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41. 发明授权

US07882625B2 Transfer mask in micro ball mounter 有权
标题翻译：转移面罩在微球安装器
公开(公告)号：US07882625B2
公开(公告)日：2011-02-08
申请号：US12033128
申请日：2008-02-19
申请人： Kengo Aoya
发明人： Kengo Aoya
IPC分类号： H05K3/30
CPC分类号： H05K3/3478 , H01L21/4853 , H01L24/16 , H01L24/48 , H01L24/97 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/15311 , H01L2924/181 , H05K2203/041 , H05K2203/0557 , Y10T29/41 , Y10T29/49126 , Y10T29/4913 , Y10T29/5313 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The objective of this invention is to provide a transfer mask that is able to accurately pass micro-balls onto terminal areas on a substrate. A thin plate transfer mask 200 is arranged facing a substrate 100, and possesses a plurality of through-holes 242 for the purpose of passing micro-balls (solder balls) onto a plurality of terminal areas 108 formed on one surface of a substrate 100. Slits 230, 232, 234, 236 formed in the surface of the transfer mask 200 extending in the length direction and the width direction of the transfer mask 200, inside the substrate edge P1 and outside the area in which the plurality of through-holes 242 is formed when it is facing the substrate 100.
摘要翻译：本发明的目的是提供一种能够将微球精确地传递到基底上的终端区域的转印掩模。薄板转印掩模200面向衬底100布置，并且具有多个通孔242，用于将微球（焊球）传递到形成在衬底100的一个表面上的多个端子区域108上。在转印掩模200的表面上形成的狭缝230,232,234,236，其在基板边缘P1的内部和在多个通孔242的区域的外部沿着传送掩模200的长度方向和宽度方向延伸当其面向基板100时形成。

42. 发明申请

US20110008979A1 SOCKET CONNECTOR WITH CONTACT TERMINAL HAVING WAVEFORM ARRANGEMENT ADJACENT TO TAIL PORTION PERFECTING SOLDER JOINT 有权
标题翻译：带接头端子的插座连接器，具有波纹管接头，配有尾部，完美的焊接接头
公开(公告)号：US20110008979A1
公开(公告)日：2011-01-13
申请号：US12853317
申请日：2010-08-10
申请人： CHENG-CHI YEH , NAN-HUNG LIN , ANDREW CHENG , TING-YAO HUNG
发明人： CHENG-CHI YEH , NAN-HUNG LIN , ANDREW CHENG , TING-YAO HUNG
IPC分类号： H01R13/02
CPC分类号： H01R12/57 , H01R12/716 , H01R13/2442 , H01R43/0256 , H05K3/3426 , H05K7/1069 , H05K2201/10325 , H05K2201/10984 , H05K2203/041 , Y02P70/613
摘要： Disclosed herewith a socket connector configured with an insulative housing defining a mating interface surrounded with peripheral walls and a mounting surface. A plurality of passageways is defined between the mating interface and the mounting surface and having an opening at the mounting surface. The insulative housing includes an encampment associated with each of the passageway at the mounting surface, and includes an extension crossing over an inner wall of the passageway to substantially narrow the opening of the opening. The socket connector furthers includes a plurality of contact terminals each received in the passageway and further includes a curvilinear solder portion extending beyond the mounting surface. And the socket connector further is incorporated with a plurality of solder balls each disposed between the encampment and the curvilinear solder portion.
摘要翻译：这里公开了一种插座连接器，其配置有绝缘壳体，该绝缘壳体限定由周壁围绕的配合接口和安装表面。多个通道被限定在配合接口和安装表面之间并且在安装表面上具有开口。绝缘壳体包括与安装表面上的每个通道相关联的营地，并且包括跨过通道的内壁的延伸部，以使开口的开口基本上变窄。插座连接器还包括多个接触端子，每个接触端子都容纳在通道中，并且还包括延伸超过安装表面的曲线焊接部分。并且插座连接器还与各自设置在营地和曲线焊料部分之间的多个焊球结合。

