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41. 发明申请

US20090265918A1 SYSTEM AND METHOD FOR AUTOMATED PRODUCTION OF RF CHOKES 审中-公开
标题翻译：用于自动生产射频检测的系统和方法
公开(公告)号：US20090265918A1
公开(公告)日：2009-10-29
申请号：US12359554
申请日：2009-01-26
申请人： Oleg DOUNAEVSKY
发明人： Oleg DOUNAEVSKY
IPC分类号： H01F27/30
CPC分类号： H01F17/06 , H01F17/0006 , H01F2017/065 , H01F2017/067 , H01F2027/2814 , Y10T29/49073
摘要： System and method that permits fully automated production of RF hybrid devices or chokes comprised of electrical wires and a main body made of ferrite toroids are disclosed. RF chokes produced according to current invention may be used as directional couplers, in-phase splitters, balanced/unbalanced (BALUN) matching devices, radio frequency (RF) transformers etc., and may achieve high repeatability and improved electrical performance without adversely affecting electrical characteristics of the RF hybrid devices.
摘要翻译：公开了允许由电线组成的RF混合设备或扼流圈的全自动化生产以及由铁氧体环形体制成的主体的系统和方法。根据本发明制造的RF扼流器可以用作定向耦合器，同相分离器，平衡/不平衡（BALUN）匹配装置，射频（RF）变压器等），并且可以实现高重复性和改善的电性能而不会不利地影响电气 RF混合设备的特点。

42. 发明申请

US20090261813A1 CURRENT SENSOR 有权
标题翻译：电流传感器
公开(公告)号：US20090261813A1
公开(公告)日：2009-10-22
申请号：US12255783
申请日：2008-10-22
申请人： Ryuichi NISHIURA , Yo Makita , Hiroshi Nishizawa , Tadahiro Yoshida , Tae Hyun Kim
发明人： Ryuichi NISHIURA , Yo Makita , Hiroshi Nishizawa , Tadahiro Yoshida , Tae Hyun Kim
IPC分类号： G01R19/00
CPC分类号： H01F3/10 , H01F3/14 , H01F17/0033 , H01F27/346 , H01F30/16 , H01F38/30 , H01F2027/2814
摘要： A core is divided by alternately arranging plural magnetic material portions and plural non-magnetic material portions in a circumferential direction of the core through which a primary conductor penetrates. A conductor is wound around the core under conditions in which each core cross section of the core intersects the magnetic material portion and the non-magnetic material portion, each core cross section including a cut end surface of each conductor of a secondary winding wound around the core, and a ratio of a magnetic material portion cross-sectional area of the magnetic material portion to a non-magnetic material portion cross-sectional area of the non-magnetic material portion at the core cross section is kept constant at each core cross section.
摘要翻译：通过在芯的圆周方向上交替布置多个磁性材料部分和多个非磁性材料部分来分割芯体，初级导体穿过芯部。在核心的每个芯横截面与磁性材料部分和非磁性材料部分相交的条件下，导体缠绕在芯体周围，每个芯部横截面包括缠绕在第二绕组上的次级绕组的每个导体的切割端面磁芯部分的磁性材料部分横截面积与芯部横截面处的非磁性材料部分的非磁性材料部分横截面积的比率在每个芯部横截面保持恒定。

43. 发明申请

US20090201115A1 INDUCTANCE ELEMENT IN AN INTEGRATED CIRCUIT PACKAGE 审中-公开
标题翻译：集成电路封装中的电感元件
公开(公告)号：US20090201115A1
公开(公告)日：2009-08-13
申请号：US12030669
申请日：2008-02-13
申请人： Sajol Ghoshal , Philip John Crawley
发明人： Sajol Ghoshal , Philip John Crawley
IPC分类号： H01F5/00 , H01F41/00
CPC分类号： H01F1/344 , H01F17/062 , H01F27/2804 , H01F2027/2814 , H01L23/645 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L28/10 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , Y10T29/4902 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An electronic circuit in an integrated circuit package comprises an inductance element. The inductance element further comprises a plurality of separated metal strips formed on a substrate and a ferrite core coupled to the substrate. The metal strip plurality is formed between the substrate and the ferrite core. The inductance element further comprises a plurality of wires coupled to the separated metal strips whereby the metal strips and wires form a continuous coil. The ferrite core is interposed between the metal strip plurality and the wire plurality.
摘要翻译：集成电路封装中的电子电路包括电感元件。电感元件还包括形成在基板上的多个分开的金属条和耦合到基板的铁氧体芯。金属带多个形成在基板和铁氧体磁芯之间。电感元件还包括耦合到分离的金属条的多个线，由此金属条和线形成连续的线圈。铁氧体磁心介于金属带多个和电线多个之间。

