专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明授权

US07246435B2 Wiring board and method for fabricating the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US07246435B2
公开(公告)日：2007-07-24
申请号：US11138467
申请日：2005-05-27
申请人： Keishiro Okamoto , Tomoyuki Abe , Motoaki Tani , Nobuyuki Hayashi
发明人： Keishiro Okamoto , Tomoyuki Abe , Motoaki Tani , Nobuyuki Hayashi
IPC分类号： H01K3/10
CPC分类号： H05K3/445 , H05K1/056 , H05K3/426 , H05K2201/0179 , H05K2201/0195 , H05K2201/0323 , H05K2201/09581 , H05K2203/135 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.
摘要翻译：布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

42. 发明申请

US20070128825A1 Method for bonding substrates and device for bonding substrates 有权
标题翻译：接合基板的方法和用于接合基板的装置
公开(公告)号：US20070128825A1
公开(公告)日：2007-06-07
申请号：US11293663
申请日：2005-12-02
申请人： Tadatomo Suga , Mohammad Howlader , Tomoyuki Abe
发明人： Tadatomo Suga , Mohammad Howlader , Tomoyuki Abe
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L21/187 , H01L24/27 , H01L24/30 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01079 , H01L2924/09701
摘要： A method for bonding of substrates has a steps of irradiating surfaces of the substrates respectively in a vacuum with both an inert gas beam and a metal beam thereby forming island shaped thin metal films on the surfaces of the substrates, and surface-activated bonding of the substrates through the island shaped thin metal films by contacting the surfaces of the substrates each other.
摘要翻译：基板的接合方法具有分别在惰性气体束和金属梁两者的真空中照射基板的表面的步骤，从而在基板的表面上形成岛状薄金属膜，并且将表面激活的通过使基板的表面彼此接触而穿过岛状薄金属膜的基板。

43. 发明申请

US20070122235A1 Method for continuous on-site recycling of an asphalt mixture layer of a pavement and a motor-driven vehicle system therefor 有权
标题翻译：路面沥青混合料层及其电动车辆系统的连续现场回收方法
公开(公告)号：US20070122235A1
公开(公告)日：2007-05-31
申请号：US11698531
申请日：2007-01-26
申请人： Atsushi Kasahara , Shunsuke Ushio , Kojiro Ogata , Hiroshi Inamitsu , Fumio Goto , Tomoyuki Abe , Hiroaki Irie , Isami Fujii , Kazuo Onoda , Hideo Ikeda , Eisuke Nagai , Atsuki Gomi , Masaki Tsunabuchi
发明人： Atsushi Kasahara , Shunsuke Ushio , Kojiro Ogata , Hiroshi Inamitsu , Fumio Goto , Tomoyuki Abe , Hiroaki Irie , Isami Fujii , Kazuo Onoda , Hideo Ikeda , Eisuke Nagai , Atsuki Gomi , Masaki Tsunabuchi
IPC分类号： E01C7/32
CPC分类号： E01C23/065
摘要： A method for recycling in place an asphalt mixture layer of a paved road continuously, while moving a self-propelled vehicle system, which comprises a step of heating and softening the asphalt mixture layer, a step of scraping and breaking said hot and softened asphalt mixture layer and keeping the softened mixture at a temperature sufficient not to form an aggregate, to prepare an asphalt mixture having a single-grained structure, a sieving step of classifying said asphalt mixture having a single-grained structure into a plurality of grain size groups, a step of designing mix proportions for converting said asphalt mixture to a recycled asphalt mixture by the use of said plurality of grain size groups classified, a step of mixing uniformly said recycled asphalt mixtures having designed mix proportions, and a step of spreading and compacting said recycled asphalt mixtures having been mixed uniformly, to thereby form a recycled asphalt mixtures layer.
摘要翻译：一种用于在移动自行车辆系统的同时循环使用铺路的沥青混合物层的方法，其包括加热和软化沥青混合物层的步骤，刮削和破碎所述热和软化沥青混合物的步骤将软化混合物保持在足够不形成骨料的温度下，制备具有单一颗粒结构的沥青混合料，将具有单一颗粒结构的沥青混合料分级成多个粒度组的筛分步骤，设计混合比例的步骤，通过使用分级的所述多个粒度组将所述沥青混合物转化为再循环沥青混合物，将所述具有设计的混合比例的再循环沥青混合物均匀混合的步骤，以及将所述沥青混合物扩展和压实所述再循环沥青混合物已经均匀混合，从而形成再循环沥青混合物层。

