
基本信息:
- 专利标题: LASER PROCESSING APPARATUS
- 专利标题(中):激光加工设备
- 申请号:US14790662 申请日:2015-07-02
- 公开(公告)号:US20160001397A1 公开(公告)日:2016-01-07
- 发明人: Tak EUN , Cheol-woong BYUN , Young-min PARK
- 申请人: Microinspection, Inc.
- 优先权: KR10-2014-0083326 20140703
- 主分类号: B23K26/046
- IPC分类号: B23K26/046 ; B23K26/062 ; B23K26/064 ; B23K26/0622
摘要:
The present disclosure provides a laser processing apparatus. A laser processing apparatus includes a laser generator, a laser amplifier, a chromatic dispersion tuner and an optical focusing unit. The laser generator is configured to generate ultrashort pulse laser having chirp characteristics by simultaneously generating a plurality of wavelengths. The laser amplifier is configured to amplify the laser generated by the laser generator. The chromatic dispersion tuner is configured to adjust chirp and pulse width of the laser output from the laser amplifier. The optical focusing unit is configured to irradiate a workpiece with the laser after adjusting the depth of focus of the laser with the chirp and the pulse width adjusted by the chromatic dispersion tuner.
摘要(中):
本公开提供了一种激光加工设备。 激光加工装置包括激光发生器,激光放大器,色散调谐器和光聚焦单元。 激光发生器被配置为通过同时产生多个波长来产生具有啁啾特性的超短脉冲激光器。 激光放大器被配置为放大由激光发生器产生的激光。 色散调谐器被配置为调节来自激光放大器的激光输出的啁啾和脉冲宽度。 光聚焦单元被配置为在利用啁啾调节激光器的焦深并且通过色散调谐器调节的脉冲宽度之后,用激光照射工件。
IPC结构图谱:
B | 作业;运输 |
--B23 | 机床;不包含在其他类目中的金属加工 |
----B23K | 钎焊或脱焊;焊接;用钎焊或焊接方法包覆或镀敷;局部加热切割,如火焰切割;用激光束加工 |
------B23K26/00 | 用激光束加工,例如焊接,切割,打孔 |
--------B23K26/02 | .工件的定位和观测,如相对于冲击点,激光束的对正,瞄准或聚焦 |
----------B23K26/04 | ..激光束的自动对正,瞄准或聚焦,如应用反向散射光 |
------------B23K26/046 | ...激光束的自动聚焦 |