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1. 发明授权

US08430527B2 Illuminating device and method for manufacturing the same 失效
标题翻译：照明装置及其制造方法
公开(公告)号：US08430527B2
公开(公告)日：2013-04-30
申请号：US12791030
申请日：2010-06-01
申请人： Kuang-Chu Lai
发明人： Kuang-Chu Lai
IPC分类号： F21V5/04 , F21V5/00
CPC分类号： H01L33/00 , F21K9/00 , F21V21/00 , F21V29/70 , F21V29/713 , F21V31/04 , F21Y2105/10 , F21Y2115/10
摘要： A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.
摘要翻译：一种制造照明装置的方法，包括以下步骤：在金属基板上形成导电电路，在金属基板上排列与导电电路电连接的发光元件，在发光元件的每一个上覆盖透明盖，将电连接器固定到金属基板上以与导电电路电连接，通过过度成型工艺在透明盖，金属基板和导电电路外部形成透明体; 通过超模制工艺在透明体外部，金属基底和电连接器上形成灯罩。还提供一种照明装置，从而防止发光元件由于过度模制过程的温度和压力而受到损坏，并且增加了由发光元件发射的光的亮度。

2. 发明申请

US20130044484A1 ILLUMINATING DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：照明装置及其制造方法
公开(公告)号：US20130044484A1
公开(公告)日：2013-02-21
申请号：US13645487
申请日：2012-10-04
申请人： Kuang-Chu LAI
发明人： Kuang-Chu LAI
IPC分类号： F21V21/00
CPC分类号： H01L33/00 , F21K9/00 , F21V21/00 , F21V29/70 , F21V29/713 , F21V31/04 , F21Y2105/10 , F21Y2115/10
摘要： A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.
摘要翻译：一种制造照明装置的方法，包括以下步骤：在金属基板上形成导电电路，在金属基板上排列与导电电路电连接的发光元件，在发光元件的每一个上覆盖透明盖，将电连接器固定到金属基板上以与导电电路电连接，通过过度成型工艺在透明盖，金属基板和导电电路外部形成透明体; 通过超模制工艺在透明体外部，金属基底和电连接器上形成灯罩。还提供一种照明装置，从而防止发光元件由于过度模制过程的温度和压力而受到损坏，并且增加了由发光元件发射的光的亮度。

3. 发明申请

US20140153277A1 ASSEMBLING STRUCTURE FOR LED LAMP MODULE 审中-公开
标题翻译： LED灯组件组装结构
公开(公告)号：US20140153277A1
公开(公告)日：2014-06-05
申请号：US13689813
申请日：2012-11-30
申请人： Kuang-Chu LAI
发明人： Kuang-Chu LAI
IPC分类号： F21V17/10 , F21V29/00 , F21V21/30
CPC分类号： F21V17/10 , F21K9/20 , F21K9/69 , F21V5/007 , F21V19/04 , F21V29/773 , F21Y2105/10 , F21Y2115/10
摘要： An assembling structure of an LED lamp module includes an LED lamp base (10) and a heat sink (30). The LED lamp base (10) includes a plastic receptacle (11), an LED light source (12) disposed in the plastic receptacle (11), and a plurality of metal fasteners (20) spaced apart and upright on an outer side surface of the plastic receptacle (11). The heat sink (30) includes has a plurality of openings (42), wherein the LED lamp base (10) is rotatable with respect to the heat sink (30) to make the metal fasteners (20) positioned in the openings (42), respectively and thus, the LED lamp base (10) is combined with the heat sink (30).
摘要翻译： LED灯模块的组装结构包括LED灯座（10）和散热器（30）。 LED灯座（10）包括塑料插座（11），设置在塑料插座（11）中的LED光源（12），以及多个金属紧固件（20），其间隔开并竖立在外侧表面上塑料容器（11）。散热器（30）包括多个开口（42），其中LED灯座（10）能够相对于散热器（30）旋转，以使金属紧固件（20）位于开口（42）中，，因此LED灯座（10）与散热器（30）组合。

