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41. 发明申请

US20060049499A1 Semiconductor device and its manufacturing method 失效
公开(公告)号：US20060049499A1
公开(公告)日：2006-03-09
申请号：US11260182
申请日：2005-10-28
申请人： Yoshinori Miyaki , Hiromichi Suzuki , Kazunari Suzuki , Takafumi Nishita , Fujio Ito , Kunihiro Tsubosaki , Akihiko Kameoka , Kunihiko Nishi
发明人： Yoshinori Miyaki , Hiromichi Suzuki , Kazunari Suzuki , Takafumi Nishita , Fujio Ito , Kunihiro Tsubosaki , Akihiko Kameoka , Kunihiko Nishi
IPC分类号： H01L23/02
CPC分类号： H01L24/27 , H01L21/56 , H01L23/3142 , H01L23/3171 , H01L23/3192 , H01L23/49503 , H01L23/49513 , H01L23/562 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/85 , H01L2224/02166 , H01L2224/274 , H01L2224/29007 , H01L2224/2919 , H01L2224/29339 , H01L2224/32014 , H01L2224/32055 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/743 , H01L2224/83192 , H01L2224/83855 , H01L2224/85 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12044 , H01L2924/1433 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/85399
摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.

42. 发明申请

US20060014321A1 Manufacturing method of semiconductor device and manufacturing method of lead frame 失效
标题翻译：半导体器件的制造方法及引线框架的制造方法
公开(公告)号：US20060014321A1
公开(公告)日：2006-01-19
申请号：US11181929
申请日：2005-07-15
申请人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Junpei Kusukawa , Yoshitaka Takezawa
发明人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Junpei Kusukawa , Yoshitaka Takezawa
IPC分类号： H01L21/50
CPC分类号： H01L21/56 , H01L21/4821 , H01L23/3107 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.
摘要翻译：旨在提高半导体器件的可靠性。通过加热引线框架，在用带子制备引线框架之后，直到进行树脂模制，在160-300℃（优选180-300℃）的温度下，总共超过2分钟具有氧的气氛，粘合剂树脂中的交联密度变高，低分子化合物挥发并跳出外部，因此，由于低分子化合物不会残留在粘合剂的树脂中，所以可以防止铜迁移的产生。

43. 发明申请

US20050230793A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20050230793A1
公开(公告)日：2005-10-20
申请号：US11106678
申请日：2005-04-15
申请人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Noriaki Sakamoto
发明人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Noriaki Sakamoto
IPC分类号： H01L21/60 , H01L21/48 , H01L21/607 , H01L23/495 , H01L23/50
CPC分类号： H01L24/85 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/06153 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/4912 , H01L2224/49171 , H01L2224/49175 , H01L2224/4943 , H01L2224/73265 , H01L2224/78743 , H01L2224/85148 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01055 , H01L2924/01079 , H01L2924/01082 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/19043 , H01L2924/3011 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device comprises a microcomputer chip, an SDRAM which is disposed alongside the microcomputer chip and is thinner than the microcomputer chip, a tub, a plurality of inner leads and outer leads, first wires that connect pads of the microcomputer chip and pads of the SDRAM, and second wires which connect the pads of the microcomputer chip and the inner leads and which are disposed so as to bridge over the SDRAM and are formed with loops at positions higher than loops of the first wires. An interface circuit for a memory bus is connected only between the chips, without connecting to external terminals, and is closed within a package. Therefore, pins can be utilized for other functions correspondingly and a multi-pin configuration can be achieved. Further, the cost of an SIP (semiconductor device) can be reduced owing to the adoption of a frame type.
摘要翻译：半导体器件包括微计算机芯片，与微计算机芯片一起设置并且比微计算机芯片薄的SDRAM，多个内引线和外引线，连接微计算机芯片的焊盘和第二引线的第一引线 SDRAM和第二线，其连接微型计算机芯片的焊盘和内部引线，并布置成跨越SDRAM并且在高于第一线的环的位置处形成有环。用于存储器总线的接口电路仅在芯片之间连接，而不连接到外部端子，并且在封装内封闭。因此，可以相应地使用引脚用于其他功能，并且可以实现多引脚配置。此外，由于采用帧类型，可以降低SIP（半导体器件）的成本。

