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41. 发明申请

US20080289862A1 Electronic component package 有权
标题翻译：电子元件包装
公开(公告)号：US20080289862A1
公开(公告)日：2008-11-27
申请号：US12222115
申请日：2008-08-01
申请人： Takatoshi Yagisawa , Tadashi Ikeuchi
发明人： Takatoshi Yagisawa , Tadashi Ikeuchi
IPC分类号： H05K1/00
CPC分类号： H01L23/4985 , G02B6/4201 , H01L23/057 , H01L23/66 , H01L2223/6627 , H01L2224/16 , H01L2224/32188 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/1903 , H01L2924/3011 , H05K1/0243 , H05K1/189 , H01L2224/0401
摘要： An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part, and the electronic component is connected to a signal wiring conductor formed at the film board.
摘要翻译：电子部件封装包括安装电子部件的薄膜基板和安装在薄膜基板上以覆盖薄膜基板的表面的盖部。电子部件设置在由薄膜基板和盖部形成的空腔中，电子部件与形成在薄膜基板上的信号布线导体连接。

42. 发明授权

US07432775B2 High speed electronics interconnect having a dielectric system with cylindrical holes therein 有权
标题翻译：具有在其中具有圆柱形孔的电介质系统的高速电子连接器
公开(公告)号：US07432775B2
公开(公告)日：2008-10-07
申请号：US10793362
申请日：2004-03-04
申请人： Achyut Dutta
发明人： Achyut Dutta
IPC分类号： H01P3/08
CPC分类号： H01L23/66 , H01L23/5383 , H01L25/0655 , H01L2223/6627 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/09701 , H01L2924/12044 , H01L2924/13091 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/3011 , H01P1/2005 , H01P3/08 , H05K1/0224 , H05K1/0236 , H05K1/024 , H05K1/0253 , H05K1/0298 , H05K1/0306 , H05K1/0313 , H05K2201/0187 , H05K2201/0191 , H05K2201/0715 , H05K2201/09036 , H05K2201/09063 , H05K2201/09681 , Y02P80/30 , H01L2924/00 , H01L2224/05599
摘要： Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of the signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single ended or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects (chip-to-chip interconnects). The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. More over, this fundamental technology is also used for the high sped die package, high speed connector, and high speed cables where conventional manufacturing technology can be used and yet to increase the bandwidth of the interconnects.
摘要翻译：提供了用于连接高速电子元件的基础互连系统。互连系统由信号线，具有开放沟槽的介质系统或充满空气或较低介质损耗材料的槽以及接地层组成。信号线可以是例如微带线，带状线，共面线，单端或差分对。互连系统可用于片上互连，也可用于片外互连（芯片到芯片间互连）。本发明提供的基本技术也可用于高速连接器和高速电缆。更重要的是，这种基础技术也被用于可以使用常规制造技术并且增加互连带宽的高速度封装，高速连接器和高速电缆。

43. 发明申请

US20080159243A1 Local wireless communications within a device 有权
标题翻译：设备内的本地无线通信
公开(公告)号：US20080159243A1
公开(公告)日：2008-07-03
申请号：US11648744
申请日：2006-12-30
申请人： Ahmadreza (Reza) Rofougaran
发明人： Ahmadreza (Reza) Rofougaran
IPC分类号： H04Q7/24
CPC分类号： H01Q1/2283 , H01L23/3128 , H01L23/48 , H01L23/552 , H01L23/66 , H01L24/48 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/16 , H01L2223/6627 , H01L2223/6677 , H01L2224/48091 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1903 , H01L2924/3025 , H01P3/121 , H01Q23/00 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.
摘要翻译：无线电收发器装置包括用于通过空间在非常高的射频辐射电磁信号以及通过形成在衬底材料内的波导来辐射电磁信号的电路。在一个实施例中，基板包括形成在板内的电介质基板，例如印刷电路板。在本发明的另一实施例中，波导形成在集成电路无线电收发器的管芯内。定义了具有不同功能的多个收发器。基板收发器可操作以通过波导传输，而本地收发器可操作以通过空间产生非常短距离的无线传输。第三个也是最终的收发器是用于与远程（非本地到设备）收发器进行通信的典型无线收发器。