44. 发明申请

US20090160596A1 MAGNETIC DEVICE 有权
标题翻译：磁性装置
公开(公告)号：US20090160596A1
公开(公告)日：2009-06-25
申请号：US12052388
申请日：2008-03-20
申请人： Chung-Jung Yang , Chuan-Yuan Kung , Man-Mei Chen , Po-Jen Tsai
发明人： Chung-Jung Yang , Chuan-Yuan Kung , Man-Mei Chen , Po-Jen Tsai
IPC分类号： H01F27/30 , H01F27/36 , H01F27/29
CPC分类号： H01F27/2804 , H01F27/2895 , H01F27/306 , H01F2027/2814
摘要： A magnetic device includes a circuit board, a magnetic induction element, an insulating structure and a plurality of conductive wire segments. The circuit board has at least one conductive layer. The magnetic induction element is disposed on the circuit board. The insulating structure covers the magnetic induction element. The insulating structure is wound by the conductive wire segments. Two ends of each conductive wire segments are electrically connected to the conductive layer to form a coil loop.
摘要翻译：磁性装置包括电路板，磁感应元件，绝缘结构和多个导电线段。电路板具有至少一个导电层。磁感应元件设置在电路板上。绝缘结构覆盖磁感应元件。绝缘结构被导线段缠绕。每个导线段的两端电连接到导电层以形成线圈环。

45. 发明申请

US20090160595A1 Compact Power Semiconductor Package and Method with Stacked Inductor and Integrated Circuit Die 有权
标题翻译：紧凑型功率半导体封装和堆叠电感和集成电路芯片的方法
公开(公告)号：US20090160595A1
公开(公告)日：2009-06-25
申请号：US12391251
申请日：2009-02-23
申请人： Tao Feng , Xiaolian Zhang , Francois Hebert , Ming Sun
发明人： Tao Feng , Xiaolian Zhang , Francois Hebert , Ming Sun
IPC分类号： H01F5/00 , H01L23/495 , H01L21/60
CPC分类号： H01L23/49861 , H01F17/0033 , H01F2027/2814 , H01L21/4832 , H01L21/563 , H01L23/495 , H01L23/4951 , H01L23/49548 , H01L23/49816 , H01L23/49827 , H01L24/48 , H01L24/49 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/49175 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/19107 , H01L2924/30107 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power semiconductor package is disclosed with high inductance rating while exhibiting a reduced foot print. It has a bonded stack of power IC die at bottom, a power inductor at top and a circuit substrate, made of leadframe or printed circuit board, in the middle. The power inductor has a inductor core of closed magnetic loop. The circuit substrate has a first number of bottom half-coil forming conductive elements beneath the inductor core. A second number of top half-coil forming conductive elements, made of bond wires, three dimensionally formed interconnection plates or upper leadframe leads, are located atop the inductor core with both ends of each element connected to respective bottom half-coil forming conductive elements to jointly form an inductive coil enclosing the inductor core. A top encapsulant protectively encases the inductor core, the top half-coil forming conductive elements, the bottom half-coil forming conductive elements and the circuit substrate.
摘要翻译：公开了一种功率半导体封装，其具有高电感额定值，同时显示出减少的脚印。底部有一个电源IC芯片，顶部有一个功率电感器和一个由引线框或印刷电路板制成的电路基板。功率电感器具有闭合磁环的电感芯。电路衬底具有在电感器芯下方形成导电元件的第一数量的底部半线圈。由接合线，三维形成的互连板或上引线框引线构成的第二数量的上半线圈形成导电元件位于电感器芯的顶部，每个元件的两端连接到形成导电元件的相应底部半线圈，共同形成围绕电感器芯的感应线圈。顶部密封剂保护性地封装电感器芯，顶部半线圈形成导电元件，底部半线圈形成导电元件和电路衬底。