4. 发明授权

US08342703B2 Light emitting apparatus 失效
标题翻译：发光装置
公开(公告)号：US08342703B2
公开(公告)日：2013-01-01
申请号：US13040964
申请日：2011-03-04
申请人： Kuang-Chu Lai
发明人： Kuang-Chu Lai
IPC分类号： F21V9/16
CPC分类号： H01L25/0753 , F21S8/085 , F21V9/30 , F21V29/70 , F21W2111/02 , F21Y2105/10 , F21Y2115/10 , H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A light emitting apparatus including a circuit board (10), at least one light emitting chip (20), an integrated optical cover (30) and a fluorescent layer (40). The light emitting chip (20) is arranged on the circuit board (10). The integrated optical cover (30) has a peripheral wall (31), a top wall (32) and a light guiding post (33). The peripheral wall (31) is arranged around the circuit board (10). The top wall (32) is arranged on the peripheral wall (31). The light guiding post (33) extends from the top wall (32) toward the light emitting chip (20). The light guiding post (33) includes a recess portion (332). The light emitting chip (20) is accommodated in the recess portion (332). The fluorescent layer (40) is arranged between the recess portion (332) and the light emitting chip (20). By using the recess portion (332) and the light emitting chip (20) cooperatively to confine the fluorescent layer (40), the thickness thereof can be controlled to be consistent.
摘要翻译：一种发光装置，包括电路板（10），至少一个发光芯片（20），集成光学盖（30）和荧光层（40）。发光芯片（20）布置在电路板（10）上。集成光学盖（30）具有周壁（31），顶壁（32）和导光柱（33）。周壁（31）围绕电路板（10）布置。顶壁（32）布置在周壁（31）上。导光柱（33）从顶壁（32）朝向发光芯片（20）延伸。导光柱（33）包括凹部（332）。发光芯片（20）容纳在凹部（332）中。荧光层（40）设置在凹部（332）和发光芯片（20）之间。通过使凹部（332）和发光芯片（20）协同地限制荧光层（40），其厚度可以被控制为一致。

5. 发明申请

US20120008304A1 LIGHT EMITTING APPARATUS 失效
标题翻译：发光装置
公开(公告)号：US20120008304A1
公开(公告)日：2012-01-12
申请号：US13040964
申请日：2011-03-04
申请人： Kuang-Chu LAI
发明人： Kuang-Chu LAI
IPC分类号： F21V9/16
CPC分类号： H01L25/0753 , F21S8/085 , F21V9/30 , F21V29/70 , F21W2111/02 , F21Y2105/10 , F21Y2115/10 , H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A light emitting apparatus including a circuit board (10), at least one light emitting chip (20), an integrated optical cover (30) and a fluorescent layer (40). The light emitting chip (20) is arranged on the circuit board (10). The integrated optical cover (30) has a peripheral wall (31), a top wall (32) and a light guiding post (33). The peripheral wall (31) is arranged around the circuit board (10). The top wall (32) is arranged on the peripheral wall (31). The light guiding post (33) extends from the top wall (32) toward the light emitting chip (20). The light guiding post (33) includes a recess portion (332). The light emitting chip (20) is accommodated in the recess portion (332). The fluorescent layer (40) is arranged between the recess portion (332) and the light emitting chip (20). By using the recess portion (332) and the light emitting chip (20) cooperatively to confine the fluorescent layer (40), the thickness thereof can be controlled to be consistent.
摘要翻译：一种发光装置，包括电路板（10），至少一个发光芯片（20），集成光学盖（30）和荧光层（40）。发光芯片（20）布置在电路板（10）上。集成光学盖（30）具有周壁（31），顶壁（32）和导光柱（33）。周壁（31）围绕电路板（10）布置。顶壁（32）布置在周壁（31）上。导光柱（33）从顶壁（32）朝向发光芯片（20）延伸。导光柱（33）包括凹部（332）。发光芯片（20）容纳在凹部（332）中。荧光层（40）设置在凹部（332）和发光芯片（20）之间。通过使凹部（332）和发光芯片（20）协同地限制荧光层（40），其厚度可以被控制为一致。

