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41. 发明申请

US20120061880A1 MOLDING APPARATUS AND MOLDING METHOD FOR PACKAGING SEMICONDUCTOR 审中-公开
标题翻译：用于包装半导体的成型装置和成型方法
公开(公告)号：US20120061880A1
公开(公告)日：2012-03-15
申请号：US13221576
申请日：2011-08-30
申请人： Seok-Jae Han
发明人： Seok-Jae Han
IPC分类号： H01L21/56 , B29C45/00 , B29C45/76 , B29C45/14
CPC分类号： B29C45/14655 , B29C45/0046 , B29C45/568 , B29C2791/008 , H01L21/565 , H01L2224/48091 , H01L2924/00014
摘要： A molding apparatus for packaging a semiconductor device includes an upper mold having a first cavity, a lower mold having a second cavity corresponding to the first cavity, and a selective flow facilitation unit. The first and second cavities are configured to receive a printed circuit board (PCB). The selective flow facilitation unit is configured to increase a flow of a molding resin in a selective area of the PCB. The flow of the molding resin in the selective area of the PCB is faster than the flow of the molding resin in a non-selective area of the PCB.
摘要翻译：一种用于包装半导体器件的成型设备包括具有第一空腔的上模具，具有与第一空腔对应的第二空腔的下模具和选择性流动促进单元。第一和第二腔被构造成接收印刷电路板（PCB）。选择性流动促进单元被配置为增加PCB的选择性区域中的模制树脂的流动。在PCB的选择区域中的模塑树脂的流动比在PCB的非选择性区域中的模塑树脂的流动更快。

42. 发明申请

US20120025254A1 SEMICONDUCTOR LIGHT EMITTING DEVICE SUBSTRATE STRIPS AND PACKAGED SEMICONDUCTOR LIGHT EMITTING DEVICES 有权
标题翻译：半导体发光器件基片和包装半导体发光器件
公开(公告)号：US20120025254A1
公开(公告)日：2012-02-02
申请号：US13253657
申请日：2011-10-05
申请人： Ban P. Loh , Nicholas W. Medendorp, JR.
发明人： Ban P. Loh , Nicholas W. Medendorp, JR.
IPC分类号： H01L33/58
CPC分类号： B29C45/14655 , B29C45/14836 , B29C45/34 , B29C2045/14844 , B29K2083/00 , B29K2995/0018 , B29L2011/0016 , H01L24/97 , H01L33/52 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.
摘要翻译：半导体发光器件封装方法包括制造在其上安装半导体发光器件的衬底。衬底可以包括被配置为将半导体发光器件安装在其中的空腔。半导体发光器件安装在基板上并电连接到基板的接触部分。衬底被液体注射成型以形成在半导体发光器件上结合到衬底的光学元件。之前可以在空腔中的电连接的半导体发光器件上施加软树脂。还提供了半导体发光器件衬底条。

43. 发明授权

US08070992B2 Mold cleaning sheet and method of producing semiconductor devices using the same 有权
标题翻译：模具清洁片及使用其制造半导体器件的方法
公开(公告)号：US08070992B2
公开(公告)日：2011-12-06
申请号：US12906421
申请日：2010-10-18
申请人： Kiyoshi Tsuchida
发明人： Kiyoshi Tsuchida
IPC分类号： B29C45/14
CPC分类号： B29C33/72 , B29C45/14655 , B29C45/1753 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A cleaning sheet (29) is formed with a trough-hole (29a) at a portion corresponding to a cavity of a mold along with a slit (29b) or a flow cavity cut (29c) at every corner at an outer periphery of the through-hole (29a) and is placed between a first mold half and a second mold half of the mold to clean the inside of the mold, thereby improving the cleaning effect of the mold.
摘要翻译：清洁片（29）在与模具的空腔相对应的部分处形成有槽孔（29a）以及在该外壳的每个拐角处的狭缝（29b）或流动腔切割（29c）通孔（29a），并且放置在模具的第一半模和第二半模之间以清洁模具的内部，从而提高模具的清洁效果。

