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    • 42. 发明授权
    • Dual port memory cell with reduced coupling capacitance and small cell size
    • 具有减小的耦合电容和小单元尺寸的双端口存储单元
    • US07286438B2
    • 2007-10-23
    • US11403370
    • 2006-04-12
    • Chuen-Der LienPao-Lu Louis Huang
    • Chuen-Der LienPao-Lu Louis Huang
    • G11C8/00
    • G11C8/16G11C5/063G11C7/02G11C7/1075G11C7/18
    • A dual or multi port memory device including a first group of bit lines associated with the first port a second group of bit lines associated with the second port, wherein the bit lines are arranged in different metalization layers and separated horizontally to reduce one or both of stray and coupling capacitance associated with the bit lines. In one exemplary embodiment, the bit lines from each port that are in closer proximity to the bit lines of the other (or another) port are disposed in different metallization layers to reduce coupling capacitance therebetween. One or more further embodiments can include VSS or VDD line(s) located horizontally between the bit lines and metal to substrate contacts for the bit lines can be formed in opposite corners of the memory device to further reduce capacitance.
    • 一种双端口或多端口存储器件,包括与第一端口相关联的与第二端口相关联的第二组位线的第一组位线,其中位线布置在不同的金属化层中并且水平分开以减少一个或两个 与位线相关的杂散和耦合电容。 在一个示例性实施例中,来自更接近另一(或另一)端口的位线的每个端口的位线被布置在不同的金属化层中以减小它们之间的耦合电容。 一个或多个另外的实施例可以包括水平位于位线和用于位线的金属到衬底触点之间的V SS或V DD线,可以形成为相反的 存储器件的角落,以进一步降低电容。
    • 44. 发明申请
    • Dual port memory cell with reduced coupling capacitance and small cell size
    • 具有减小的耦合电容和小单元尺寸的双端口存储单元
    • US20060227649A1
    • 2006-10-12
    • US11403370
    • 2006-04-12
    • Chuen-Der LienPao-Lu Huang
    • Chuen-Der LienPao-Lu Huang
    • G11C8/00
    • G11C8/16G11C5/063G11C7/02G11C7/1075G11C7/18
    • A dual or multi port memory device including a first group of bit lines associated with the first port a second group of bit lines associated with the second port, wherein the bit lines are arranged in different metalization layers and separated horizontally to reduce one or both of stray and coupling capacitance associated with the bit lines. In one exemplary embodiment, the bit lines from each port that are in closer proximity to the bit lines of the other (or another) port are disposed in different metallization layers to reduce coupling capacitance therebetween. One or more further embodiments can include VSS or VDD line(s) located horizontally between the bit lines and metal to substrate contacts for the bit lines can be formed in opposite corners of the memory device to further reduce capacitance.
    • 一种双端口或多端口存储器件,包括与第一端口相关联的与第二端口相关联的第二组位线的第一组位线,其中位线布置在不同的金属化层中并且水平分开以减少一个或两个 与位线相关的杂散和耦合电容。 在一个示例性实施例中,来自更接近另一(或另一)端口的位线的每个端口的位线被布置在不同的金属化层中以减小它们之间的耦合电容。 一个或多个另外的实施例可以包括水平位于位线和用于位线的金属到衬底触点之间的V SS或V DD线,可以形成为相反的 存储器件的角落,以进一步降低电容。
    • 48. 发明授权
    • ESD protection for LDD devices
    • LDD器件的ESD保护
    • US06278162B1
    • 2001-08-21
    • US08342781
    • 1994-11-21
    • Chuen-Der LienPaul Y. M. Shy
    • Chuen-Der LienPaul Y. M. Shy
    • H01L2976
    • H01L29/66659H01L27/0266H01L29/1045H01L29/7835
    • A semiconductor integrated circuit suitable for use in an ESD protection circuit is disclosed. A substrate has an active region formed therein so as to define a P/N junction therebetween. An insulating region is formed near the surface of the substrate adjacent the active region thus defining an edge therewith. The active region includes a highly doped portion formed near the surface of the substrate and near the edge of the insulating region and a lightly doped portion formed below the highly doped portion and separated from the edge of the insulating portion. By moving the highly doped portion of the active region away from the insulating region, the P/N junction is effectively moved away from the insulating region.
    • 公开了一种适用于ESD保护电路的半导体集成电路。 衬底具有形成在其中的有源区,以便在它们之间限定P / N结。 绝缘区域形成在邻近有源区的衬底的表面附近,从而与其形成边缘。 有源区包括在衬底的表面附近形成并在绝缘区的边缘附近形成的高掺杂部分,以及形成在高掺杂部分下方并与绝缘部分的边缘分离的轻掺杂部分。 通过将有源区域的高掺杂部分移动离开绝缘区域,P / N结有效地远离绝缘区域移动。
    • 50. 发明授权
    • Testing method and apparatus for identifying disturbed cells within a memory cell array
    • 用于识别存储器单元阵列内的受干扰的单元的测试方法和装置
    • US06216239B1
    • 2001-04-10
    • US08931201
    • 1997-09-15
    • Chuen-Der Lien
    • Chuen-Der Lien
    • G11C2900
    • G11C29/24
    • A method and structure for identifying disturbed memory cells within a memory cell array are provided. A test circuit consists of several cells within the memory cell array, and are coupled to the cells in the memory cell array. The test cells are also coupled to a test cell word line. During a long-write test, all word lines within the memory cell array are first deselected. The test cell word line is then selected, which causes the test cells to provide a logic high or a logic low voltage to the bit lines within the memory cell array. The voltage provided to the bit lines can be used to write test data into the memory cells or to create a write-disturb mode. The test cells can be either memory cells similar to that used in the memory cell array, or a circuit that couples a voltage source to the bit lines when activated.
    • 提供了用于识别存储单元阵列内的受干扰的存储单元的方法和结构。 测试电路由存储单元阵列内的几个单元组成,并且耦合到存储单元阵列中的单元。 测试单元也耦合到测试单元字线。 在长写测试期间,首先取消选择存储单元阵列内的所有字线。 然后选择测试单元字线,这使得测试单元向存储单元阵列内的位线提供逻辑高电平或逻辑低电压。 提供给位线的电压可用于将测试数据写入存储单元或创建写入干扰模式。 测试单元可以是与存储单元阵列中使用的存储器单元相似的存储器单元,或者是当激活时将电压源耦合到位线的电路。