44. 发明申请

US20050189627A1 Method of surface mounting a semiconductor device 审中-公开
标题翻译：表面安装半导体器件的方法
公开(公告)号：US20050189627A1
公开(公告)日：2005-09-01
申请号：US11065108
申请日：2005-02-25
申请人： Fujio Ito , Hiromichi Suzuki , Takashi Miwa , Tokuji Toida
发明人： Fujio Ito , Hiromichi Suzuki , Takashi Miwa , Tokuji Toida
IPC分类号： H01L21/48 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/31 , H01L23/495 , H01L23/50 , H05K1/18 , H05K3/34
CPC分类号： H01L23/3107 , H01L21/4825 , H01L21/565 , H01L23/49541 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H05K3/3426 , H05K3/3442 , H05K2201/09709 , H05K2201/10689 , H05K2201/10931 , H05K2201/10984 , Y02P70/613 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A surface mounting method for mounting semiconductor devices suppresses solder peeling defects which tried to occur during mounting. The method used for mounting semiconductor devices includes a process for preparing the semiconductor devices by obtaining multiple terminals by exposing a section of each of multiple leads protruding from a rear side of the plastic casing, and forming a layer of solder by solidifying a molten solder material; a process for supplying a solder paste material to multiple electrodes on a printed circuit board; and a process for melting the solder paste of the multiple electrodes and connecting each of the multiple terminals with the multiple electrodes.
摘要翻译：用于安装半导体器件的表面安装方法抑制了在安装期间发生的焊料剥离缺陷。用于安装半导体器件的方法包括通过从塑料外壳的后侧突出的多个引线的一部分暴露出多个端子来制备半导体器件的工艺，以及通过使熔融焊料材料固化形成一层焊料 ; 用于将焊膏材料供应到印刷电路板上的多个电极的工艺; 以及用于熔化多个电极的焊膏并将多个端子中的每一个与多个电极连接的工艺。

45. 发明申请

US20120318231A1 Engine Stopping And Restarting System 有权
标题翻译：发动机停止和重新启动系统
公开(公告)号：US20120318231A1
公开(公告)日：2012-12-20
申请号：US13162301
申请日：2011-06-16
申请人： Hiromichi Suzuki
发明人： Hiromichi Suzuki
IPC分类号： F02B67/04 , F16H57/08
CPC分类号： F16H55/36 , B60K6/00
摘要： A system that automatically stops an engine when the vehicle is stopped and restarts the engine in response to a predetermined condition is disclosed. The system may generally include an engine and a motor for restarting the engine and driving an auxiliary machine when the engine is stopped, and an electrical power source for supplying electrical power to the motor. The motor may be disposed within a crank pulley housing and configured to be connected to a crankshaft. The motor may restart the engine in response to a predetermined condition. The system may include a gear reduction system for amplifying the torque provided by the motor. The motor may drive an auxiliary machine when the engine is stopped. The engine may drive the auxiliary machine when the engine is operating in drive.
摘要翻译：公开了一种在车辆停止时自动停止发动机并且响应于预定条件重新启动发动机的系统。该系统通常可以包括用于在发动机停止时重新启动发动机和驱动辅助机器的发动机和马达，以及用于向马达供电的电源。电动机可以设置在曲柄皮带轮壳体内并且被配置为连接到曲轴。电机可以响应于预定条件重新启动发动机。该系统可以包括用于放大由电动机提供的扭矩的齿轮减速系统。发动机停止时，电机可能会驱动辅机。当发动机在驱动器中运行时，发动机可以驱动辅助机器。

46. 发明申请

US20120283532A1 BIOLOGICAL OPTICAL MEASUREMENT INSTRUMENT AND METHOD FOR DISPLAYING INFORMATION RELATING TO NECESSITY/UNNECESSITY OF REPLACEMENT OF LIGHT-EMITTING UNIT 审中-公开
标题翻译：生物光学测量仪器和显示与发光单元更换的必要性/不可靠性有关的信息的方法
公开(公告)号：US20120283532A1
公开(公告)日：2012-11-08
申请号：US13509698
申请日：2010-11-11
申请人： Hiromichi Suzuki
发明人： Hiromichi Suzuki
IPC分类号： A61B5/1455 , G08B21/18
CPC分类号： A61B5/1455 , A61B2560/0276
摘要： Disclosed is a biological optical measurement instrument provided with: a light source unit which has a light-emitting unit that emits light and irradiates the light to an object; a light measurement unit configured to measure passing light at a measurement point of the object: a signal processing unit configured to process hemoglobin information outputted from the light measurement unit and create a light measurement image; and a display unit configured to display the light measurement image, further provided with a measurement/determination unit configured to measure the deterioration state of the light-emitting unit from the light output of the light-emitting unit and an electric current injected into the light-emitting unit and determine the necessity/unnecessity of replacement of the light-emitting unit, wherein the display unit displays information relating to the necessity/unnecessity of replacing the light-emitting unit determined by the measurement/determination unit.
摘要翻译：本发明公开了一种生物光学测量仪器，其具备：光源单元，其具有发光并将光照射到物体的发光单元; 光测量单元，被配置为测量物体的测量点处的通过光;信号处理单元，被配置为处理从所述光测量单元输出的血红蛋白信息并创建光测量图像; 以及显示单元，被配置为显示所述光测量图像，还具有测量/确定单元，所述测量/确定单元被配置为从所述发光单元的光输出测量所述发光单元的劣化状态和注入到所述光中的电流确定更换发光单元的必要性/不必要性，其中显示单元显示与由测量/确定单元确定的发光单元的更换的必要性/不必要性有关的信息。

