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41. 发明申请

US20090145631A1 RECONFIGURABLE SYSTEM THAT EXCHANGES SUBSTRATES USING COULOMB FORCES TO OPTIMIZE A PARAMETER 失效
标题翻译：可重构的系统，使用COULOMB FORCES优化参数来交换基板
公开(公告)号：US20090145631A1
公开(公告)日：2009-06-11
申请号：US11952995
申请日：2007-12-07
申请人： Thaddeus Gabara
发明人： Thaddeus Gabara
IPC分类号： H05K1/02
CPC分类号： H05K3/303 , B01L3/5027 , B01L3/502707 , B01L3/502715 , B01L9/527 , B01L2200/028 , B01L2200/04 , B01L2200/0647 , B01L2200/10 , B01L2300/0816 , B81B7/02 , B81C3/008 , H01L23/48 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/94 , H01L24/95 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2223/6677 , H01L2224/13025 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/95145 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15311 , H01L2924/16195 , H01L2924/19041 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01Q9/0407 , H01Q9/14 , H01Q9/16 , H05K3/225 , H05K2201/09781 , H05K2201/09963 , H05K2203/105 , H05K2203/166 , Y02P70/613 , Y10T279/23 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A reconfigurable system is described that can optimize the performance of the system. Substrates can be detached, levitated, moved, dropped and reattached as desired by the use of Coulomb forces generate between Coulomb islands. Thus, a system using a first set of substrates for a given frequency range can be exchanged with a second set of substrates operable at a different frequency range by the use of Coulomb forces. Making this exchange in an RF system can improve the selectivity and decrease the power dissipation of the system. One of the exchanges can involve inductor to shift the frequency of oscillation, for example. A control unit can be used to control the movement and replacement of all substrates. The formation of minimal energy potentials of Coulomb forces are determined to move a substrate over an underlying substrate.
摘要翻译：描述了可以优化系统性能的可重构系统。根据库仑力在库仑群岛之间产生的库仑力，底物可根据需要分离，悬浮，移动，掉落并重新附着。因此，对于给定的频率范围，使用第一组基板的系统可以与通过使用库仑力在不同频率范围内操作的第二组基板交换。在RF系统中进行这种交换可以提高系统的选择性并降低功耗。例如，其中一个交换机可以涉及电感器来移动振荡频率。控制单元可用于控制所有基板的移动和更换。确定库仑力的最小能量势的形成以使衬底移动到下面的衬底上。

42. 发明申请

US20090116235A1 SEMICONDUCTOR SOLID-STATE LIGHT-SOURCE MODULE AND ASSEMBLY HAVING THE SAME 失效
标题翻译：半导体固态光源模块及其组装
公开(公告)号：US20090116235A1
公开(公告)日：2009-05-07
申请号：US12202557
申请日：2008-09-02
申请人： CHIH-CHUNG TSAO , CHIH-PENG HSU , WEN-JANG JIANG , CHUN-WEI WANG , CHIH-MING LAI , HUNG-KUANG HSU
发明人： CHIH-CHUNG TSAO , CHIH-PENG HSU , WEN-JANG JIANG , CHUN-WEI WANG , CHIH-MING LAI , HUNG-KUANG HSU
IPC分类号： H01S5/06 , F21S13/14 , F21V1/00 , H01S5/00
CPC分类号： F21S2/005 , F21V19/001 , F21V19/045 , F21V23/06 , F21Y2115/10 , G02B6/0068 , G02B6/0073 , H05K1/14 , H05K2201/048 , H05K2201/09963 , H05K2201/10106
摘要： An exemplary semiconductor solid-state light-source module includes a printed circuit board, at least one semiconductor solid state light source mounted on the printed circuit board and a light guide plate optically coupled to the semiconductor solid state light source. The printed circuit board includes a protrusion and a recess. The protrusion is configured for engaging with a recess of the printed circuit board of another similar semiconductor solid-state light-source module.
摘要翻译：示例性的半导体固态光源模块包括印刷电路板，安装在印刷电路板上的至少一个半导体固态光源和与半导体固态光源光学耦合的导光板。印刷电路板包括突起和凹部。该突出部构造成用于与另一个类似的半导体固态光源模块的印刷电路板的凹部接合。

