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41. 发明授权

US07074632B2 Miniature optical element for wireless bonding in an electronic instrument 有权
公开(公告)号：US07074632B2
公开(公告)日：2006-07-11
申请号：US10759266
申请日：2004-01-20
申请人： Kenji Wada
发明人： Kenji Wada
IPC分类号： H01L21/00
CPC分类号： H01L27/14683 , H01L21/76898 , H01L23/481 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L27/1462 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L31/18 , H01L33/382 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00015 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/16195 , H01L2924/3025 , H01L2933/0016 , Y10S257/911 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.

42. 发明申请

US20060040208A1 Chemical amplification resist composition and pattern-forming method using the same 失效
标题翻译：化学放大抗蚀剂组合物和使用其的图案形成方法
公开(公告)号：US20060040208A1
公开(公告)日：2006-02-23
申请号：US11206220
申请日：2005-08-18
申请人： Shinji Tarutani , Hyou Takahashi , Kenji Wada
发明人： Shinji Tarutani , Hyou Takahashi , Kenji Wada
IPC分类号： G03C1/76
CPC分类号： G03F7/0045 , G03F7/0046 , G03F7/0392
摘要： A chemical amplification resist composition comprising (A) a resin increasing the solubility in an alkali developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, (C) a compound having a fluorine atom and a hydroxyl group, and a pKa value of from 4 to 15, and (D) a solvent, and a pattern-forming method using the same.
摘要翻译：一种化学放大抗蚀剂组合物，其包含（A）通过酸的作用增加在碱性显影剂中的溶解度的树脂，（B）在用光化射线或辐射照射时能够产生酸的化合物，（C）具有氟原子和羟基，pKa值为4〜15，和（D）溶剂，以及使用其的图案形成方法。

43. 发明申请

US20050272244A1 Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus 审中-公开
标题翻译：电路元件的制造方法，电子元件的制造方法，电路基板，电子器件以及电光学装置
公开(公告)号：US20050272244A1
公开(公告)日：2005-12-08
申请号：US11113097
申请日：2005-04-25
申请人： Kenji Wada
发明人： Kenji Wada
IPC分类号： H01L21/288 , B41J2/01 , H01L21/20 , H01L21/3205 , H01L21/44 , H01L21/56 , H01L21/60 , H01L23/485 , H01L23/52
CPC分类号： H01L24/03 , H01L21/288 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/03505 , H01L2224/0401 , H01L2224/1147 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/81801 , H01L2224/94 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/14 , H01L2924/3025 , H01L2224/11 , H01L2924/00
摘要： The present invention aims to provide a mounting technology that prevents unnecessary consumption of materials. A method for manufacturing a circuit element includes the steps of: setting a semiconductor element on a stage so that a metal pad of the semiconductor element faces a head; changing positions of the head relative to the semiconductor element; dispensing a liquid conductive material from a nozzle so that the conductive material is coated on the metal pad when the nozzle reaches a position corresponding to the metal pad; and either activating or drying the coated conductive material in order to obtain a UBM layer on the metal pad.
摘要翻译：本发明旨在提供一种防止不必要的材料消耗的安装技术。一种制造电路元件的方法包括以下步骤：将半导体元件设置在台上，使得半导体元件的金属焊盘面向头部; 改变头部相对于半导体元件的位置; 从喷嘴分配液体导电材料，使得当喷嘴到达对应于金属垫的位置时，导电材料被涂覆在金属垫上; 并且激活或干燥涂覆的导电材料以便在金属垫上获得UBM层。

44. 发明申请

US20050139148A1 Silicon purifying method, slag for purifying silicon and purified silicon 审中-公开
标题翻译：硅精制方法，用于纯化硅和纯化硅的炉渣
公开(公告)号：US20050139148A1
公开(公告)日：2005-06-30
申请号：US10503304
申请日：2003-02-03
申请人： Hiroyasu Fujiwara , Ryotatsu Otsuka , Kenji Wada , Toshiaki Fukuyama
发明人： Hiroyasu Fujiwara , Ryotatsu Otsuka , Kenji Wada , Toshiaki Fukuyama
IPC分类号： C01B33/037 , C30B15/00 , C30B21/06 , C30B27/02 , C30B28/10 , C30B30/04
CPC分类号： C01B33/037
摘要： Method capable of preparing silicon having purity of about 6N applied to a solar cell efficiently at a low cost. Raw silicon containing boron and a slag are melted and a shaft is rotated by a rotating/driving mechanism for stirring the molten silicon. The molten slag is dispersed in the molten silicon, thereby accelerating the boron removal reaction. It is further effective to use a slag containing at least 45 percent by mass of silicon oxide or to blow gas mixed with water vapor into the molten silicon for refining reaction.
摘要翻译：能够以低成本高效率地制造纯度约为6N的硅的方法。含有硼和渣的原料硅熔化，并通过用于搅拌熔融硅的旋转/驱动机构旋转轴。熔融渣分散在熔融硅中，从而加速脱硼反应。使用含有至少45质量％的氧化硅的炉渣或者将与水蒸气混合的气体吹入熔融硅中以进行精制反应是进一步有效的。