44. 发明授权

US07224046B2 Multilayer wiring board incorporating carbon fibers and glass fibers 有权
标题翻译：包含碳纤维和玻璃纤维的多层布线板
公开(公告)号：US07224046B2
公开(公告)日：2007-05-29
申请号：US11141643
申请日：2005-06-01
申请人： Tomoyuki Abe , Nobuyuki Hayashi , Motoaki Tani
发明人： Tomoyuki Abe , Nobuyuki Hayashi , Motoaki Tani
IPC分类号： H01L23/48 , H05K3/40
CPC分类号： H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0366 , H05K1/056 , H05K1/09 , H05K3/429 , H05K3/4608 , H05K3/4641 , H05K3/4688 , H05K2201/0281 , H05K2201/0323 , H05K2201/0355 , H05K2201/09536 , H05K2203/1105 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49162 , Y10T428/24917 , H01L2924/00
摘要： A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).
摘要翻译：多层布线板（X 1）包括芯部（100）和外芯布线部（30）。芯部（100）包括由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10），以及具有层叠结构的芯内配线部（20）包含玻璃纤维材料（21a）的绝缘层（21）和由弹性模量为10〜40GPa的导体构成并与碳纤维增强部（10）接合的布线图案（22）。外芯接线部（30）具有至少一个绝缘层（31）和布线图案（32）的叠层结构，并且在芯部布线部（20）处与芯部（100）接合。

45. 发明授权

US07017265B2 Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby 有权
公开(公告)号：US07017265B2
公开(公告)日：2006-03-28
申请号：US10279980
申请日：2002-10-25
申请人： Motoaki Tani , Nobuyuki Hayashi , Tomoyuki Abe
发明人： Motoaki Tani , Nobuyuki Hayashi , Tomoyuki Abe
IPC分类号： H01K3/10
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/38 , H05K3/389 , H05K2201/0175 , H05K2203/0315 , H05K2203/066 , H05K2203/1152 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method is provided for manufacturing a multilayer wiring board wherein good adhesion is achieved between an insulating layer and a wiring pattern. The multilayer wiring board has a laminar structure which includes insulating layers and a wiring pattern. The method includes at least the steps of sticking a support whose surface has been treated with a coupling agent onto an insulating layer with a coupling agent interposed therebetween, and transferring the coupling agent to the insulating layer by removing the support while leaving the coupling agent on the insulating layer.

46. 发明申请

US20050218503A1 Multilayer wiring board, method for producing the same, and method for producing fiber reinforced resin board 有权
标题翻译：多层布线基板及其制造方法以及纤维增强树脂板的制造方法
公开(公告)号：US20050218503A1
公开(公告)日：2005-10-06
申请号：US11141643
申请日：2005-06-01
申请人： Tomoyuki Abe , Nobuyuki Hayashi , Motoaki Tani
发明人： Tomoyuki Abe , Nobuyuki Hayashi , Motoaki Tani
IPC分类号： A63H30/04 , H01L21/48 , H01L23/48 , H01L23/498 , H05K1/03 , H05K3/42 , H05K3/46
CPC分类号： H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0366 , H05K1/056 , H05K1/09 , H05K3/429 , H05K3/4608 , H05K3/4641 , H05K3/4688 , H05K2201/0281 , H05K2201/0323 , H05K2201/0355 , H05K2201/09536 , H05K2203/1105 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49162 , Y10T428/24917 , H01L2924/00
摘要： A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).
摘要翻译：多层布线板（X 1）包括芯部（100）和外芯布线部（30）。芯部（100）包括由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10），以及具有层叠结构的芯内配线部（20）包含玻璃纤维材料（21a）的绝缘层（21）和由弹性模量为10〜40GPa的导体构成并与碳纤维增强部（10）接合的布线图案（22）。外芯接线部（30）具有至少一个绝缘层（31）和布线图案（32）的叠层结构，并且在芯部布线部（20）处与芯部（100）接合。