46. 发明申请

US20090134503A1 Semiconductor power device package having a lead frame-based integrated inductor 有权
标题翻译：具有引线框架的集成电感器的半导体功率器件封装
公开(公告)号：US20090134503A1
公开(公告)日：2009-05-28
申请号：US11986673
申请日：2007-11-23
申请人： Tao Feng , Xiaotian Zhang , Francois Hebert
发明人： Tao Feng , Xiaotian Zhang , Francois Hebert
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/495 , H01F17/0033 , H01F2027/2814 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2924/00014 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor power device package having a lead frame-based integrated inductor is disclosed. The semiconductor power device package includes a lead frame having a plurality of leads, a inductor core attached to the lead frame such that a plurality of lead ends are exposed through a window formed in the inductor core, a plurality of bonding wires, ones of the plurality of bonding wires coupling each of the plurality of lead ends to adjacent leads about the inductor core to form the inductor, and a power integrated circuit coupled to the inductor. In alternative embodiments, a top lead frame couples each of the plurality of lead ends to adjacent leads about the inductor core by means of a connection chip.
摘要翻译：公开了一种具有引线框架的集成电感器的半导体功率器件封装。半导体功率器件封装包括具有多个引线的引线框架，附接到引线框架的电感器芯，使得多个引线端通过形成在电感器芯中的窗体露出，多个接合线，多个接合线将多个引线端中的每一个连接到围绕电感器芯的相邻引线以形成电感器，以及耦合到电感器的功率集成电路。在替代实施例中，顶部引线框架通过连接芯片将多个引线端中的每一个耦合到围绕电感器芯的相邻引线。

47. 发明授权

US07524731B2 Process of forming an electronic device including an inductor 失效
标题翻译：形成包括电感器的电子设备的工艺
公开(公告)号：US07524731B2
公开(公告)日：2009-04-28
申请号：US11540614
申请日：2006-09-29
申请人： James Jen-Ho Wang
发明人： James Jen-Ho Wang
IPC分类号： H01L21/20
CPC分类号： H01L23/5227 , H01F17/0033 , H01F2027/2814 , H01L23/552 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L27/092 , H01L2224/04042 , H01L2224/05554 , H01L2224/05644 , H01L2224/45015 , H01L2224/48091 , H01L2224/4813 , H01L2224/4845 , H01L2224/48455 , H01L2224/48463 , H01L2224/4847 , H01L2224/49175 , H01L2224/49431 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/20752 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.
摘要翻译：电子设备可以包括覆盖减震层的电感器。在一个方面，电子设备可以包括衬底，覆盖衬底的互连电平以及覆盖互连电平的减震层。电感器可以包括导电迹线和环形导线。导电迹线可以连接到震动吸收层上的导电迹线上。在另一方面，可以使用一种方法来形成包括电感器的电子设备。另一方面，电子设备可以是包括串联连接的线性电感器段的环形电感器。

48. 发明授权

US07489226B1 Fabrication method and structure for embedded core transformers 有权
标题翻译：嵌入式核心变压器的制造方法和结构
公开(公告)号：US07489226B1
公开(公告)日：2009-02-10
申请号：US12151870
申请日：2008-05-09
申请人： Bruce W. Chignola , Boris S. Jacobson , Donald H. Desrosiers , Dennis R. Kling
发明人： Bruce W. Chignola , Boris S. Jacobson , Donald H. Desrosiers , Dennis R. Kling
IPC分类号： H01F27/28
CPC分类号： H01F27/2804 , H01F27/2847 , H01F2027/2814
摘要： An embedded core electrical transformer (120) for DC to DC current conversion at a switching frequency of 1 MHz has reduced volume and weight with increased power density. The electrical transformer (120) utilizes a plurality of conductive elements (132) disposed inside a hollow cavity (128) used to embed two magnetic cores (134, 136). The conductive elements (132) encircle three sides of the embedded cores (134, 136) and interface with a multilayer PCB (137) which includes conductive traces formed therein to encircle a fourth side of the embedded cores and to form primary and secondary winding circuits.
摘要翻译：用于以1MHz的开关频率进行DC至DC电流转换的嵌入式核心电力变压器（120）具有随着功率密度的增加而减小的体积和重量。电变压器（120）利用设置在用于嵌入两个磁芯（134,136）的空腔（128）内的多个导电元件（132）。导电元件（132）环绕嵌入式芯（134,136）的三面并与多层PCB（137）接合，多层PCB（137）包括形成在其中的导电迹线，以包围嵌入式芯的第四侧，并且形成初级和次级绕组电路。