44. 发明授权

US08057723B2 Method of manufacturing insert-molded article and apparatus therefor 有权
标题翻译：嵌入成型品的制造方法及其装置
公开(公告)号：US08057723B2
公开(公告)日：2011-11-15
申请号：US11704359
申请日：2007-02-09
申请人： Takeshi Takeda , Makoto Kitamura , Nihei Kaishita
发明人： Takeshi Takeda , Makoto Kitamura , Nihei Kaishita
IPC分类号： B29C45/14
CPC分类号： B29C45/14221 , B29C45/14655
摘要： Provides is a method of manufacturing an insert-molded article enabling to perform resin molding and tie bar cutting in one step and so as not to expose the cut planes of the tie bars to the external surface of the resin. A lead frame 1 provided with easily breakable notches 3a at positions closer to the metal component than the interfaces of tie bars 3 to be resin molded is prepared and positioned by means of pilot pins 11 provided to a lower mold 10. A metal component 4 is sandwiched between support protrusions 13 and component fixing pins 24 by lowering an upper mold 20 with the lead frame being positioned. Tie bar cutting punches 23 provided to the upper mold 20 are pressed against the tie bars, the tie bars 3 are separated from the metal component 4 by breaking the notches 3a, and the surroundings of the metal component 4 are filled with resin while the molds are closed. By this, the cut surfaces between the metal component 4 and the tie bars 3 are buried in the molded resin 7.
摘要翻译：提供一种制造插入成型制品的方法，其能够在一个步骤中进行树脂模制和拉杆切割，并且不将连杆的切割面暴露于树脂的外表面。通过设置在下模具10上的引导销11准备并定位引线框架1，该引线框架1在比待连接条3的树脂模制接口更靠近金属部件的位置处设置容易断裂的切口3a。金属部件4 通过在引线框架定位的同时降低上模20而夹在支撑突起13和部件固定销24之间。设置在上模具20上的连杆切割冲头23被压靠在拉杆上，通过断开切口3a将连接杆3与金属部件4分离，金属部件4的周围用树脂填充，而模具关闭。由此，将金属部件4和连接条3之间的切割面埋设在模制树脂7中。

45. 发明申请

US20110254026A1 SURFACE MOUNTED LED PACKAGE 有权
标题翻译：表面安装LED包装
公开(公告)号：US20110254026A1
公开(公告)日：2011-10-20
申请号：US13175134
申请日：2011-07-01
申请人： CHIH-LUNG LIANG , YUAN-FU CHEN
发明人： CHIH-LUNG LIANG , YUAN-FU CHEN
IPC分类号： H01L33/08 , H01L33/60
CPC分类号： H01L33/54 , B29C45/0046 , B29C45/14655 , B29C45/14836 , B29C45/2708 , H01L33/005 , H01L33/483 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED device and LED module are provided. The LED device is coupled to a lead frame with a first plane and a second plane opposite to the first plane, the lead frame having a LED chip disposed on the first plane. The LED device includes a reflection cup structure disposed on the lead frame, a lens structure and at least one fixing structure. The LED chip is disposed in the reflection cup structure and electrically connected to the first plane of the lead frame. The lens structure covers the first plane and the second plane of the lead frame. The fixing structure and the fixing structures are formed integrally and cover the lead frame cooperatively.
摘要翻译：提供LED装置和LED模块。 LED装置与具有第一平面和与第一平面相对的第二平面的引线框架连接，引线框架具有布置在第一平面上的LED芯片。 LED装置包括设置在引线框架上的反射杯结构，透镜结构和至少一个固定结构。 LED芯片设置在反射杯结构中并电连接到引线框架的第一平面。透镜结构覆盖引线框架的第一平面和第二平面。固定结构和固定结构一体地形成并且协同地覆盖引线框架。