43. 发明授权

US07425684B2 Universal systems printed circuit board for interconnections 失效
标题翻译：通用系统用于互连的印刷电路板
公开(公告)号：US07425684B2
公开(公告)日：2008-09-16
申请号：US12075336
申请日：2008-01-30
申请人： Sang Henry Ta
发明人： Sang Henry Ta
IPC分类号： H05K1/00
CPC分类号： H05K1/142 , H05K1/0287 , H05K1/029 , H05K3/42 , H05K2201/09627 , H05K2201/09963 , H05K2201/10363 , H05K2203/173
摘要： In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This invention aims at reducing the implementation of electronic systems down to just three steps namely, systems design, printed-circuit-board planar assembly, and systems test when-as a plurality of Universal Systems Printed-Circuit Blocks of pre-defined sizes is used. Each of said Universal Systems Printed-Circuit Blocks being usable and reusable for prototypes and production is built from a printed circuit board having thereon a functional circuit and a variety of circuit patterns and interconnection structures such that, any of said blocks, when joined together with other blocks on the same plane by standard connectors or electrically conductive compounds to form a systems board, can send and receive signals and voltages to and from any other blocks.
摘要翻译：在电子学中，存在三个独特的领域，即分立元件或器件，电路和系统。电路由设备构成，系统由电路构成。本发明旨在将电子系统的实现降低到三个步骤，即系统设计，印刷电路板平面组装和系统测试 - 当使用预定义尺寸的多个通用系统印刷电路块。每个所述通用系统印刷电路块可用于和可重复使用的原型和生产由其上具有功能电路和各种电路图案和互连结构的印刷电路板构成，使得任何所述块当与通过标准连接器或导电化合物形成系统板的同一平面上的其他块可以向任何其他块发送和接收信号和电压。

44. 发明申请

US20080173474A1 UNIVERSAL SYSTEMS PRINTED CIRCUIT BOARD FOR INTERCONNECTIONS 失效
标题翻译：通用系统印刷电路板互连
公开(公告)号：US20080173474A1
公开(公告)日：2008-07-24
申请号：US12075336
申请日：2008-01-30
申请人： Sang Henry Ta
发明人： Sang Henry Ta
IPC分类号： H05K1/11
CPC分类号： H05K1/142 , H05K1/0287 , H05K1/029 , H05K3/42 , H05K2201/09627 , H05K2201/09963 , H05K2201/10363 , H05K2203/173
摘要： In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This invention aims at reducing the implementation of electronic systems down to just three steps namely, systems design, printed-circuit-board planar assembly, and systems test when-as a plurality of Universal Systems Printed-Circuit Blocks of pre-defined sizes is used. Each of said Universal Systems Printed-Circuit Blocks being usable and reusable for prototypes and production is built from a printed circuit board having thereon a functional circuit and a variety of circuit patterns and interconnection structures such that, any of said blocks, when joined together with other blocks on the same plane by standard connectors or electrically conductive compounds to form a systems board, can send and receive signals and voltages to and from any other blocks.
摘要翻译：在电子学中，存在三个独特的领域，即分立元件或器件，电路和系统。电路由设备构成，系统由电路构成。本发明旨在将电子系统的实现降低到三个步骤，即系统设计，印刷电路板平面组装和系统测试 - 当使用预定义尺寸的多个通用系统印刷电路块。每个所述通用系统印刷电路块可用于和可重复使用的原型和生产由其上具有功能电路和各种电路图案和互连结构的印刷电路板构成，使得任何所述块当与通过标准连接器或导电化合物形成系统板的同一平面上的其他块可以向任何其他块发送和接收信号和电压。

