6) and the mask (7) are directed into the imaging lens (10) with a predetermined aperture with the aid of the field lens system (8) in such a way that a reduced image, ac curate in every detail and having a predetermined imaging ratio, of the intensity profile generated by the stop (6) and the mask (7) is generated over the laser beam cross section of the laser beam pulses in the imaging plane. In a beam guiding variant 1, an added lens system (16), the field lens system (8) and the imaging lens (10) are positioned relative to one another in such a way that a focus (19) is generated between the imaging lens (10) and the substrate surface and, in a beam guiding variant 2, the added lens system (16), the field lens system (8) and the imaging lens (10) are positioned relative to one another in such a way that a focus (22) is generated between the field lens system (8) and the imaging lens (10). At least one vacuum cuvette, which surrounds the region of the focus (19) and of the focus (22), is present.

49. 发明申请

US20160167166A1 LASER PROCESSING METHOD AND LASER BEAM IRRADIATION APPARATUS 审中-公开
标题翻译：激光加工方法和激光束辐射装置
公开(公告)号：US20160167166A1
公开(公告)日：2016-06-16
申请号：US14436616
申请日：2013-10-01
申请人： SUMITOMO Electric Industries ,Ltd.
发明人： Shigehiro NAGANO , Motoki KAKUI , Yasuhiro OKAMOTO , Akira OKADA
IPC分类号： B23K26/06 , B23K26/046
CPC分类号： B23K26/0648 , B23K26/046 , B23K26/0665
摘要： There is provided a laser processing method using a laser processing apparatus including a laser beam source for outputting a laser beam including a plurality of wavelength components, a collimating lens for receiving the laser beam, and a focusing lens for receiving the laser beam collimated by the collimating lens, the laser processing method including the step of: irradiating a material to be processed with the laser beam focused by the focusing lens in the laser processing apparatus. In the step of irradiating the material to be processed with the laser beam, positions of the collimating lens and the focusing lens are adjusted, and a wavefront shape of the laser beam received by the focusing lens is adjusted, thereby adjusting a size of a focusing area constituted by a plurality of focuses corresponding to the plurality of wavelength components of the laser beam focused by the focusing lens.
摘要翻译：提供一种使用激光加工装置的激光加工方法，该激光加工装置包括：激光束源，用于输出包括多个波长成分的激光束;准直透镜，用于接收激光束;以及聚焦透镜，用于接收由所述激光束准直的激光束准直透镜，该激光加工方法包括以下步骤：在激光加工设备中用聚焦透镜聚焦的激光束照射被处理材料。在用激光束照射待处理材料的步骤中，调整准直透镜和聚焦透镜的位置，调整由聚焦透镜接收的激光束的波前形状，从而调节聚焦的尺寸由与由聚焦透镜聚焦的激光束的多个波长分量对应的多个焦点构成的区域。

50. 发明申请

US20160001397A1 LASER PROCESSING APPARATUS 审中-公开
标题翻译：激光加工设备
公开(公告)号：US20160001397A1
公开(公告)日：2016-01-07
申请号：US14790662
申请日：2015-07-02
申请人： Microinspection, Inc.
发明人： Tak EUN , Cheol-woong BYUN , Young-min PARK
IPC分类号： B23K26/046 , B23K26/062 , B23K26/064 , B23K26/0622
CPC分类号： B23K26/046 , B23K26/0624 , B23K26/0648 , B23K26/0652 , H01S3/0057 , H01S3/1112
摘要： The present disclosure provides a laser processing apparatus. A laser processing apparatus includes a laser generator, a laser amplifier, a chromatic dispersion tuner and an optical focusing unit. The laser generator is configured to generate ultrashort pulse laser having chirp characteristics by simultaneously generating a plurality of wavelengths. The laser amplifier is configured to amplify the laser generated by the laser generator. The chromatic dispersion tuner is configured to adjust chirp and pulse width of the laser output from the laser amplifier. The optical focusing unit is configured to irradiate a workpiece with the laser after adjusting the depth of focus of the laser with the chirp and the pulse width adjusted by the chromatic dispersion tuner.
摘要翻译：本公开提供了一种激光加工设备。激光加工装置包括激光发生器，激光放大器，色散调谐器和光聚焦单元。激光发生器被配置为通过同时产生多个波长来产生具有啁啾特性的超短脉冲激光器。激光放大器被配置为放大由激光发生器产生的激光。色散调谐器被配置为调节来自激光放大器的激光输出的啁啾和脉冲宽度。光聚焦单元被配置为在利用啁啾调节激光器的焦深并且通过色散调谐器调节的脉冲宽度之后，用激光照射工件。

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