46. 发明申请

US20110244637A1 MOLD AND SUBSTRATE FOR USE WITH MOLD 有权
标题翻译：模具和基材用于模具
公开(公告)号：US20110244637A1
公开(公告)日：2011-10-06
申请号：US13097066
申请日：2011-04-29
申请人： Poh Leng EU , Boon Yew Low , Wai Keong Wong
发明人： Poh Leng EU , Boon Yew Low , Wai Keong Wong
IPC分类号： H01L21/56 , B29C33/10
CPC分类号： B29C45/14655 , B29C45/14836 , B29C45/34 , H01L2924/14 , H01L2924/1433
摘要： A mold (10) including a first mold part (12) and a second mold part (14) define a mold cavity (16) therebetween. A gate (18) is formed in at least one of the first and second mold parts (12) and (14) such that the gate (18) communicates with the mold cavity (16). A vent (20) having a constricted portion (22) is arranged to communicate with the mold cavity (16). A substrate (28) including a base substrate (30) and an electrically conductive pattern (32) and (34) formed on the base substrate (30) may be received in the mold (10). A solder resist layer (36) is formed on the base substrate (30) and a portion of the electrically conductive pattern (32). A plurality of grooves (38) and (40) is formed in a staggered arrangement around a periphery of a molding area (42) on the substrate (28).
摘要翻译：包括第一模具部件（12）和第二模具部件（14）的模具（10）在它们之间限定模具腔（16）。在第一和第二模具部件（12）和（14）中的至少一个模具部件（14）中形成有浇口（18），使得浇口（18）与模腔（16）连通。具有收缩部分（22）的排气口（20）被布置成与模腔（16）连通。可以在模具（10）中容纳包括基底（30）和形成在基底（30）上的导电图案（32）和（34）的基底（28）。在基底基板（30）和导电图案（32）的一部分上形成阻焊层（36）。多个凹槽（38）和（40）以围绕衬底（28）上的模制区域（42）的周边的交错布置形成。

47. 发明申请

US20110235341A1 METHOD OF MANUFACTURING A LIGHT EMITTING UNIT AND LIGHT EMITTING DEVICE MANUFACTURED USING THE METHOD 有权
标题翻译：制造发光单元的方法和使用该方法制造的发光装置
公开(公告)号：US20110235341A1
公开(公告)日：2011-09-29
申请号：US12892383
申请日：2010-09-28
申请人： Seung-Sik Hong , Seung-Ryeol Ryu
发明人： Seung-Sik Hong , Seung-Ryeol Ryu
IPC分类号： F21V15/01 , B29C45/14
CPC分类号： H05K3/284 , B29C45/0046 , B29C45/14065 , B29C45/14655 , F21K9/90 , F21V23/06 , F21Y2105/10 , F21Y2115/10 , H05K2201/10106 , H05K2201/1034 , H05K2203/1316
摘要： The present invention relates to a method of manufacturing a light emitting unit including mounting at least one light emitting element on a printed circuit board (PCB), connecting at least one terminal to the PCB, the at least one terminal to provide power to the at least one light emitting element, and molding a housing to enclose a light emitting part including the PCB and the at least one terminal.
摘要翻译：本发明涉及一种制造发光单元的方法，包括将至少一个发光元件安装在印刷电路板（PCB）上，将至少一个端子连接至PCB，所述至少一个端子向所述至少一个端子提供电力至少一个发光元件，以及模制壳体以包围包括所述PCB和所述至少一个端子的发光部分。

48. 发明授权

US07994529B2 LED with molded bi-directional optics 有权
标题翻译： LED模具双向光学元件
公开(公告)号：US07994529B2
公开(公告)日：2011-08-09
申请号：US12265131
申请日：2008-11-05
申请人： Serge Bierhuizen , Mark Butterworth
发明人： Serge Bierhuizen , Mark Butterworth
IPC分类号： H01L33/00
CPC分类号： B29C45/1671 , B29C45/14655 , B29D11/00355 , B29L2031/3406 , G02B6/003 , G02B6/0031 , G02B6/0068 , G02B6/0073 , H01L33/54 , H01L33/58
摘要： A double-molded lens for an LED includes an outer lens molded around the periphery of an LED die and a collimating inner lens molded over the top surface of the LED die and partially defined by a central opening in the outer lens. The outer lens is formed using silicone having a relatively low index of refraction such as n=1.33-1.47, and the inner lens is formed of a higher index silicone, such as n=1.54-1.76, to cause TIR within the inner lens. Light not internally reflected by the inner lens is transmitted into the outer lens. The shape of the outer lens determines the side emission pattern of the light. The front and side emission patterns separately created by the two lenses may be tailored for a particular backlight or automotive application.
摘要翻译：用于LED的双重模制透镜包括在LED模具的周围模制的外透镜和在LED模具的顶表面上模制并且部分地由外透镜中的中心开口限定的准直内透镜。外透镜使用具有较低折射率（例如n = 1.33-1.47）的硅酮形成，并且内透镜由较高折射率的硅酮形成，例如n = 1.54-1.76，以引起内透镜内的TIR。内部透镜未内部反射的光被透射到外部透镜中。外透镜的形状确定光的侧发射图案。由两个透镜分开创建的前侧和侧面发射图案可以针对特定背光或汽车应用而定制。