47. 发明授权

US5976393A Method of manufacturing multilayer circuit substrate 失效
标题翻译：制造多层电路基板的方法
公开(公告)号：US5976393A
公开(公告)日：1999-11-02
申请号：US21953
申请日：1998-02-11
申请人： Tomoyuki Abe
发明人： Tomoyuki Abe
IPC分类号： H05K1/09 , B22F7/08 , H01L21/48 , H05K3/02 , H05K3/10 , H05K3/24 , H05K3/28 , H05K3/34 , H05K3/38 , H05K3/40 , H05K3/46 , B44C1/22
CPC分类号： H05K3/4617 , B22F7/08 , H01L21/4857 , H01L21/486 , H05K3/102 , H05K3/247 , H05K3/4069 , H05K3/4664 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H05K1/095 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2203/0191 , H05K2203/1131 , H05K2203/1327 , H05K3/28 , H05K3/3473 , H05K3/388 , H05K3/4038 , Y10T156/1057 , Y10T29/49155
摘要： A method of manufacturing a multilayer circuit substrate includes a process of forming via holes in an insulating film, a process of applying an electrically conducting paste obtained by having ultra-fine metal particles disperse in a solvent onto an insulating film, and a process of forming vias composed of a sintered product of ultra-fine metal particles in the via holes by removing the solvent and also sintering the ultra-fine metal particles. The sintered products of the ultra-fine metal particles on the insulating layer is removed (or patterned) by peeling off the protective film stuck to the insulating layer.
摘要翻译：一种制造多层电路基板的方法包括在绝缘膜中形成通孔的工艺，将通过将超细金属颗粒分散在溶剂中而获得的导电浆料涂敷到绝缘膜上的工艺和形成由通孔中的超细金属颗粒的烧结体构成的通孔，除去溶剂，并烧结超细金属粒子。通过剥离粘附到绝缘层上的保护膜，去除（或图案化）绝缘层上的超细金属颗粒的烧结产物。

48. 发明申请

US20110220396A1 WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：接线基板及其制造方法
公开(公告)号：US20110220396A1
公开(公告)日：2011-09-15
申请号：US13111257
申请日：2011-05-19
申请人： Tomoyuki Abe
发明人： Tomoyuki Abe
IPC分类号： H05K1/09 , H05K3/46 , B05D5/00 , B05D5/12 , B82Y30/00 , B82Y99/00
CPC分类号： H05K3/4641 , B82Y10/00 , H05K3/429 , H05K2201/026 , H05K2201/0323 , H05K2201/068
摘要： A wiring substrate includes a substrate containing a carbon material, a first insulating layer formed over the substrate, an interlayer formed over the first insulating layer, the interlayer including a metal plate having a smaller coefficient of thermal expansion than the first insulating layer while having a greater elastic modulus than the first insulating layer, and a second insulating layer formed over the interlayer.
摘要翻译：布线基板包括含有碳材料的基板，在基板上形成的第一绝缘层，在第一绝缘层上形成的中间层，所述中间层包括具有比第一绝缘层更小的热膨胀系数的金属板，同时具有比第一绝缘层更大的弹性模量，以及形成在中间层上的第二绝缘层。