6. 发明授权

US08088636B2 LED packaging using injection molding method 失效
标题翻译： LED封装采用注塑成型法
公开(公告)号：US08088636B2
公开(公告)日：2012-01-03
申请号：US12947850
申请日：2010-11-17
申请人： Kuang-Chu Lai
发明人： Kuang-Chu Lai
IPC分类号： H01L21/00
CPC分类号： B29C45/14655 , B29C45/2708 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2924/00
摘要： A light emitting diode (LED) packaging method includes the steps of preparing a circuit board (1), a transparent cap (3), and at least one LED material (2), placing the transparent cap (3) on the LED material (2) such that the circuit board (1) is aligned and superimposed, and forming an encapsulation layer (4) having a light pattern on the transparent cap (3) by an in-mold decoration injection molding process. In the in-mold decoration injection molding process, a filling port (511) of a mold (5) is aligned precisely above the LED material (2) to prevent a deviation of the LED material (2) and omit a surface mount technology (SMT) process, so as to integrally form an LED with a light pattern at the same time and achieve good water-resisting and static charge resisting effects.
摘要翻译：发光二极管（LED）封装方法包括以下步骤：制备电路板（1），透明盖（3）和至少一个LED材料（2），将透明盖（3）放置在LED材料 2），使得电路板（1）对准和重叠，并且通过模内装饰注射成型工艺在透明盖（3）上形成具有光图案的封装层（4）。在模内装饰注射成型工艺中，模具（5）的填充口（511）精确地对准LED材料（2），以防止LED材料（2）的偏离并省略表面贴装技术 SMT）工艺，以便同时整合形成具有光图案的LED，并实现良好的耐水和静电抵抗效果。

7. 发明授权

US08421174B2 Light emitting diode package structure 失效
标题翻译：发光二极管封装结构
公开(公告)号：US08421174B2
公开(公告)日：2013-04-16
申请号：US13084947
申请日：2011-04-12
申请人： Kuang-Chu Lai
发明人： Kuang-Chu Lai
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , B29C45/14311 , B29C45/14655 , B29L2011/0016 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode package structure includes a substrate (10), LED bare chips (20) and a lens (30). The substrate (10) has an upper surface (11), a lower surface (12) and a side surface (13) between the upper surface (11) and the lower surface (12). The upper surface (11) is provided with a circuit pattern (111). The side surface (13) is provided with a groove (131). The LED bare chips (20) are fixed on the upper surface (11) and electrically connected with the circuit pattern (111). The lens (30) covers the LED bare chips (20), the upper surface (11) and the circuit pattern (111) by an injection molding process so as to be inserted into the groove (131). With this arrangement, the connecting strength between the substrate (10) and the lens (30) can be enhanced, thereby achieving waterproof and anti-electrostatic effects. Further, material cost of the present invention is reduced greatly.
摘要翻译：发光二极管封装结构包括基板（10），LED裸芯片（20）和透镜（30）。基板（10）在上表面（11）和下表面（12）之间具有上表面（11），下表面（12）和侧表面（13）。上表面（11）设有电路图案（111）。侧表面（13）设置有凹槽（131）。 LED裸芯片（20）固定在上表面（11）上并与电路图案（111）电连接。透镜（30）通过注射成型工艺覆盖LED裸芯片（20），上表面（11）和电路图案（111），以插入凹槽（131）中。通过这种布置，可以提高基板（10）和透镜（30）之间的连接强度，从而实现防水和抗静电效果。此外，本发明的材料成本大大降低。