45. 发明申请

US20080087903A1 Method for producing a light emitting diode arrangement, and light emitting diode arrangement 有权
标题翻译：用于制造发光二极管装置的方法和发光二极管装置
公开(公告)号：US20080087903A1
公开(公告)日：2008-04-17
申请号：US11904170
申请日：2007-09-26
申请人： Harald Stoyan
发明人： Harald Stoyan
IPC分类号： H01L29/18 , H01L21/02
CPC分类号： H05K1/141 , F21S2/005 , F21V21/005 , F21V23/06 , F21Y2115/10 , H05K1/142 , H05K1/147 , H05K1/148 , H05K3/3442 , H05K3/363 , H05K2201/046 , H05K2201/09963 , H05K2201/10106
摘要： A method for producing a light emitting diode arrangement. A plurality of LED modules (110, 120, 130) are provided, which in each case comprise at least one radiation emitting semiconductor component (1000) on a carrier body (1300). At least one separately fabricated connection carrier (200) is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.
摘要翻译：一种制造发光二极管装置的方法。提供了多个LED模块（110,120,130），其在每种情况下都包括在载体主体（1300）上的至少一个辐射发射半导体部件（1000）。提供至少一个单独制造的连接支架（200）。 LED模块以彼此成对相邻的方式布置。通过连接载体产生两个LED模块的载体之间的机械稳定且导电的连接。此外，公开了一种发光二极管装置。

46. 发明申请

US20070262434A1 INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS 审中-公开
标题翻译：互连IC封装与垂直SMT贴片
公开(公告)号：US20070262434A1
公开(公告)日：2007-11-15
申请号：US11782102
申请日：2007-07-24
申请人： Chin-Tien Chiu , Cheemen Yu , Hem Takiar , Jack Chien , Meng-Ju Tsai
发明人： Chin-Tien Chiu , Cheemen Yu , Hem Takiar , Jack Chien , Meng-Ju Tsai
IPC分类号： H01L23/02
CPC分类号： H01L23/49805 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/06562 , H01L2225/1005 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H05K1/142 , H05K3/0052 , H05K3/3442 , H05K3/403 , H05K2201/09963 , H05K2201/1053 , H05K2201/10727 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The panel includes a plurality of through-holes drilled through the panel and subsequently filled with metal such as copper or gold. These filled through-holes lie along the cut line between adjacent packages so that, upon singulation, the filled through holes are cut and a portion of the filled through-holes are exposed at the side edges of the singulated packages. These exposed portions of the filled through-holes form vertical surface mount technology (SMT) pads. After the semiconductor packages are singulated and the SMT pads are defined in the side edges, SMT is used to solder the SMT pads of a first semiconductor package to the respective SMT pads of a second semiconductor package to structurally and electrically couple the two packages together side-by-side.
摘要翻译：公开了一种电子部件，其包括以并排配置焊接在一起的多个半导体封装。包装在基板上进行批量处理。面板包括穿过面板钻出的多个通孔，随后填充有诸如铜或金的金属。这些填充的通孔沿着相邻封装之间的切割线位于相邻封装之间的切割线处，使得在分离时，填充的通孔被切割并且一部分填充的通孔在单个封装的侧边缘处露出。填充的通孔的这些暴露部分形成垂直表面贴装技术（SMT）焊盘。在半导体封装被单个化并且SMT焊盘限定在侧边缘中之后，使用SMT来将第一半导体封装的SMT焊盘焊接到第二半导体封装的相应SMT焊盘，以将两个封装结合和电耦合在一起旁边。

47. 发明授权

US07215540B2 Memory module 失效
标题翻译：内存模块
公开(公告)号：US07215540B2
公开(公告)日：2007-05-08
申请号：US11008901
申请日：2004-12-10
申请人： Shih-Hsiung Lien
发明人： Shih-Hsiung Lien
IPC分类号： G06F1/16 , H05K5/00 , H05K7/00 , H05K1/14 , H01R12/16
CPC分类号： H05K1/142 , H05K2201/09172 , H05K2201/09181 , H05K2201/09963 , H05K2201/10159 , H05K2201/209
摘要： A memory module includes a plurality of memory units, an assembling holder and an engaging arrangement. The assembling holder includes an elongated unit housing having at least an elongated receiving slot extended therealong. The engaging arrangement includes a first assembling joint provided at a side edge portion of one of the memory substrates, and a second assembling joint provided at a corresponding side edge portion of an adjacent memory substrate, wherein the first assembling joint is fittedly and detachably engaged with the second assembling joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner to inset into the receiving slot of the elongated unit housing.
摘要翻译：存储器模块包括多个存储器单元，组装保持器和接合装置。组装保持器包括细长单元壳体，其具有沿其延伸的至少一个细长的接收槽。接合装置包括设置在其中一个存储器基板的侧边缘部分处的第一组装接头和设置在相邻存储器基板的相应侧边缘部分处的第二组装接头，其中第一组装接头可以与相邻存储器单元的第二组装接头，以边缘到边缘方式彼此对准地将存储单元彼此对准地插入到细长单元壳体的接收槽中。