49. 发明申请

US20080079115A1 Electronic device including an inductor and a process of forming the same 失效
标题翻译：包括电感器的电子设备及其形成方法
公开(公告)号：US20080079115A1
公开(公告)日：2008-04-03
申请号：US11540614
申请日：2006-09-29
申请人： James Jen-Ho Wang
发明人： James Jen-Ho Wang
IPC分类号： H01L29/00 , H01L21/8222
CPC分类号： H01L23/5227 , H01F17/0033 , H01F2027/2814 , H01L23/552 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L27/092 , H01L2224/04042 , H01L2224/05554 , H01L2224/05644 , H01L2224/45015 , H01L2224/48091 , H01L2224/4813 , H01L2224/4845 , H01L2224/48455 , H01L2224/48463 , H01L2224/4847 , H01L2224/49175 , H01L2224/49431 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/20752 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.
摘要翻译：电子设备可以包括覆盖减震层的电感器。在一个方面，电子设备可以包括衬底，覆盖衬底的互连电平以及覆盖互连电平的减震层。电感器可以包括导电迹线和环形导线。导电迹线可以连接到震动吸收层上的导电迹线上。在另一方面，可以使用一种方法来形成包括电感器的电子设备。另一方面，电子设备可以是包括串联连接的线性电感器段的环形电感器。

50. 发明授权

US07304558B1 Toroidal inductor design for improved Q 有权
标题翻译：环形电感设计改进Q
公开(公告)号：US07304558B1
公开(公告)日：2007-12-04
申请号：US11624321
申请日：2007-01-18
申请人： Michael D. Pleskach , Bayardo A. Payan , Terry Provo
发明人： Michael D. Pleskach , Bayardo A. Payan , Terry Provo
IPC分类号： H01F5/00
CPC分类号： H01F17/0033 , H01F17/0013 , H01F17/062 , H01F2027/2814 , Y10T29/4902 , Y10T29/49073
摘要： A toroidal inductor (100) and method of forming same. The invention is intended to decrease the direct current resistance (DCR) of the toroidal inductor circuit. Thus, an increase in the quality factor (Q) of the circuit is produced. The toroidal inductor includes a coil formed from an elongated conductor extending around a core material and defining a plurality of turns. The elongated conductor is comprised of one or more coil segments. The coil segments are arranged in an alternating pattern of a first type segment (101) and a second type segment (102). Each of the coil segments of the first type includes a plurality of elongated parallel conductors (104, 105) spaced apart and electrically connected by conductive links (108) at predetermined intervals along their respective lengths. The coil segments of the second type are formed of a single conductor defined by a conductive via (302, 304) formed in the substrate.
摘要翻译：环形电感器（100）及其形成方法。本发明旨在降低环形电感电路的直流电阻（DCR）。因此，产生电路的质量因子（Q）的增加。环形电感器包括由围绕芯材料延伸并限定多个匝的细长导体形成的线圈。细长导体由一个或多个线圈段组成。线圈段以第一类型段（101）和第二类型段（102）的交替模式布置。第一类型的线圈段中的每一个包括多个细长平行的导体（104,105），其间隔开并且沿着它们各自的长度以预定间隔由导电连接件（108）电连接。第二类型的线圈段由形成在衬底中的导电通孔（302,304）限定的单个导体形成。

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