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41. 发明申请

US20160352215A1 POWER CONVERTER INCORPORATED IN CASE 有权
标题翻译：电源转换器
公开(公告)号：US20160352215A1
公开(公告)日：2016-12-01
申请号：US15163093
申请日：2016-05-24
申请人： Denso Corporation
发明人： Taijirou MOMOSE
IPC分类号： H02M1/36 , H05K5/02 , B60L11/18
CPC分类号： H05K5/0239 , B60L11/18 , H05K1/144 , H05K3/3447 , H05K3/368 , H05K7/1432 , H05K2201/042 , H05K2201/09127 , H05K2201/10318 , H05K2201/10833 , H05K2201/1084
摘要： A power converter includes a case body provided with a device main body part having a power conversion part accommodated therein, a lid member covering an aperture of the case body, a first substrate fixed to the case body, a second substrate fixed to the lid member, the first substrate and the second substrate being fixed therein and a connection member electrically connecting the first substrate and the second substrate.
摘要翻译：电力转换器包括壳体，该壳体设置有容纳有电力转换部分的装置主体部分，覆盖壳体的孔的盖构件，固定到壳体的第一基板，固定到盖构件的第二基板第一基板和第二基板固定在其中，以及连接构件，电连接第一基板和第二基板。

42. 发明授权

US09502797B2 Contact 有权
标题翻译：联系
公开(公告)号：US09502797B2
公开(公告)日：2016-11-22
申请号：US14446497
申请日：2014-07-30
申请人： FUJITSU COMPONENT LIMITED
发明人： Koichi Kiryu , Mitsuru Kobayashi
IPC分类号： H01R12/71 , H01R13/24 , H01R13/62 , H01R12/57 , H05K3/36 , H01R4/64
CPC分类号： H01R12/714 , H01R4/64 , H01R12/57 , H01R12/718 , H01R13/2442 , H01R13/245 , H01R13/62 , H05K3/368 , H05K2201/1031 , Y02P70/611
摘要： A contact that electrically connects a first board and a second board includes a bottom part to be joined to the first board, a first spring that is bent and extends from the bottom part, a second spring configured to be displaced in a first direction toward the bottom part and in a second direction opposite to the first direction by the bending of the first spring, multiple side guides rising from the bottom part, and a stopper provided at an end of each of the side guides in the second direction and configured to come into contact with the second board. The side guides include respective extension parts configured to protect an area in which the second spring is displaced.
摘要翻译：电连接第一板和第二板的触点包括要接合到第一板的底部，第一弹簧，其从底部弯曲并延伸;第二弹簧，其构造成沿着第一方向朝向底部，并且通过第一弹簧的弯曲而与第一方向相反的第二方向，从底部升起的多个侧向引导件和设置在每个侧引导件的端部处于第二方向并且构造成来与第二板接触。侧引导件包括被配置为保护第二弹簧移动的区域的相应的延伸部分。

43. 发明申请

US20160317115A1 DATA TRANSFER ACROSS A ROTATING BOUNDARY 有权
标题翻译：数据传输通过旋转边界
公开(公告)号：US20160317115A1
公开(公告)日：2016-11-03
申请号：US14699488
申请日：2015-04-29
申请人： Analogic Corporation
发明人： Peter Daniel Shippen
IPC分类号： A61B6/00 , A61B6/03 , H05K1/14
CPC分类号： A61B6/56 , A61B6/035 , H05K1/142 , H05K3/368 , H05K2201/041 , H05K2201/09018
摘要： A computed tomography (CT) imaging modality includes a stator and a rotor that rotates relative to the stator. The CT imaging modality includes a radiation source and a detector array for detecting at least some of the radiation. A first data communication component is coupled to the stator or the rotor for transmitting data between the stator and the rotor. The first data communication component includes a first circuit board assembly including a first conductive layer and a first dielectric layer and a second circuit board assembly including a second conductive layer and a second dielectric layer. The second conductive layer of the second circuit board assembly faces the first conductive layer of the first circuit board assembly. An insulating layer is disposed between the first conductive layer of the first circuit board assembly and the second conductive layer of the second circuit board assembly.
摘要翻译：计算机断层摄影（CT）成像模式包括定子和相对于定子旋转的转子。 CT成像模式包括用于检测至少一些辐射的辐射源和检测器阵列。第一数据通信部件耦合到定子或转子，用于在定子和转子之间传输数据。第一数据通信部件包括包括第一导电层和第一介电层的第一电路板组件和包括第二导电层和第二介电层的第二电路板组件。第二电路板组件的第二导电层面对第一电路板组件的第一导电层。绝缘层设置在第一电路板组件的第一导电层和第二电路板组件的第二导电层之间。

