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    • 1. 发明申请
    • LASER PROCESSING METHOD AND LASER BEAM IRRADIATION APPARATUS
    • 激光加工方法和激光束辐射装置
    • US20160167166A1
    • 2016-06-16
    • US14436616
    • 2013-10-01
    • SUMITOMO Electric Industries ,Ltd.
    • Shigehiro NAGANOMotoki KAKUIYasuhiro OKAMOTOAkira OKADA
    • B23K26/06B23K26/046
    • B23K26/0648B23K26/046B23K26/0665
    • There is provided a laser processing method using a laser processing apparatus including a laser beam source for outputting a laser beam including a plurality of wavelength components, a collimating lens for receiving the laser beam, and a focusing lens for receiving the laser beam collimated by the collimating lens, the laser processing method including the step of: irradiating a material to be processed with the laser beam focused by the focusing lens in the laser processing apparatus. In the step of irradiating the material to be processed with the laser beam, positions of the collimating lens and the focusing lens are adjusted, and a wavefront shape of the laser beam received by the focusing lens is adjusted, thereby adjusting a size of a focusing area constituted by a plurality of focuses corresponding to the plurality of wavelength components of the laser beam focused by the focusing lens.
    • 提供一种使用激光加工装置的激光加工方法,该激光加工装置包括:激光束源,用于输出包括多个波长成分的激光束;准直透镜,用于接收激光束;以及聚焦透镜,用于接收由所述激光束准直的激光束 准直透镜,该激光加工方法包括以下步骤:在激光加工设备中用聚焦透镜聚焦的激光束照射被处理材料。 在用激光束照射待处理材料的步骤中,调整准直透镜和聚焦透镜的位置,调整由聚焦透镜接收的激光束的波前形状,从而调节聚焦的尺寸 由与由聚焦透镜聚焦的激光束的多个波长分量对应的多个焦点构成的区域。