49. 发明申请

US20110189800A1 LED PACKAGING METHOD 失效
标题翻译： LED封装方法
公开(公告)号：US20110189800A1
公开(公告)日：2011-08-04
申请号：US12947850
申请日：2010-11-17
申请人： Kuang-Chu LAI
发明人： Kuang-Chu LAI
IPC分类号： H01L33/52
CPC分类号： B29C45/14655 , B29C45/2708 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2924/00
摘要： A light emitting diode (LED) packaging method includes the steps of preparing a circuit board (1), a transparent cap (3), and at least one LED material (2), placing the transparent cap (3) on the LED material (2) such that the circuit board (1) is aligned and superimposed, and forming an encapsulation layer (4) having a light pattern on the transparent cap (3) by an in-mold decoration injection molding process. In the in-mold decoration injection molding process, a filling port (511) of a mold (5) is aligned precisely above the LED material (2) to prevent a deviation of the LED material (2) and omit a surface mount technology (SMT) process, so as to integrally form an LED with a light pattern at the same time and achieve good water-resisting and static charge resisting effects.
摘要翻译：发光二极管（LED）封装方法包括以下步骤：制备电路板（1），透明盖（3）和至少一个LED材料（2），将透明盖（3）放置在LED材料 2），使得电路板（1）对准和重叠，并且通过模内装饰注射成型工艺在透明盖（3）上形成具有光图案的封装层（4）。在模内装饰注射成型工艺中，模具（5）的填充口（511）精确地对准LED材料（2），以防止LED材料（2）的偏离并省略表面贴装技术 SMT）工艺，以便同时整合形成具有光图案的LED，并实现良好的耐水和静电抵抗效果。

50. 发明授权

US07943432B2 Mold cleaning sheet and manufacturing method of a semiconductor device using the same 有权
标题翻译：模具清洁片及使用其的半导体器件的制造方法
公开(公告)号：US07943432B2
公开(公告)日：2011-05-17
申请号：US12424075
申请日：2009-04-15
申请人： Kiyoshi Tsuchida
发明人： Kiyoshi Tsuchida
IPC分类号： H01L21/00
CPC分类号： B29C33/72 , B29C45/14655 , B29C45/1753 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/181 , Y10T428/24 , H01L2924/00012 , H01L2924/00014
摘要： A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed along the peripheral edge to the outside of the plural cavities of the mating surface of the molding die, the cleaning sheet main body being formed with first through holes at positions corresponding to the cavities of the molding die, air vent slits and flow cavity recesses at positions corresponding to the air vents of the cavities, second through holes at positions corresponding to the pots of the molding die, and slits at positions corresponding to the runners of the molding die, thereby capable of improving the cleaning effect of the molding die and shortening the time for the cleaning operation to improve the productivity.
摘要翻译：一种具有用于清洁成型模具的框架的清洁片，其包括覆盖成型模具的整个配合表面的清洁热主体和能够沿着周边设置在配合表面的多个空腔的外部的加强框架成型模具，清洁片主体在对应于成型模具的空腔的位置处形成有第一通孔，在与空腔的通气口对应的位置处的通气孔狭缝和流动腔凹部中，在相应位置处的第二通孔与成型模具的浇道相对应的切口和成形模具的流道的位置处的切口，从而能够提高成形模具的清洗效果，缩短清洗动作的时间，提高生产率。

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