49. 发明申请

US20110199251A1 RADIO WAVE SENSOR 审中-公开
标题翻译：无线电波传感器
公开(公告)号：US20110199251A1
公开(公告)日：2011-08-18
申请号：US13124354
申请日：2009-10-16
申请人： Kengo Iwata , Tomoyuki Abe
发明人： Kengo Iwata , Tomoyuki Abe
IPC分类号： G01S13/04
CPC分类号： H01Q23/00 , G01S7/032 , H01Q1/247 , H01Q9/0407
摘要： The object of the present invention is to provide a low power consumption, compact radio wave sensor capable of accurately detecting the presence and mobile status of a detected object present within a detection area, and having a superior S/N ratio. The radio wave sensor comprising: an oscillator circuit 1 for producing a high-frequency signal; a ground electrode 3 formed on one surface of a substrate 2 formed of a dielectric body or on approximately the entire surface of the interior thereof, acting as ground to a high-frequency signal; an antenna electrode 6 formed on the other surface of the substrate, for radiating a high-frequency signal as a radio beam and receiving a radio beam which collides with a detected object and is reflected back from the object; and a wave detecting element 7 for detecting a high-frequency signal received by the antenna electrode 6; wherein one of the terminals of the wave detecting element 7 is connected to the antenna electrode 6 via a frequency adjustment line 12 for adjusting the frequency of the antenna electrode 6, and the other terminal is connected to the ground electrode 3; and the frequency adjustment line 12 is connected to the antenna electrode 6 at a position different from that of an electrical feeding point (in Fig., a position of a conducting hole 13a) provided on the antenna electrode 6 to supply electricity to the antenna electrode 6 with the high-frequency signal produced by the oscillator circuit 1.
摘要翻译：本发明的目的是提供一种能够精确地检测存在于检测区域内的检测对象的存在和移动状态，并且具有优异的S / N比的低功耗小型无线电波传感器。该无线电波传感器包括：用于产生高频信号的振荡器电路1; 形成在由电介质体形成的基板2的一个表面上或其内部的大致整个表面上的作为高频信号接地的接地电极3; 形成在基板的另一个表面上的天线电极6，用于辐射作为无线电波束的高频信号，并接收与检测对象相撞并从物体反射的无线电波束; 以及用于检测由天线电极6接收的高频信号的波检测元件7; 其中，波长检测元件7的一个端子经由用于调整天线电极6的频率的频率调节线12连接到天线电极6，另一个端子连接到接地电极3; 并且频率调整线12与设置在天线电极6上的馈电点（图中为导电孔13a的位置）不同的位置处连接到天线电极6，以向天线电极供电 6具有由振荡器电路1产生的高频信号。

50. 发明授权

US07915541B2 Multilayer interconnection substrate and manufacturing method therefor 有权
标题翻译：多层互连基板及其制造方法
公开(公告)号：US07915541B2
公开(公告)日：2011-03-29
申请号：US12099450
申请日：2008-04-08
申请人： Masateru Koide , Tomoyuki Abe
发明人： Masateru Koide , Tomoyuki Abe
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： H05K3/4688 , H05K1/0306 , H05K1/0313 , H05K3/462 , H05K3/4641 , H05K2203/1189 , Y10T29/49126
摘要： According to an aspect of an embodiment, a multilayer interconnection substrate includes a resin substrate layer including a first insulating layer made of a resin, and a first interconnection layer made of a conductive material, a ceramic substrate layer including a second insulating layer made of a ceramic, and a second interconnection layer made of a conductive material, a mechanically bonding layer mechanically bonding the resin substrate layer and the ceramic substrate layer which are laminated, and an electrically bonding member penetrating the mechanically bonding layer and electrically bonding the resin substrate layer and the ceramic substrate layer.
摘要翻译：根据实施方案的一个方面，多层互连基板包括树脂基板层，该树脂基板层包括由树脂制成的第一绝缘层和由导电材料制成的第一互连层，陶瓷基板层包括第二绝缘层陶瓷和由导电材料制成的第二互连层，机械粘合层机械粘合树脂基板层和陶瓷基板层;以及电接合构件，其穿透机械接合层并电连接树脂基板层和陶瓷基板层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式