44. 发明授权

US09480142B2 Wiring substrate and manufacturing method thereof 有权
标题翻译：接线基板及其制造方法
公开(公告)号：US09480142B2
公开(公告)日：2016-10-25
申请号：US14289401
申请日：2014-05-28
申请人： YAZAKI CORPORATION
发明人： Akira Harao , Mototatsu Matsunaga , Yasuhiro Sugiura , Minoru Kubota
IPC分类号： H01R9/00 , H05K1/02 , H01R12/72 , H05K3/36 , H05K1/11 , H05K3/10 , H01L23/498 , H05K7/10 , H05K1/05 , H05K3/20 , H05K3/34 , H05K1/14
CPC分类号： H05K1/0204 , H01L23/49861 , H01L2224/05571 , H01L2224/48091 , H01L2225/1094 , H01R12/728 , H05K1/0203 , H05K1/05 , H05K1/056 , H05K1/11 , H05K1/14 , H05K3/10 , H05K3/202 , H05K3/3447 , H05K3/368 , H05K7/1046 , H05K2201/09009 , H05K2201/09063 , H05K2201/10757 , H05K2201/10787 , H05K2203/025 , Y10T29/49147 , Y10T29/49155
摘要： Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.
摘要翻译：公开了布线基板及其制造方法，所述布线基板包括具有高导热层的基板，其中所述基板的前表面和后表面中的至少一个是用于各种部件的安装表面; 形成在所述基板中的窗部; 以及从所述窗部的内表面部分延伸并在垂直于所述基板的表面的方向上弯曲的连接端子。

45. 发明授权

US09442539B2 Reduced length memory card 有权
标题翻译：缩短存储卡
公开(公告)号：US09442539B2
公开(公告)日：2016-09-13
申请号：US14245343
申请日：2014-04-04
申请人： PNY Technologies, Inc.
发明人： Robert Stone , Joseph Pluchino
IPC分类号： G06F1/18 , H05K3/36
CPC分类号： G06F1/185 , G06K19/07732 , H05K3/368 , H05K2201/09754 , H05K2201/0999
摘要： A reduced length memory card is provided. The memory card, comprising a memory circuit, a housing for said memory circuit, said housing defining a first end, a second end opposite the first end and insertable into a port of a digital device, and opposing sidewalls between the first end and the second end, and a plurality of electrical contacts in electrical communication with said memory circuit, said contacts exposed through apertures formed in a bottom surface of the housing extending between the first end and the second end, wherein the memory card is electrically compatible with a Secure Digital (SD) standard, and wherein a length of the card extending between the first end and the second end is less than a width of the card extending between the opposing sidewalls. The memory could comprise an extraction ridge along the first end of the card and exposed when the card is inserted into the port of the digital device.
摘要翻译：提供了缩小的存储卡。所述存储卡包括存储器电路，用于所述存储器电路的外壳，所述壳体限定第一端，与所述第一端相对的第二端并可插入数字设备的端口中，以及所述第一端和所述第二端之间的相对的侧壁端部以及与所述存储器电路电连通的多个电触头，所述触点通过形成在壳体的底表面中的孔在第一端和第二端之间暴露，其中存储卡与安全数字（SD）标准，并且其中在第一端和第二端之间延伸的卡的长度小于在相对侧壁之间延伸的卡的宽度。存储器可以包括沿着卡的第一端的提取脊，并且当卡被插入数字设备的端口时被暴露。