43. 发明申请

US20100327465A1 PACKAGE PROCESS AND PACKAGE STRUCTURE 审中-公开
标题翻译：包装流程和包装结构
公开(公告)号：US20100327465A1
公开(公告)日：2010-12-30
申请号：US12538338
申请日：2009-08-10
申请人： CHI-CHIH SHEN , Jen-Chuan Chen , Tommy Pan
发明人： CHI-CHIH SHEN , Jen-Chuan Chen , Tommy Pan
IPC分类号： H01L23/31 , H01L21/60
CPC分类号： H01L21/563 , H01L21/6835 , H01L23/147 , H01L23/3128 , H01L23/3135 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/16 , H01L24/48 , H01L24/81 , H01L24/97 , H01L2221/68345 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/73203 , H01L2224/75252 , H01L2224/81005 , H01L2224/83005 , H01L2224/83192 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/014 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H01L2924/18161 , H01L2924/30105 , H05K3/007 , H05K3/284 , H05K3/3436 , H05K3/3478 , H05K2201/10674 , H05K2203/041 , H05K2203/1316 , Y02P70/613 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package process is provided. First, a semiconductor substrate is disposed on a carrier, in which a surface of the carrier has an adhesive layer and the semiconductor substrate is bonded to the carrier by the adhesive layer. Next, a chip is bonded on the semiconductor substrate by flip chip technique and a first underfill is formed between the chip and the semiconductor substrate to encapsulate a plurality of first conductive bumps at the bottom of the chip. Then, a first molding compound is formed on the semiconductor substrate. The first molding compound at least encapsulates the side surface of the chip and the first underfill. Finally, the semiconductor substrate together with the chip and the first molding compound located thereon are separated from the adhesive layer of the carrier to form an array package structure.
摘要翻译：提供包装过程。首先，将半导体基板设置在载体上，其中载体的表面具有粘合剂层，并且半导体衬底通过粘合剂层结合到载体上。接下来，通过倒装芯片技术将芯片接合在半导体衬底上，并且在芯片和半导体衬底之间形成第一底部填充物，以在芯片的底部封装多个第一导电凸块。然后，在半导体基板上形成第一模塑料。第一模塑料至少封装芯片的侧表面和第一底部填充物。最后，与芯片和位于其上的第一模塑料一起的半导体衬底与载体的粘合剂层分离以形成阵列封装结构。

44. 发明授权

US07845547B2 Method for manufacturing a printed wiring board 有权
标题翻译：印刷电路板的制造方法
公开(公告)号：US07845547B2
公开(公告)日：2010-12-07
申请号：US12120046
申请日：2008-05-13
申请人： Katsuhiko Tanno
发明人： Katsuhiko Tanno
IPC分类号： B23K31/02
CPC分类号： B23K31/02 , H01L21/4853 , H01L23/49838 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K3/3452 , H05K3/3478 , H05K3/3484 , H05K3/4602 , H05K2201/094 , H05K2201/099 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/1476 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for manufacturing a printed wiring board having a bump. The method includes forming a solder-resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective conductive pad of the printed wiring board, and printing a solder paste in the large-diameter aperture in the solder-resist layer, but not printing the solder paste in the small-diameter aperture in the solder resist layer. The method also includes loading a solder ball in each of the large-diameter aperture and the small-diameter aperture using a mask having aperture areas that correspond to the small-diameter aperture and large-diameter aperture of the solder-resist layer, and forming a small-diameter bump from the solder ball in the small-diameter aperture and a large-diameter bump from both the solder paste and the solder ball in the large-diameter aperture.
摘要翻译：一种具有凸块的印刷线路板的制造方法。该方法包括形成具有小直径孔径和大直径孔径的阻焊层，每个孔暴露印刷线路板的相应导电焊盘，以及在焊料焊盘的大直径孔中印刷焊膏，抗蚀剂层，但不将焊膏印刷在阻焊层的小直径孔中。该方法还包括使用具有对应于阻焊层的小直径孔径和大直径孔径的孔径区域的掩模将焊球加载到大直径孔径和小直径孔径中的每一个中，并形成来自小直径孔中的焊球的小直径凸起和大直径孔中的焊膏和焊球的大直径凸块。