47. 发明申请

US20120175759A1 WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR SEMICONDUCTOR DEVICE, AND RESIN-SEALED SEMICONDUCTOR DEVICE 有权
标题翻译：用于半导体器件的接线装置，用于半导体器件的复合布线器件和树脂密封半导体器件
公开(公告)号：US20120175759A1
公开(公告)日：2012-07-12
申请号：US13403616
申请日：2012-02-23
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/495
CPC分类号： H01L23/485 , H01L23/36 , H01L23/4827 , H01L23/49503 , H01L23/49531 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/49883 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要翻译：本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。布线装置将半导体芯片上的电极与外部布线装置连接，并且具有绝缘层，金属基板和铜布线层。布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。铜布线层包括第一端子，第二端子和布线部分。第一端子与电极连接。第二端子与外部接线装置连接。布线部将第一端子与第二端子连接。

48. 发明申请

US20090189263A1 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device 有权
标题翻译：半导体装置用配线装置，半导体装置用复合布线装置以及树脂密封型半导体装置
公开(公告)号：US20090189263A1
公开(公告)日：2009-07-30
申请号：US12318955
申请日：2009-01-13
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/52 , H01L23/498
CPC分类号： H01L23/485 , H01L23/36 , H01L23/4827 , H01L23/49503 , H01L23/49531 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/49883 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要翻译：本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。布线装置将设置在半导体芯片上的电极与外部布线装置电连接，并且具有绝缘层，金属基板和铜布线层。金属基板设置在绝缘层的一侧。铜布线层设置在绝缘层的另一侧。布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。铜布线层包括第一端子，第二端子和布线部分。第一端子与设置在半导体芯片上的电极连接。第二端子与外部接线装置连接。布线部将第一端子与第二端子连接。

49. 发明申请

US20090176333A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20090176333A1
公开(公告)日：2009-07-09
申请号：US12400892
申请日：2009-03-10
申请人： Yoshihisa MATSUBARA , Hiromichi Suzuki , Wahei Kitamura , Kosho Akiyama , Seiji Kato
发明人： Yoshihisa MATSUBARA , Hiromichi Suzuki , Wahei Kitamura , Kosho Akiyama , Seiji Kato
IPC分类号： H01L21/78 , H01L21/60
CPC分类号： H01L21/67333 , H01L2924/0002 , H01L2924/00
摘要： To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor chips on a main surface thereof are stacked in a plurality of stages, the semiconductor chips are accommodated in spaces defined by the accommodating portions formed over the main surface of the lower-stage tray and corresponding accommodating portions formed over the back surface of the upper-stage tray. Here, on bottom surfaces of the accommodating portions formed over the back surface of the upper-stage tray, isolated projections having a height which prevents the projections from coming into contact with the semiconductor chips are arranged in a scattered manner. In this way, it is possible to prevent the semiconductor chips from adhering to the back surface of the upper-stage tray.
摘要翻译：为了防止半导体芯片在运输期间粘附到托盘，采用以下状态传输半导体芯片的方法。当具有多个具有用于在其主表面上容纳半导体芯片的凹入截面的容纳部分的托盘被堆叠成多级时，半导体芯片被容纳在形成在主表面上的容纳部分所形成的空间中下级托盘和形成在上级托盘的后表面上的相应的容纳部分。这里，在形成在上层托盘的后表面上的容纳部分的底表面上，以散射方式布置具有防止突起与半导体芯片接触的高度的隔离突起。以这种方式，可以防止半导体芯片粘附到上层托盘的后表面。

50. 发明申请

US20090009401A1 Antenna device having no less than two antenna elements 失效
标题翻译：具有不少于两个天线元件的天线装置
公开(公告)号：US20090009401A1
公开(公告)日：2009-01-08
申请号：US11975332
申请日：2007-10-18
申请人： Hiromichi Suzuki , Satoshi Mizoguchi , Isao Ohba
发明人： Hiromichi Suzuki , Satoshi Mizoguchi , Isao Ohba
IPC分类号： H01Q9/04
CPC分类号： H01Q7/00 , H01Q1/242 , H01Q5/371 , H01Q5/40 , H01Q9/42 , H01Q21/28
摘要： An antenna device provided in a radio apparatus having a printed circuit board includes a first antenna element and a second antenna element. The first antenna element is configured to be fed and grounded at a first feed portion and at a first short-circuit portion both on the printed circuit board, respectively. The second antenna element is configured to be fed and grounded at a second feed portion and at a second short-circuit portion both on the printed circuit board, respectively. The second feed portion is located farther from the first feed portion than from the first short-circuit portion, farther than the first short-circuit portion is from the first feed portion, farther from the first short-circuit portion than from the second short-circuit portion, and farther than the second short-circuit portion is from the first short-circuit portion.
摘要翻译：设置在具有印刷电路板的无线电设备中的天线装置包括第一天线元件和第二天线元件。第一天线元件被配置为分别在印刷电路板上的第一馈电部分和第一短路部分馈电和接地。第二天线元件被配置为分别在印刷电路板上的第二馈电部分和第二短路部分馈电和接地。第二馈电部分比第一短路部分远离第一短路部分，远离第一短路部分比第一短路部分远离第一短路部分远离第一短路部分，电路部分，并且比第二短路部分更远离第一短路部分。

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