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    • 50. 发明申请
    • Elastic wave device and manufacturing method of the same
    • 弹性波装置及其制造方法相同
    • US20080018414A1
    • 2008-01-24
    • US11730961
    • 2007-04-05
    • Kazunori InoueTakashi MatsudaShogo InoueXiaoyu MiJyouji Kimura
    • Kazunori InoueTakashi MatsudaShogo InoueXiaoyu MiJyouji Kimura
    • H03H9/72
    • H03H9/72H03H3/08H03H9/0576H03H2250/00
    • An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.
    • 公开了一种通过在其间填充树脂来粘合至少两个表面声波装置而形成的弹性波装置。 每个表面声波(SAW)器件包括衬底; 配置在所述基板上的功能部; 形成操作功能部分所需的空间部分的凹部和覆盖基板表面的封装以及至少两个SAW器件的封装的侧面,对应于通过填充树脂粘合的部分 在至少两个SAW器件之间,包括至少一个切口,并且第一树脂覆盖所述至少两个SAW器件的基板的每个侧面,背面和前表面的一部分,并且第一树脂 树脂填充在包装的侧面上的至少一个切口中。