48. 发明申请

US20050146856A1 Memory module 失效
标题翻译：内存模块
公开(公告)号：US20050146856A1
公开(公告)日：2005-07-07
申请号：US11008901
申请日：2004-12-10
申请人： Shih-Hsiung Lien
发明人： Shih-Hsiung Lien
IPC分类号： H05K1/14 , H05K5/00
CPC分类号： H05K1/142 , H05K2201/09172 , H05K2201/09181 , H05K2201/09963 , H05K2201/10159 , H05K2201/209
摘要： A memory module includes a plurality of memory units, an assembling holder and an engaging arrangement. The assembling holder includes an elongated unit housing having at least an elongated receiving slot extended therealong. The engaging arrangement includes a first assembling joint provided at a side edge portion of one of the memory substrates, and a second assembling joint provided at a corresponding side edge portion of an adjacent memory substrate, wherein the first assembling joint is fittedly and detachably engaged with the second assembling joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner to inset into the receiving slot of the elongated unit housing.
摘要翻译：存储器模块包括多个存储器单元，组装保持器和接合装置。组装保持器包括细长单元壳体，其具有沿其延伸的至少一个细长的接收槽。接合装置包括设置在其中一个存储器基板的侧边缘部分处的第一组装接头和设置在相邻存储器基板的相应侧边缘部分处的第二组装接头，其中第一组装接头可以与相邻存储器单元的第二组装接头，以边缘到边缘方式彼此对准地将存储单元彼此对准地插入到细长单元壳体的接收槽中。

49. 发明授权

US5745339A Packing element including a foam plastic body and a device relating to this packing element 失效
标题翻译：包装材料包括泡沫塑料体和与该包装元件有关的装置
公开(公告)号：US5745339A
公开(公告)日：1998-04-28
申请号：US833460
申请日：1997-04-07
申请人： Gundokar Braumann , Ralf H. F. Seitz
发明人： Gundokar Braumann , Ralf H. F. Seitz
IPC分类号： G06F1/16 , G06F1/18 , H05K1/00 , H05K1/14 , H05K1/18 , H05K3/32 , H05K3/40 , H05K7/14 , H05K9/00 , H05K5/02 , H05K7/02
CPC分类号： H05K9/0067 , G06F1/16 , G06F1/183 , H05K1/0284 , H05K3/325 , H05K7/1422 , H05K1/0286 , H05K1/144 , H05K1/182 , H05K1/183 , H05K2201/09118 , H05K2201/09963 , H05K3/403
摘要： The invention relates to a packing element, which can be used for packing and arranging one or more electric components of an appliance, depending on the case together with the same or similar packing elements; the packing element (1,3,4) has at least one current-conducting or light-conducting conducting track (10,11,12,17,18,43,44). Moreover, the invention relates to a device such as a Personal Computer in which this packing element is used.
摘要翻译：本发明涉及一种包装元件，其可以用于根据具体情况与相同或相似的包装元件一起用于包装和布置器具的一个或多个电气部件; 填料元件（1,3,4）具有至少一个导电或导光导电轨道（10,11,12,17,18,43,44）。此外，本发明涉及使用该包装单元的个人计算机等装置。

50. 发明授权

US3426426A Sliced circuitry 失效
标题翻译：简单电路
公开(公告)号：US3426426A
公开(公告)日：1969-02-11
申请号：US3426426D
申请日：1967-02-27
申请人： DAVID E BORN
发明人： BORN DAVID E
IPC分类号： H05K3/00 , H05K3/10 , H01B13/00 , H05K13/00
CPC分类号： H05K3/10 , H05K3/00 , H05K2201/09963 , H05K2203/0235 , Y10T29/49126 , Y10T29/49798 , Y10T29/4981

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