8. 发明申请

US20110189800A1 LED PACKAGING METHOD 失效
标题翻译： LED封装方法
公开(公告)号：US20110189800A1
公开(公告)日：2011-08-04
申请号：US12947850
申请日：2010-11-17
申请人： Kuang-Chu LAI
发明人： Kuang-Chu LAI
IPC分类号： H01L33/52
CPC分类号： B29C45/14655 , B29C45/2708 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2924/00
摘要： A light emitting diode (LED) packaging method includes the steps of preparing a circuit board (1), a transparent cap (3), and at least one LED material (2), placing the transparent cap (3) on the LED material (2) such that the circuit board (1) is aligned and superimposed, and forming an encapsulation layer (4) having a light pattern on the transparent cap (3) by an in-mold decoration injection molding process. In the in-mold decoration injection molding process, a filling port (511) of a mold (5) is aligned precisely above the LED material (2) to prevent a deviation of the LED material (2) and omit a surface mount technology (SMT) process, so as to integrally form an LED with a light pattern at the same time and achieve good water-resisting and static charge resisting effects.
摘要翻译：发光二极管（LED）封装方法包括以下步骤：制备电路板（1），透明盖（3）和至少一个LED材料（2），将透明盖（3）放置在LED材料 2），使得电路板（1）对准和重叠，并且通过模内装饰注射成型工艺在透明盖（3）上形成具有光图案的封装层（4）。在模内装饰注射成型工艺中，模具（5）的填充口（511）精确地对准LED材料（2），以防止LED材料（2）的偏离并省略表面贴装技术 SMT）工艺，以便同时整合形成具有光图案的LED，并实现良好的耐水和静电抵抗效果。

9. 发明申请

US20110075421A1 ILLUMINATING DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：照明装置及其制造方法
公开(公告)号：US20110075421A1
公开(公告)日：2011-03-31
申请号：US12791030
申请日：2010-06-01
申请人： Kuang-Chu LAI
发明人： Kuang-Chu LAI
IPC分类号： F21V21/00 , H01J9/00
CPC分类号： H01L33/00 , F21K9/00 , F21V21/00 , F21V29/70 , F21V29/713 , F21V31/04 , F21Y2105/10 , F21Y2115/10
摘要： A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.
摘要翻译：一种制造照明装置的方法，包括以下步骤：在金属基板上形成导电电路，在金属基板上排列与导电电路电连接的发光元件，在发光元件的每一个上覆盖透明盖，将电连接器固定到金属基板上以与导电电路电连接，通过过度成型工艺在透明盖，金属基板和导电电路外部形成透明体; 通过超模制工艺在透明体外部，金属基底和电连接器上形成灯罩。还提供一种照明装置，从而防止发光元件由于过度模制过程的温度和压力而受到损坏，并且增加了由发光元件发射的光的亮度。

10. 发明申请

US20130264735A1 MOLD-MAKING METHOD CAPABLE OF SHORTENING A PROCEDURE OF MANUFACTURING A PRODUCT MOLD 审中-公开
标题翻译：可以制造制造产品模具的程序的模具制造方法
公开(公告)号：US20130264735A1
公开(公告)日：2013-10-10
申请号：US13440531
申请日：2012-04-05
申请人： Kuang-Chu LAI
发明人： Kuang-Chu LAI
IPC分类号： B29C45/76 , B29C33/40
CPC分类号： B29C33/3842 , B29C33/40
摘要： The present invention provides a mold-making method capable of shortening a procedure of manufacturing a product mold, including steps of: preparing a plastic original mold; processing the original mold to form a preliminary product; assembling the preliminary product and testing the functions of the preliminary product having the original mold; producing a standard mold after testing the functions of the preliminary product; and producing a final mold having a profile and a dimension corresponding to those of the standard mold. By this method, the procedure of developing a mold is shortened, so that the production cost of a mold can be reduced.
摘要翻译：本发明提供一种能够缩短产品模具制造工序的模具制造方法，包括以下步骤：制备塑料原模; 加工原模，形成初步产品; 组装初步产品，测试原模具初步产品的功能; 测试初步产品的功能后生产标准模具; 并制造具有与标准模具的轮廓和尺寸相对应的轮廓和尺寸的最终模具。通过这种方法，缩短开发模具的过程，从而可以降低模具的生产成本。

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