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    • 43. 发明授权
    • Workpiece support systems and related machines
    • 工件支撑系统和相关机器
    • US08813941B2
    • 2014-08-26
    • US13362055
    • 2012-01-31
    • Andreas Kettner-ReichTobias MeckMartin Petera
    • Andreas Kettner-ReichTobias MeckMartin Petera
    • B65G43/00B23Q7/14
    • B23Q7/1431B23Q7/1426
    • In some aspects, a workpiece processing installation includes an operating area, an operating pallet able to be moved along a transport direction between a position within the operating area and a position outside the operating area, the operating pallet being configured to support a workpiece, and a pallet support that is configured to be transferred from a first position, in which the pallet support defines a storage area for the storage of the operating pallet outside the operating area, to a second position in which the pallet support protrudes away from the operating area in the transport direction to a lesser extent than it does in the first position. Transferring the pallet support from the first position to the second position includes moving at least a portion of the pallet support towards the operating area which results in the storage area defined by the pallet support becoming smaller.
    • 在一些方面,工件处理设备包括操作区域,操作托盘,其能够在操作区域内的位置与操作区域外部的位置之间沿输送方向移动,所述操作托板构造成支撑工件;以及 配置成从第一位置传送的托盘支撑件,其中托盘支撑件限定用于将操作托盘在操作区域外部存储的存储区域到托盘支撑件从操作区域突出的第二位置 在运输方向上比在第一位置的程度更小。 将托盘支撑件从第一位置传送到第二位置包括将托盘支撑件的至少一部分移动到操作区域,导致由托盘支架限定的存储区域变小。
    • 45. 发明授权
    • Apparatus for holding a plate-like material during a separation process
    • 用于在分离过程中保持板状材料的装置
    • US08714066B2
    • 2014-05-06
    • US12636994
    • 2009-12-14
    • Eberhard WahlMartin Blaser
    • Eberhard WahlMartin Blaser
    • B26D7/01B26F3/00
    • B26D7/20B23K26/0876B23K26/38B23K37/0461B23K37/047B23K2101/16B26D7/018B26D7/0625B26D2007/206B26F3/004Y10T83/2185Y10T83/2192Y10T83/364Y10T83/566Y10T83/6579Y10T83/6582Y10T83/727
    • An apparatus for holding a plate-like material during a separation process. The apparatus includes a separating device that is movable, during the separation process, in a first axial direction that is transverse to a second axial direction that the plate-like material is conveyed in during the separation process. The apparatus also includes first and second transport tables. The first transport table has a first contact surface and the second transport table has a second contact surface. The first contact surface and the second contact surface are spaced apart by a gap along which the separating device is movable. The apparatus also includes at least one holding device that is operable hold the plate-like material relative to the first and second contact surfaces such that the plate-like material is movable along the first and second contact surfaces. The holding device is configured to support the plate-like material such that a first surface of the plate-like material, on which a cutting beam of the separating device impinges, faces toward the first and second contact surfaces during the separation process.
    • 一种用于在分离过程中保持板状材料的装置。 该装置包括分离装置,该分离装置在分离过程中可沿着在分离过程期间板状材料被输送的横向于第二轴向方向的第一轴向移动。 该装置还包括第一和第二传送台。 第一输送台具有第一接触表面,第二输送台具有第二接触表面。 第一接触表面和第二接触表面间隔开分隔装置可移动的间隙。 该装置还包括至少一个保持装置,其可操作地相对于第一和第二接触表面保持板状材料,使得板状材料可沿第一和第二接触表面移动。 保持装置构造成支撑板状材料,使得在分离过程中,分离装置的切割梁在其上撞击的板状材料的第一表面朝向第一和第二接触表面。
    • 46. 发明授权
    • Forming and/or cutting plate workpieces
    • 成型和/或切割板材工件
    • US08671728B2
    • 2014-03-18
    • US12425534
    • 2009-04-17
    • Joerg Heusel
    • Joerg Heusel
    • B21D1/02B21D3/02B21D17/04B21B19/14B21D5/14
    • G05B19/195B21D17/04
    • A plate workpiece processing tool includes a first tool portion and a second tool portion. The first and second tool portions are arranged along an application axis in spaced relation to each other such that a plate workpiece can be disposed therebetween. The tool also includes two or more processing devices that are carried by the first tool portion, and one or more counter-devices that are carried by the second tool portion. The processing devices are rotatable, relative to the first tool portion, about a first rotational axis that extends perpendicular to the application axis and are arranged to follow each other along an axis extending perpendicularly to the application axis. The processing devices and the one or more counter-devices are selectively alignable to form a plurality of alternative device pairings for processing plate workpieces therebetween.