46. 发明授权

US09437943B1 Stacked symmetric printed circuit boards 有权
标题翻译：堆叠对称印刷电路板
公开(公告)号：US09437943B1
公开(公告)日：2016-09-06
申请号：US14659469
申请日：2015-03-16
申请人： Pure Storage, Inc.
发明人： John D. Davis
IPC分类号： H01R12/00 , H01R12/52 , H05K3/36 , H05K1/14
CPC分类号： H05K3/368 , H05K1/144 , H05K2201/042 , H05K2201/09063 , H05K2201/10189 , H05K2201/2036
摘要： A printed circuit board (PCB) is provided. The PCB includes a connector extending from a surface of the PCB and a bypass feature extending through the PCB. The PCB is constructed so that a first copy of the PCB is configured to be assembled to a second copy of the PCB with the second copy rotated and/or flipped relative to the first copy. An electrical connection to the first copy is accessible via the connector of the first copy, and an electrical connection to the second copy is accessible via the connector of the second copy through the bypass feature of the first copy.
摘要翻译：提供印刷电路板（PCB）。 PCB包括从PCB的表面延伸的连接器和延伸穿过PCB的旁路特征。 PCB被构造成使得PCB的第一副本被配置为组装到PCB的第二副本，而第二副本相对于第一副本旋转和/或翻转。可以通过第一副本的连接器访问与第一副本的电连接，并且通过第一副本的旁路功能，可以经由第二副本的连接器访问与第二副本的电连接。

47. 发明授权

US09437535B2 Wireless module and production method for wireless module 有权
标题翻译：无线模块的无线模块和生产方法
公开(公告)号：US09437535B2
公开(公告)日：2016-09-06
申请号：US14388349
申请日：2014-01-29
申请人： PANASONIC CORPORATION
发明人： Maki Nakamura , Suguru Fujita
IPC分类号： H01L23/495 , H01L23/498 , H01L23/31 , H01L21/56 , H01L21/48 , H01L23/66 , H05K3/36 , H05K1/14 , H05K1/18 , H05K3/46
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3121 , H01L23/49811 , H01L23/49833 , H01L23/66 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2924/15192 , H01L2924/1533 , H01L2924/18161 , H05K1/144 , H05K1/186 , H05K3/368 , H05K3/4614 , H05K2201/0379 , H05K2201/042 , H05K2201/10098 , H05K2201/10234 , H05K2203/061
摘要： Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.
摘要翻译：提供了可以使其尺寸更小的无线模块。无线模块包括：第一基板，其上安装天线; 第二基板，其与所述第一基板相对并且安装有电子部件; 以及多个电导体，其连接所述第一基板和所述第二基板，并且在所述天线和所述电子部件之间传输信号，其中，所述多个电导体以基本垂直的方式串联设置在所述第一基板和所述第二基板之间相对于第一基板和第二基板的安装表面的方向。

48. 发明授权

US09414493B2 Assembly of printed circuit boards 有权
标题翻译：组装印刷电路板
公开(公告)号：US09414493B2
公开(公告)日：2016-08-09
申请号：US14715943
申请日：2015-05-19
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Andreas C. Doering , Ralph Heller , Ronald P. Luijten , Martin L. Schmatz
IPC分类号： H05K1/11 , H01R12/52 , H01R13/24 , H05K1/14 , H01R12/73 , H01R43/26 , H05K3/36
CPC分类号： H05K1/117 , H01R12/52 , H01R12/73 , H01R13/2414 , H01R43/26 , H05K1/144 , H05K3/368 , H05K2201/0133 , H05K2201/0314 , H05K2201/041 , H05K2201/042 , H05K2201/10159 , H05K2201/10189 , H05K2201/10265 , H05K2201/10954 , Y10T29/49128
摘要： A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.
摘要翻译：印刷电路板（PCB）组件包括基本上平行且彼此相对设置的第一PCB和第二PCB，使得第一PCB的第二面与第二PCB的第一侧相对; 其中所述第二PCB在其第一侧上具有第一组侧连接器，在其第二侧上具有第二组侧连接器，其被配置用于与所述第二PCB的电力供应和信号通信; 第二PCB经由第一弹性体连接器电连接和机械地连接到第一PCB的第二侧; 并且所述第二PCB经由其第二组侧连接器电连接到所述第一PCB，以及电连接到所述第二组侧连接器和所述第一PCB的柔性电连接器。