45. 发明申请

US20100304625A1 SOLDER ATTACHED CONTACT AND A METHOD OF MANUFACTURING THE SAME 失效
标题翻译：焊接接头及其制造方法
公开(公告)号：US20100304625A1
公开(公告)日：2010-12-02
申请号：US12446432
申请日：2007-10-30
申请人： Yuji Nakamura
发明人： Yuji Nakamura
IPC分类号： H01R4/02 , B23K31/02 , B23K1/20
CPC分类号： G01R1/07342 , G01R1/06727 , G01R3/00 , H05K3/3426 , H05K2201/1031 , H05K2201/1084 , H05K2201/10984 , H05K2203/0278 , H05K2203/041 , Y02P70/611 , Y02P70/613
摘要： There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.
摘要翻译：提供了制备由包括基部（11,21），弹性变形部（12,22）和接触部（13,23）的金属板形成的触点（10,20）的步骤），并且其中在所述基部的底表面上形成有凹部（15,25），并且多个通孔（16,26,27）形成为布置在所述凹部上方并且平行于所述底部基部的表面延伸穿过基部，并且将焊料保持在形成在触点上的通孔上。通过该制造方法制造所需的焊料附着接触件（10a，20a）。此外，焊料是焊球（90），保持焊料的步骤包括制备焊球的步骤和将焊球压入通孔的步骤。

46. 发明授权

US07810705B2 Apparatus and method for supplying electrically conductive material 有权
标题翻译：用于提供导电材料的设备和方法
公开(公告)号：US07810705B2
公开(公告)日：2010-10-12
申请号：US11854222
申请日：2007-09-12
申请人： Toru Mizuno , Kazuaki Takanuki , Tatsuya Wagou
发明人： Toru Mizuno , Kazuaki Takanuki , Tatsuya Wagou
IPC分类号： B23K35/12
CPC分类号： B23K3/0623 , B23K2101/38 , H05K3/3478 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/086
摘要： In a conductive material supply apparatus that can connect a small slider electrode and a wiring electrode on a flexure in a miniaturized magnetic head, electrically conductive material is supplied, with the aid of flow of nitrogen gas that is pressurized to a first pressure, into the interior of a nozzle assembly that defines an interior space having a nozzle orifice through which the electrically conductive material can pass. After the electrically conductive material has been supplied, the flow of the nitrogen gas is stopped, and the interior space is temporarily brought into communication with the exterior space thereby decreasing the pressure in the interior space. Thereafter, nitrogen gas maintained at a second pressure that is designed to be lower than the first pressure is supplied to the interior space, whereby the electrically conductive material is ejected to the exterior from the nozzle orifice by the effect of the second pressure.
摘要翻译：在小型磁头中的弯曲部上可以连接小滑块电极和布线电极的导电材料供给装置中，借助于加压到第一压力的氮气流，供给导电材料，喷嘴组件的内部限定具有喷嘴孔的内部空间，导电材料可以通过该喷嘴孔通过。在提供导电材料之后，停止氮气的流动，并且内部空间暂时与外部空间连通，从而减小内部空间中的压力。此后，保持在设计为低于第一压力的第二压力的氮气被供应到内部空间，由此导电材料通过第二压力从喷嘴孔喷射到外部。

47. 发明授权

US07798389B2 Flux for soldering, soldering method, and printed circuit board 有权
标题翻译：焊接助焊剂，焊接方法和印刷电路板
公开(公告)号：US07798389B2
公开(公告)日：2010-09-21
申请号：US11727014
申请日：2007-03-23
申请人： Kazuki Ikeda , Hisao Irie , Toshinori Shima , Takaaki Anada , Syunsuke Ishikawa
发明人： Kazuki Ikeda , Hisao Irie , Toshinori Shima , Takaaki Anada , Syunsuke Ishikawa
IPC分类号： B23K31/02 , B23K35/36
CPC分类号： B23K35/0244 , B23K1/203 , B23K35/007 , B23K35/0222 , B23K35/025 , B23K35/34 , B23K35/36 , B23K35/3613 , B23K35/3618 , B23K35/362 , B23K2101/42 , H05K3/244 , H05K3/3478 , H05K3/3484 , H05K3/3489 , H05K2203/041
摘要： A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.
摘要翻译：在进行无电解镀镍的板进行焊接时使用的焊剂用焊剂，具有成膜能力的助熔剂树脂，活化剂和溶剂，还含有金属盐的总量的0.1〜20重量％助焊剂量。使用这种助焊剂抑制镍焊料在焊接部分的扩散，并防止磷的浓度，从而提高焊接的接合强度。