45. 发明授权

US06750394B2 Thin-film solar cell and its manufacturing method 失效
标题翻译：薄膜太阳能电池及其制造方法
公开(公告)号：US06750394B2
公开(公告)日：2004-06-15
申请号：US10041681
申请日：2002-01-10
申请人： Hiroshi Yamamoto , Kenji Wada
发明人： Hiroshi Yamamoto , Kenji Wada
IPC分类号： H01L31075
CPC分类号： H01L31/075 , H01L31/022466 , H01L31/022483 , H01L31/02363 , H01L31/02366 , H01L31/028 , H01L31/03685 , H01L31/03762 , H01L31/0547 , H01L31/0747 , Y02E10/52 , Y02E10/545 , Y02E10/547 , Y02E10/548
摘要： A thin-film solar cell comprises a set of a transparent conductive layer and a photoelectric conversion layer laminated in this order on a substrate, wherein the photoelectric conversion layer is made of a p-i-n junction, the i-layer is made of a crystalline layer and the transparent conductive layer is provided with a plurality of holes at its surface of the side of the photoelectric conversion layer, each of said holes having irregularities formed on its surface.
摘要翻译：薄膜太阳能电池包括在基板上依次层叠的一组透明导电层和光电转换层，其中光电转换层由pin结形成，i层由结晶层制成，透明导电层在其光电转换层的一侧的表面设置有多个孔，每个所述孔在其表面上形成有凹凸。

46. 发明授权

US06720661B2 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument 有权
公开(公告)号：US06720661B2
公开(公告)日：2004-04-13
申请号：US09870710
申请日：2001-06-01
申请人： Terunao Hanaoka , Kenji Wada
发明人： Terunao Hanaoka , Kenji Wada
IPC分类号： H01L2348
CPC分类号： H01L24/13 , H01L21/76898 , H01L23/3107 , H01L23/481 , H01L24/11 , H01L24/16 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/1319 , H01L2224/16237 , H01L2225/06513 , H01L2225/06541 , H01L2225/06586 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/013
摘要： A method of fabricating a semiconductor device including: a first step of forming a through hole in a semiconductor element having electrodes on a first surface; and a second step of forming a conductive layer which is electrically connected to the electrodes and is provided from the first surface through an inner wall of the through hole to a second surface of the semiconductor element which is opposite to the first surface. The conductive layer is formed to have connecting portions on the first and second surfaces so that a distance between at least two electrodes among the electrodes is different from a distance between the connecting portions on at least one of the first and second surfaces, in the second step.

47. 发明授权

US06521826B2 Thin film solar cell and fabrication method therefor 失效
标题翻译：薄膜太阳能电池及其制造方法
公开(公告)号：US06521826B2
公开(公告)日：2003-02-18
申请号：US09723277
申请日：2000-11-29
申请人： Kenji Wada
发明人： Kenji Wada
IPC分类号： H01L31036
CPC分类号： H01L31/182 , H01L31/075 , H01L31/1824 , Y02E10/545 , Y02E10/546 , Y02E10/548 , Y02P70/521
摘要： An n-type polysilicon thin film, an intrinsic polysilicon thin film and a p-type polysilicon thin film are formed on a transparent conductive film of a glass substrate by the plasma enhanced CVD method at a plasma excitation frequency of 81.36 MHz so as to obtain a photoelectric conversion layer. The n-type polysilicon thin film and the intrinsic polysilicon thin film are then formed so that the crystallization ratio of the n-doped layer located on the incident light side becomes equal to or greater than the crystallization ratio of the intrinsic layer. Thus, a thin film solar cell having an appropriate structure of a junction interface between the n-layer and the intrinsic layer is obtained.
摘要翻译：在81.36MHz的等离子体激发频率下，通过等离子体增强CVD法在玻璃基板的透明导电膜上形成n型多晶硅薄膜，本征多晶硅薄膜和p型多晶硅薄膜，以获得光电转换层。然后形成n型多晶硅薄膜和本征多晶硅薄膜，使得位于入射光侧的n掺杂层的结晶比变得等于或大于本征层的结晶比。因此，获得具有n层和本征层之间的结界面的适当结构的薄膜太阳能电池。