44. 发明授权

US07388279B2 Tapered dielectric and conductor structures and applications thereof 有权
标题翻译：锥形电介质和导体结构及其应用
公开(公告)号：US07388279B2
公开(公告)日：2008-06-17
申请号：US10987187
申请日：2004-11-12
申请人： Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , Gary Yasumura
发明人： Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , Gary Yasumura
IPC分类号： H01L23/58
CPC分类号： H05K1/0243 , G01R31/2822 , H01L23/13 , H01L23/49822 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2223/6633 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/49175 , H01L2924/00014 , H01L2924/14 , H01L2924/15173 , H01L2924/1903 , H01L2924/19039 , H01L2924/3011 , H01L2924/3025 , H01P3/08 , H01P5/028 , H05K1/024 , H05K2201/0191 , H05K2201/09154 , H05K2201/09727 , Y10S438/981 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.
摘要翻译：公开了锥形电介质和导体结构，其提供受控的阻抗互连，同时信号导体线从更细的间距转换到较粗的间距，从而消除通常与电路接触间距的变化相关的电中断。还公开了用于构造装置和应用的方法。

45. 发明申请

US20080128873A1 SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD 失效
标题翻译：半导体器件和印刷电路板
公开(公告)号：US20080128873A1
公开(公告)日：2008-06-05
申请号：US11960161
申请日：2007-12-19
申请人： Tohru Ohsaka
发明人： Tohru Ohsaka
IPC分类号： H01L23/48
CPC分类号： H05K1/0243 , H01L23/49827 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15173 , H01L2924/15311 , H01L2924/1903 , H01L2924/3011 , H01L2924/30111 , H05K1/023 , H05K1/112 , H05K3/242 , H05K2201/09227 , H05K2201/0979 , H05K2201/10022 , H05K2201/10734 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an interposer substrate, and the electrode pad is connected to the outermost located ball pad on the interposer substrate. With this arrangement, the length of a plating stub can be considerably reduced, and the adverse affect on a signal waveform can be minimized. This arrangement is especially effective for differential signal lines.
摘要翻译：对于处理高速差分信号的诸如BGA或CSP的多端子半导体封装，将高速信号分配给插入器基板上的最内侧定位的电极焊盘，并且电极焊盘连接到位于内插器基板上的最外侧的球垫。通过这种布置，可以显着地减少电镀短截线的长度，并且可以最小化对信号波形的不利影响。这种布置对于差分信号线特别有效。

46. 发明授权

US07372144B2 High speed electronics interconnect and method of manufacture 有权
公开(公告)号：US07372144B2
公开(公告)日：2008-05-13
申请号：US10793576
申请日：2004-03-04
申请人： Achyut Dutta
发明人： Achyut Dutta
IPC分类号： H01L21/00
CPC分类号： H01L23/66 , H01L23/5383 , H01L25/0655 , H01L2223/6627 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/09701 , H01L2924/12044 , H01L2924/13091 , H01L2924/1903 , H01L2924/19032 , H01L2924/19033 , H01L2924/3011 , H01P1/2005 , H01P3/08 , H05K1/0224 , H05K1/0236 , H05K1/024 , H05K1/0253 , H05K1/0298 , H05K1/0306 , H05K1/0313 , H05K2201/0187 , H05K2201/0191 , H05K2201/0715 , H05K2201/09036 , H05K2201/09063 , H05K2201/09681 , Y02P80/30 , H01L2924/00 , H01L2224/05599
摘要： Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and increase the bandwidth of the interconnects and also reduce the signal propagation delay, respectively. Ideally, the speed of the electrical signal on the signal line can be reached to speed of the light in the air, and the bandwidth can be reached to closer to the optical fiber. The interconnect systems consists of the signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, and the ground plan. The signal line proposed in this invention could be made any type of signal line configuration for example, microstripline, strip line or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations. The interconnect system based on the fundamental techniques provided in this invention, can be used for on-chip interconnects where the high speed electronics devices are connected by the signal line laid on the oxide or dielectric material. Again, the interconnect system based on the fundamental techniques provided in this invention, can also be used for off-chip interconnects (chip-to-chip interconnects), where the whole portion or portion of the PCB on which high speed chips are to be connected, are having the dielectric system with opened trench or slot to reduce the microwave loss. High scale chip-to-chip interconnection using of the multilayered PCB is possible. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. The main advantages of this invention are to make high speed interconnects systems for on-chip and off-chip interconnects. More over, this fundamental technology is also used for the high sped die package, high speed connector, and high speed cables where conventional manufacturing technology can be used and yet to increase the bandwidth of the interconnects.