    • 平板工件加工工具包括第一工具部分和第二工具部分。 第一和第二工具部分沿着施加轴线彼此间隔开地布置,使得板工件可以设置在它们之间。 该工具还包括由第一工具部分承载的两个或更多个处理装置以及由第二工具部分承载的一个或多个对置装置。 处理装置可相对于第一工具部分围绕垂直于施加轴线延伸的第一旋转轴线旋转,并且被布置成沿着垂直于施加轴线延伸的轴线彼此跟随。 处理装置和一个或多个对置装置可选择性地对准以形成用于在其间处理板工件的多个备选装置配对。
    • 48. 发明申请
    • Moving Workpiece Parts on Machine Tools
    • 在机床上移动工件
    • US20130319194A1
    • 2013-12-05
    • US13903204
    • 2013-05-28
    • TRUMPF Werkzeugmaschinen GmbH + Co. KG
    • Tobias ReiterWolfgang LaibStefan Buettner
    • B21D45/00B21D45/08
    • B21D45/006B21D28/265B21D45/08B21D45/10Y10T83/0448Y10T83/2137
    • Machine tools for processing plate-like workpieces by punching include a punching tool including a punch and a punching die, a drive unit for moving the punch and the punching die relative to each other along a stroke axis for cutting a workpiece part free from a plate-like workpiece, a hold-down device that is movable along the stroke axis and that includes a stripper that contacts an upper surface of the plate-like workpiece while the plate-like workpiece is punched through by the punch, a detection device for detecting a reference position of the hold-down device along the stroke axis, wherein the stripper contacts the upper surface of the workpiece at the reference position, and a numerical control unit for positioning the stripper at a particular distance from the reference position such that a workpiece part that has been cut off can be moved away from a processing region.
    • 用于通过冲压加工板状工件的机床包括冲压工具,其包括冲头和冲压模具,用于沿冲程轴线相对于冲头移动冲头和冲压模具的驱动单元,用于切割没有板的工件部件 压板装置,其能够沿行程轴线移动,并且包括在通过冲头冲压板状工件时与板状工件的上表面接触的剥离器;检测装置, 所述压紧装置沿着行程轴线的基准位置,其中所述汽提器在所述基准位置处接触所述工件的上表面;以及数字控制单元,用于将所述汽提器定位在与所述基准位置相距特定距离处,使得工件 被切断的部分可以从处理区域移开。
    • 50. 发明授权
    • Device for analyzing a beam profile of a laser beam
    • 用于分析激光束的光束轮廓的装置
    • US08480300B2
    • 2013-07-09
    • US12917643
    • 2010-11-02
    • Wolfgang Scholich-TessmannMarcelo Cabaleiro Martins
    • Wolfgang Scholich-TessmannMarcelo Cabaleiro Martins
    • G01K7/00G01K3/00G01J5/00
    • G01J1/4257B23K26/705
    • A device for analyzing a beam profile of a laser beam includes a carrier plate, a plurality of first temperature-sensitive measuring elements, in particular diodes, which are arranged in a preferably matrix-like arrangement on a first side of the carrier plate at a plurality of measuring locations, and a plurality of second temperature-sensitive measuring elements, in particular diodes, which are arranged in another preferably matrix-like arrangement on a second side of the carrier plate. One of the first measuring elements is arranged in each case opposite one of the second measuring elements and is thermally coupled to the first measuring element using strip conductors which extend through the carrier plate. Such a device can be included in a laser processing machine and used in an associated method for analyzing a beam profile of a laser beam.
    • 用于分析激光束的光束轮廓的装置包括载体板,多个第一温度敏感测量元件,特别是二极管,其以优选矩阵状布置在载体板的第一侧上, 多个测量位置,以及多个第二温度敏感测量元件,特别是二极管,它们被布置在载体板的第二侧上的另一优选矩阵状布置中。 第一测量元件中的一个被布置在与第二测量元件中的一个相对的每一种情况下,并且使用延伸穿过载板的带状导体热耦合到第一测量元件。 这种装置可以包括在激光加工机中并用于分析激光束的光束轮廓的相关方法中。