49. 发明申请

US20160197400A1 CIRCUIT BOARD ASSEMBLY WITH HIGH AND LOW FREQUENCY SUBSTRATES 审中-公开
标题翻译：具有高频和低频基板的电路板组件
公开(公告)号：US20160197400A1
公开(公告)日：2016-07-07
申请号：US14591120
申请日：2015-01-07
申请人： DELPHI TECHNOLOGIES, INC.
发明人： DAVID W. ZIMMERMAN , JAMES F. SEARCY , CHARLES I. DELHEIMER
IPC分类号： H01Q1/50 , H05K1/02
CPC分类号： H01Q1/50 , H01L23/66 , H01L2223/6683 , H01L2224/48472 , H01L2224/49175 , H01L2924/0002 , H01P5/028 , H01Q21/065 , H05K1/02 , H05K1/0243 , H05K1/141 , H05K1/184 , H05K3/368 , H05K2201/041 , H05K2201/10007 , H05K2201/10098 , H05K2203/049
摘要： A circuit board assembly includes a low-frequency (LF) substrate, a monolithic microwave integrated circuit (MMIC), electrical components, a high-frequency (HF) substrate, and an antenna. The LF substrate is formed of FR-4 type material. The LF substrate defines a waveguide through the LF substrate. The MMIC is attached to the top-side of the LF substrate and outputs the radio-frequency signal. The electrical components are electrically attached to the LF substrate. The HF substrate is soldered to the top side of the LF substrate. An opening through the HF substrate surrounds the MMIC. A vertical transition guides the radio-frequency signal output by the MMIC to the waveguide. A plurality of wire bonds electrically connects the MMIC to the HF substrate and couple the radio-frequency signal from the MMIC to the vertical transition. The antenna is attached to the LF substrate and configured to radiate the radio-frequency signal from the waveguide.
摘要翻译：电路板组件包括低频（LF）衬底，单片微波集成电路（MMIC），电气部件，高频（HF）衬底和天线。 LF基板由FR-4型材料形成。 LF衬底限定通过LF衬底的波导。 MMIC连接到LF基板的顶侧，并输出射频信号。电气部件电连接到LF基板。将HF衬底焊接到LF衬底的顶侧。通过HF衬底的开口围绕MMIC。垂直转换将MMIC输出的射频信号引导到波导。多个引线键合将MMIC电连接到HF衬底，并将来自MMIC的射频信号耦合到垂直转换。天线连接到LF衬底并且被配置为辐射来自波导的射频信号。

50. 发明授权

US09383733B1 Dynamic position control for electronic components 有权
标题翻译：电子元件的动态位置控制
公开(公告)号：US09383733B1
公开(公告)日：2016-07-05
申请号：US14974051
申请日：2015-12-18
申请人： International Business Machines Corporation
发明人： Tyler Jandt , Phillip V. Mann , Mark D. Plucinski , Sandra J. Shirk/Heath
IPC分类号： H02P6/16 , G05B11/01 , G05B1/04
CPC分类号： G05B19/402 , G05B1/04 , G05B11/011 , G05B19/042 , G05B2219/35581 , G05B2219/40543 , G06F1/185 , H05K1/144 , H05K3/32 , H05K3/368 , H05K2201/0329 , H05K2201/042
摘要： A computer system may determine a target position of the electronic component. The computer system may also determine a current position of the electronic component. The computer system may compare the current position to the target to position to determine whether the electronic component is in the target position. If the electronic component is not in the target position, the computer system may use an electroactive polymer to adjust the position of the electronic component to move the electronic component into the target position.
摘要翻译：计算机系统可以确定电子部件的目标位置。计算机系统还可以确定电子部件的当前位置。计算机系统可以将当前位置与目标位置进行比较以确定电子部件是否处于目标位置。如果电子部件不在目标位置，则计算机系统可以使用电活性聚合物来调节电子部件的位置以将电子部件移动到目标位置。

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