47. 发明授权

US07365433B2 High-frequency semiconductor device and method of manufacturing the same 失效
标题翻译：高频半导体器件及其制造方法
公开(公告)号：US07365433B2
公开(公告)日：2008-04-29
申请号：US11493526
申请日：2006-07-27
申请人： Masato Fujinaga
发明人： Masato Fujinaga
IPC分类号： H01L23/48
CPC分类号： H01L23/552 , H01L21/768 , H01L23/53295 , H01L23/66 , H01L2223/6622 , H01L2223/6627 , H01L2924/0002 , H01L2924/1903 , H01L2924/00
摘要： The object of the present invention is to implement an enhancement in a noise eliminating characteristic of a wiring compatibly with promotion of microfabrication and simplification of a manufacturing process. Upper and side surfaces of a wiring (6) for transmitting a signal are continuously covered by a conductor layer (12) with insulators (7), (8) and (9) interposed therebetween in a section crossing a direction of extension thereof, and the conductor layer (12) is connected to a semiconductor substrate (1). Moreover, a periphery of a wiring (15) for transmitting a signal is continuously covered by the conductor layer (12) and a conductor layer (19) with insulators (14), (16), (17) and (18) interposed therebetween in a section crossing a direction of extension thereof. The wiring (15) is electrically connected to the semiconductor substrate (1) through a conductive plug (13) filled in a contact hole (24) formed in the conductor layer (12).
摘要翻译：本发明的目的是实现与促进微细加工和制造过程简化相兼容的布线的噪声消除特性的增强。用于传输信号的布线（6）的上表面和侧表面在与其延伸方向交叉的部分中由绝缘体（7），（8）和（9）连续地被导体层（12）覆盖，并且导体层（12）连接到半导体衬底（1）。此外，用于传输信号的布线（15）的周边被导体层（12）连续覆盖，并且具有插入其间的绝缘体（14），（16），（17）和（18）的导体层（19）在与其延伸方向相交的部分。布线（15）通过填充在形成在导体层（12）中的接触孔（24）中的导电插塞（13）与半导体基板（1）电连接。

48. 发明申请

US20070290334A1 HIGH FREQUENCY SEMICONDUCTOR DEVICE 失效
标题翻译：高频半导体器件
公开(公告)号：US20070290334A1
公开(公告)日：2007-12-20
申请号：US11539884
申请日：2006-10-10
申请人： Kenichiro Chomei
发明人： Kenichiro Chomei
IPC分类号： H01L23/34
CPC分类号： H01L23/66 , H01L24/48 , H01L2223/6627 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/181 , H01L2924/1903 , H01L2924/3011 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device has a mounting substrate and a semiconductor package mounted on the mounting substrate. The mounting substrate has a substrate body, input/output line conductors on the upper surface of the substrate body, a front-face grounding conductor on the upper surface of the substrate body, spaced from the input/output line conductors, and a lower surface grounding conductor formed on the lower surface of the substrate body and electrically connected to the front-face grounding conductor. The semiconductor package has input/output terminals electrically connected to end portions of the input/output line conductors, a grounding terminal electrically connected to the front-face grounding conductor, and a semiconductor element die-bonded on the grounding terminal and electrically connected to the input/output terminals. The input/output line conductors and the lower surface grounding conductor form micro-strip line conductors; and the front-face grounding conductor surrounds the end portions of the input/output line conductors with arch shapes.
摘要翻译：半导体器件具有安装基板和安装在安装基板上的半导体封装。安装基板具有基板主体，在基板主体的上表面上的输入/输出线导体，与输入/输出线导体间隔开的基板主体上表面上的正面接地导体，以及下表面接地导体形成在基板主体的下表面上并电连接到前面接地导体。该半导体封装具有电连接到输入/输出线路导体的端部的输入/输出端子，与前面接地导体电连接的接地端子，以及裸露接地在接地端子上的电连接到输入/输出端子。输入/输出线导体和下表面接地导体形成微带线导体; 并且前面接地导体围绕具有拱形的输入/输出线导体的端部。