48. 发明申请

US20100230469A1 CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD 有权
标题翻译：导电球安装装置和导电球安装方法
公开(公告)号：US20100230469A1
公开(公告)日：2010-09-16
申请号：US12720084
申请日：2010-03-09
申请人： Kiyoaki IIDA , Kazuo TANAKA , Norio KONDO , Hideaki SAKAGUCHI , Mitsutoshi HIGASHI
发明人： Kiyoaki IIDA , Kazuo TANAKA , Norio KONDO , Hideaki SAKAGUCHI , Mitsutoshi HIGASHI
IPC分类号： B23K31/02 , B23K3/06
CPC分类号： H05K3/3478 , B23K3/0623 , B23K35/02 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H05K2203/0292 , H05K2203/041 , H05K2203/0485 , H05K2203/0557 , H05K2203/105 , H05K2203/1344 , H05K2203/1581 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.
摘要翻译：在用于将一个导电球安装在设置在基板上并且在其上形成有粘合剂的多个焊盘中的导电球安装装置中的导电球安装装置中，导电球安装装置包括：导电球容器，用于容纳多个导电球并具有通过所述多个导电球的开口; 衬底保持器，设置在导电性球容器上面对开口，并且以使得多个导电球和多个焊盘彼此面对的方式保持衬底，并且衬底设置在导电性球容器上方，其间具有空间 ; 以及导电球供给单元，其用于通过使所述多个导电球向上移动而经由所述开口将多个导电球供给到所述多个焊盘。

49. 发明授权

US07732900B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07732900B2
公开(公告)日：2010-06-08
申请号：US11236815
申请日：2005-09-28
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H01L23/495
CPC分类号： H05K1/112 , G11B5/4833 , H01L2224/11003 , H01L2224/742 , H05K1/056 , H05K3/06 , H05K3/244 , H05K3/28 , H05K3/363 , H05K3/44 , H05K2201/0394 , H05K2201/09063 , H05K2201/0969 , H05K2201/10666 , H05K2203/0323 , H05K2203/041 , H05K2203/0455 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204
摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.
摘要翻译：一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，从而导线4a，4b，4c，4d，磁头连接端子7和外部连接端子8一体形成，并且在外部连接端子8中也形成有第一通孔9.然后，在形成绝缘覆盖层10之后，在支撑板2上形成第三通孔20和第二通孔19，绝缘基底层3分别与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时可以进行连接，同时确认焊球的位置 21从相应的通孔。

50. 发明申请

US20100051673A1 METHOD AND DEVICE FOR TRANSFERRING A SOLDER DEPOSIT CONFIGURATION 有权
标题翻译：用于传送焊接沉积物配置的方法和装置
公开(公告)号：US20100051673A1
公开(公告)日：2010-03-04
申请号：US12566098
申请日：2009-09-24
申请人： Elke Zakel , Ghassem Azdasht
发明人： Elke Zakel , Ghassem Azdasht
IPC分类号： B23K1/20
CPC分类号： B23K3/0623 , H05K3/3478 , H05K2201/10734 , H05K2203/0338 , H05K2203/041 , H05K2203/082
摘要： Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum impingement (27) by the isolation unit (12).
摘要翻译：用于将具有多个焊料沉积物的焊料沉积物配置转移到衬底（36）的接触表面的端子表面构造上的方法和装置，其使用从容纳在焊料沉积容器单元中的焊料沉积物储存器（25）去除多个焊料沉积物（11），其被实现为模板并且位于焊料沉积物储存器上方，以实现对应于端子表面构造实施的焊料沉积配置，并且使用随后的焊料沉积配置的转移在衬底的端子表面结构上，焊料沉积储存器通过隔离单元的模板开口（15）通过部分真空冲击，以将焊料沉积物从焊料沉积储存器转移到隔离单元中，焊料沉积储存器（25）通过位于与隔离单元直径相对的地板壁（20）通风通过隔离单元（12）引起部分真空冲击（27）。

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