48. 发明授权

US08507174B2 Positive resist composition, pattern forming method using the composition, and compound for use in the composition 有权
标题翻译：正性抗蚀剂组合物，使用该组合物的图案形成方法和用于该组合物的化合物
公开(公告)号：US08507174B2
公开(公告)日：2013-08-13
申请号：US12673096
申请日：2008-08-11
申请人： Hidenori Takahashi , Kenji Wada , Sou Kamimura
发明人： Hidenori Takahashi , Kenji Wada , Sou Kamimura
IPC分类号： G03F7/039 , G03F7/20 , G03F7/30
CPC分类号： C07C309/72 , C07C69/716 , C07C309/65 , C07C309/74 , C07C311/48 , C07C317/44 , C07C317/46 , C07C323/20 , C07C2601/14 , C07C2602/08 , C07C2602/10 , C07C2602/42 , G03F7/0045 , G03F7/0392 , G03F7/0397 , G03F7/2041
摘要： A positive resist composition comprising (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (B) a resin capable of increasing the solubility in an alkali developer by the action of an acid, and (C) a compound having a specific structure, which decomposes by the action of an acid to generate an acid, a pattern forming method using the positive resist composition, and a compound for use in the positive resist composition are provided as a positive resist composition exhibiting good performance in terms of pattern profile, line edge roughness, pattern collapse, sensitivity and resolution in normal exposure (dry exposure), immersion exposure and double exposure, a pattern forming method using the positive resist composition and a compound for use in the positive resist composition.
摘要翻译：一种正型抗蚀剂组合物，其包含（A）在通过光化射线或辐射照射时能够产生酸的化合物，（B）能够通过酸的作用增加在碱性显影剂中的溶解度的树脂，和（C）提供具有特定结构的化合物，其通过酸的作用而分解以产生酸，使用正性抗蚀剂组合物的图案形成方法和用于正性抗蚀剂组合物的化合物作为正性抗蚀剂组合物，其表现出良好的性能使用正性抗蚀剂组合物的图案形成方法和用于正性抗蚀剂组合物的化合物的图案形成方法，线条粗糙度，图案塌陷，在正常曝光（干曝光）中的灵敏度和分辨率，浸渍曝光和双重曝光。

49. 发明授权

US08426101B2 Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition 有权
标题翻译：感光组合物，使用光敏组合物中的光敏组合物和化合物的图案形成方法
公开(公告)号：US08426101B2
公开(公告)日：2013-04-23
申请号：US11642540
申请日：2006-12-21
申请人： Kenji Wada , Hiromi Kanda
发明人： Kenji Wada , Hiromi Kanda
IPC分类号： G03C1/00 , G03F7/00 , C07C315/00 , C07C309/00
CPC分类号： G03F7/0045 , G03F7/0046 , G03F7/0392 , G03F7/0397 , G03F7/2041
摘要： A photosensitive composition containing a compound having a specific structure as described in the specification, a pattern-forming method using the photosensitive composition and the compound having a specific structure used in the photosensitive composition.
摘要翻译：含有本说明书中记载的具有特定结构的化合物的感光性组合物，使用感光性组合物的图案形成方法和在感光性组合物中使用的具有特定结构的化合物。

50. 发明授权

US07879633B2 Miniature optical element for wireless bonding in an electronic instrument 有权
标题翻译：微型光学元件，用于电子仪器中的无线键合
公开(公告)号：US07879633B2
公开(公告)日：2011-02-01
申请号：US12453301
申请日：2009-05-06
申请人： Kenji Wada
发明人： Kenji Wada
IPC分类号： H01L21/00
CPC分类号： H01L27/14683 , H01L21/76898 , H01L23/481 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L27/1462 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L31/18 , H01L33/382 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00015 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/16195 , H01L2924/3025 , H01L2933/0016 , Y10S257/911 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
摘要翻译：一种制造光学元件的方法，包括以下步骤：在具有光学部分和电连接到光学部分的电极的半导体元件中形成通孔; 以及形成从其上形成有所述光学部分的所述半导体元件的第一表面延伸穿过所述通孔的内壁表面到与所述第一表面相对的第二表面的导电层。

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