49. 发明授权

US07250827B2 Circuitry module 有权
标题翻译：电路模块
公开(公告)号：US07250827B2
公开(公告)日：2007-07-31
申请号：US11077935
申请日：2005-03-11
申请人： James J. Logothetis
发明人： James J. Logothetis
IPC分类号： H01P5/12 , H03H7/00 , H03H7/38
CPC分类号： H01P5/185 , H01L23/66 , H01L24/97 , H01L2223/6627 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12032 , H01L2924/12034 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/1903 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01P3/085 , H01P3/16 , H01P5/187 , H05K1/0237 , H05K1/056 , H05K1/183 , H05K3/4614 , H05K3/4641 , H05K3/4697 , H05K2203/063 , H05K2203/065 , H01L2924/00
摘要： A circuit assembly includes multiple substrate with a regions of embedded signal processing circuitry can be connected to a region of adjustable signal processing circuitry and a cavity formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are connected to the embedded signal processing circuitry and/or to the customizable circuitry and enables the addition of a circuit element to the assembly after the bonding of the substrate layers and enables the connection of that added element to the signal processing circuitry and to the adjustable processing circuitry.
摘要翻译：电路组件包括具有嵌入信号处理电路的区域的多个衬底，其可连接到可调信号处理电路的区域，以及通过衬底层的区域形成的空腔以暴露信号连接端子。这些信号连接端子连接到嵌入式信号处理电路和/或可定制电路，并且使得能够在基板层的结合之后向组件添加电路元件，并且使得该添加元件能够连接到信号处理电路以及可调处理电路。

50. 发明申请

US20070166520A1 Glass material for use at high frequencies 有权
标题翻译：用于高频的玻璃材料
公开(公告)号：US20070166520A1
公开(公告)日：2007-07-19
申请号：US10514876
申请日：2003-05-23
申请人： Jurgen Leib , Dietrich Mund
发明人： Jurgen Leib , Dietrich Mund
IPC分类号： C03C3/089 , C03C3/091 , B32B3/00 , B32B17/06
CPC分类号： H01L21/02263 , C03B19/00 , C03C3/083 , C03C3/089 , C03C4/12 , C03C14/006 , C03C15/00 , C03C17/02 , C03C17/34 , C03C2214/16 , C03C2217/21 , C03C2218/15 , C03C2218/32 , C03C2218/328 , C03C2218/33 , C03C2218/355 , C23C14/10 , H01L21/02129 , H01L21/02161 , H01L21/31616 , H01L21/31625 , H01L21/50 , H01L21/56 , H01L23/10 , H01L23/291 , H01L23/3114 , H01L23/481 , H01L23/49894 , H01L23/66 , H01L24/97 , H01L51/5203 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L51/5262 , H01L2223/6627 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/0106 , H01L2924/01068 , H01L2924/01072 , H01L2924/01078 , H01L2924/01082 , H01L2924/04953 , H01L2924/09701 , H01L2924/12041 , H01L2924/12044 , H01L2924/15311 , H01L2924/1903 , H01L2924/19033 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/351 , H01P3/003 , H01P11/003 , H05K3/28 , H05K3/467 , H05K2201/0179 , Y02P40/57 , Y10T428/24917 , H01L2924/00
摘要： To improve the radio-frequency properties of radio-frequency substrates or radio-frequency conductor arrangements, the invention proposes a glass material for producing insulation layers for radio-frequency substrates or radio-frequency conductor arrangements, which, as an applied layer, in particular with a layer thickness in the range between 0.05 μm and 5 mm, has a loss factor tan δ of less than or equal to 70*10−4 in at least a frequency range above 1 GHz.
摘要翻译：为了提高射频基板或射频导体配置的射频特性，本发明提出了一种用于制造射频基板绝缘层的玻璃材料或射频导体装置，特别是作为应用层层厚度在0.05μm和5mm之间的范围内，在至少1GHz以上的频率范围内具有小于或等于70×10 -4 -4的损耗因子tanδ。

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