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    • 42. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08159884B2
    • 2012-04-17
    • US12884878
    • 2010-09-17
    • Yasuhiko Honda
    • Yasuhiko Honda
    • G11C7/12
    • G11C16/3418G11C16/26
    • According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell transistor, a word line, a row decoder, a sense amplifier which determines the data in the memory cell transistor via the bit line, a first bit line clamp transistor connected in series between the bit line and the sense amplifier, a second bit line clamp transistor connected in parallel to the first bit line clamp transistor and having a current driving capability higher than that of the first bit line clamp transistor, and a bit line control circuit which turns on the first bit line clamp transistor and the second bit line clamp transistor using a common gate voltage during a predetermined period from a start of charge of the bit line, and turns off only the second bit line clamp transistor when the predetermined period has elapsed.
    • 根据一个实施例,非易失性半导体存储器件包括存储单元晶体管,字线,行解码器,通过位线确定存储单元晶体管中的数据的读出放大器,串联连接的第一位线钳位晶体管 在位线和读出放大器之间,与第一位线钳位晶体管并联连接的第二位线钳位晶体管,其电流驱动能力高于第一位线钳位晶体管的电流驱动能力,以及位线控制电路, 在第一位线钳位晶体管和第二位线钳位晶体管之间,在从位线开始充电的预定时间期间使用公共栅极电压,并且当经过预定周期时,仅关断第二位线钳位晶体管。
    • 44. 发明授权
    • Semiconductor device and method of controlling the same
    • 半导体装置及其控制方法
    • US07859915B2
    • 2010-12-28
    • US11770381
    • 2007-06-28
    • Yasuhiko Honda
    • Yasuhiko Honda
    • G11C7/10
    • H01L27/115G11C29/20
    • A semiconductor device comprises a board, a first semiconductor storage device placed on the board, and a second semiconductor storage device placed on the board. Each of the first and second semiconductor storage devices has a first pad for inputting a chip enable signal, a second pad for inputting a write enable signal, a third pad for inputting an output enable signal, a fourth pad for inputting an address signal, and a fifth pad for inputting data. The first semiconductor storage device has a sixth pad which is electrically connected to the first pad of the second semiconductor device, and the second semiconductor storage device has a seventh pad which is electrically connected to the first pad of the first semiconductor device.
    • 一种半导体器件包括一个板,一个位于该板上的第一个半导体存储器件,以及一个位于该板上的第二个半导体存储器件。 第一和第二半导体存储装置中的每一个具有用于输入芯片使能信号的第一焊盘,用于输入写使能信号的第二焊盘,用于输入输出使能信号的第三焊盘,用于输入地址信号的第四焊盘,以及 用于输入数据的第五个垫。 第一半导体存储装置具有电连接到第二半导体器件的第一焊盘的第六焊盘,并且第二半导体存储器件具有电连接到第一半导体器件的第一焊盘的第七焊盘。
    • 45. 发明申请
    • VOLTAGE GENERATING CIRCUIT
    • 电压发生电路
    • US20090115500A1
    • 2009-05-07
    • US12260366
    • 2008-10-29
    • Masaaki KuwagataYasuhiko HondaYoshihiko Kamata
    • Masaaki KuwagataYasuhiko HondaYoshihiko Kamata
    • G05F1/10
    • G11C16/30G11C5/143G11C5/145H02M3/073H02M2001/0025H02M2001/0032Y02B70/16
    • A voltage generating circuit for outputting a voltage from an output terminal, has a first voltage dividing circuit which is connected between the output terminal and ground; a switch circuit connected between the output terminal and the first voltage dividing circuit; a first voltage detecting circuit which outputs a first pumping signal corresponding to a comparison result; a second voltage dividing circuit which is connected between the output terminal and the ground; a second voltage detecting circuit which outputs a second pumping signal corresponding to a comparison result; a pump circuit that outputs a voltage boosted from a power supply voltage; and a boost circuit which has a capacitive element having one end connected to the voltage dividing resistor of the first voltage dividing circuit.
    • 用于从输出端子输出电压的电压产生电路具有连接在输出端子与地之间的第一分压电路; 连接在输出端和第一分压电路之间的开关电路; 第一电压检测电路,输出与比较结果对应的第一泵浦信号; 连接在输出端子和地之间的第二分压电路; 第二电压检测电路,其输出与比较结果相对应的第二泵浦信号; 输出从电源电压提升的电压的泵电路; 以及升压电路,其具有一端与第一分压电路的分压电阻连接的电容元件。
    • 48. 发明授权
    • Multi-chip package
    • 多芯片封装
    • US07362587B2
    • 2008-04-22
    • US11677351
    • 2007-02-21
    • Yasuhiko Honda
    • Yasuhiko Honda
    • H05K7/02H05K7/06H05K7/08H05K7/10
    • G11C7/1051G11C7/1057G11C7/1066H01L25/18H01L2924/0002H01L2924/00
    • A multi-chip package includes a first semiconductor memory controlled by a clock signal and an inverted clock signal, and a second semiconductor memory controlled by the clock signal. The first semiconductor memory and the second semiconductor memory each include a circuit for guaranteeing that a signal delay is suppressed between a peripheral circuit, and a pad to which the clock signal is input, a pad to which the inverted clock signal is input, a pad for outputting a data enable signal and a pad for outputting a data signal. Thus, it is guaranteed that the signal delay is suppressed, and the reliability of the multi-chip package is improved.
    • 多芯片封装包括由时钟信号和反相时钟信号控制的第一半导体存储器和由时钟信号控制的第二半导体存储器。 第一半导体存储器和第二半导体存储器各自包括用于保证在外围电路和输入时钟信号的焊盘之间抑制信号延迟的电路,输入反相时钟信号的焊盘,焊盘 用于输出数据使能信号和用于输出数据信号的焊盘。 因此,可以保证信号延迟得到抑制,提高了多芯片封装的可靠性。
    • 49. 发明授权
    • Semiconductor storage apparatus
    • 半导体存储装置
    • US07088631B2
    • 2006-08-08
    • US11019271
    • 2004-12-23
    • Yasuhiko Honda
    • Yasuhiko Honda
    • G11C7/02
    • G11C7/062G11C7/02G11C7/12G11C16/24
    • A semiconductor storage apparatus includes a cell array including memory cells and reference cells, normal column selection transistors connected to columns of the memory cells, a normal data line array including normal data lines connected to columns of the memory cells, first dummy data lines formed of a same wiring layer of which the normal data lines are formed, a normal data line charging circuit, reference column selection transistors connected to reference columns of the reference cells, a reference data line array including reference data lines formed of a same wiring layer of which the normal data lines are formed, second dummy data lines formed of a same wiring layer of which the reference data lines are formed, a reference data line charging circuit, a first dummy data line charging circuit, a second dummy data line charging circuit, and a sense amplifier which senses data stored in the memory cells.
    • 一种半导体存储装置,包括:包括存储单元和参考单元的单元阵列,连接到存储单元的列的正常列选择晶体管,包括连接到存储单元的列的正常数据线的正常数据线阵列,由 形成正常数据线的相同布线层,正常数据线充电电路,连接到参考单元的参考列的参考列选择晶体管,包括由相同布线层形成的参考数据线的参考数据线阵列 形成正常的数据线,由形成基准数据线的相同布线层形成的第二虚拟数据线,参考数据线充电电路,第一虚拟数据线充电电路,第二虚拟数据线充电电路和 感测放大器,其感测存储在存储单元中的数据。