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1. 发明申请

US20110199251A1 RADIO WAVE SENSOR 审中-公开
标题翻译：无线电波传感器
公开(公告)号：US20110199251A1
公开(公告)日：2011-08-18
申请号：US13124354
申请日：2009-10-16
申请人： Kengo Iwata , Tomoyuki Abe
发明人： Kengo Iwata , Tomoyuki Abe
IPC分类号： G01S13/04
CPC分类号： H01Q23/00 , G01S7/032 , H01Q1/247 , H01Q9/0407
摘要： The object of the present invention is to provide a low power consumption, compact radio wave sensor capable of accurately detecting the presence and mobile status of a detected object present within a detection area, and having a superior S/N ratio. The radio wave sensor comprising: an oscillator circuit 1 for producing a high-frequency signal; a ground electrode 3 formed on one surface of a substrate 2 formed of a dielectric body or on approximately the entire surface of the interior thereof, acting as ground to a high-frequency signal; an antenna electrode 6 formed on the other surface of the substrate, for radiating a high-frequency signal as a radio beam and receiving a radio beam which collides with a detected object and is reflected back from the object; and a wave detecting element 7 for detecting a high-frequency signal received by the antenna electrode 6; wherein one of the terminals of the wave detecting element 7 is connected to the antenna electrode 6 via a frequency adjustment line 12 for adjusting the frequency of the antenna electrode 6, and the other terminal is connected to the ground electrode 3; and the frequency adjustment line 12 is connected to the antenna electrode 6 at a position different from that of an electrical feeding point (in Fig., a position of a conducting hole 13a) provided on the antenna electrode 6 to supply electricity to the antenna electrode 6 with the high-frequency signal produced by the oscillator circuit 1.
摘要翻译：本发明的目的是提供一种能够精确地检测存在于检测区域内的检测对象的存在和移动状态，并且具有优异的S / N比的低功耗小型无线电波传感器。该无线电波传感器包括：用于产生高频信号的振荡器电路1; 形成在由电介质体形成的基板2的一个表面上或其内部的大致整个表面上的作为高频信号接地的接地电极3; 形成在基板的另一个表面上的天线电极6，用于辐射作为无线电波束的高频信号，并接收与检测对象相撞并从物体反射的无线电波束; 以及用于检测由天线电极6接收的高频信号的波检测元件7; 其中，波长检测元件7的一个端子经由用于调整天线电极6的频率的频率调节线12连接到天线电极6，另一个端子连接到接地电极3; 并且频率调整线12与设置在天线电极6上的馈电点（图中为导电孔13a的位置）不同的位置处连接到天线电极6，以向天线电极供电 6具有由振荡器电路1产生的高频信号。

2. 发明授权

US07773035B2 Microstrip antenna and high frequency sensor using microstrip antenna 失效
标题翻译：微带天线和使用微带天线的高频传感器
公开(公告)号：US07773035B2
公开(公告)日：2010-08-10
申请号：US11664292
申请日：2005-09-29
申请人： Kensuke Murata , Hiroshi Tsuboi , Kengo Iwata , Tomoyuki Abe
发明人： Kensuke Murata , Hiroshi Tsuboi , Kengo Iwata , Tomoyuki Abe
IPC分类号： H01Q1/38
CPC分类号： H01Q3/24 , H01Q9/0407 , H01Q9/0442 , H01Q19/005 , H01Q19/28
摘要： A microstrip antenna has feed element 102 and parasitic elements 104, 106 on the front surface of substrate 1. Microwave electrical power is applied to feed element 102. Parasitic elements 104, 106 are connected via through hole type leads passing through substrate 1, to switches upon the rear surface of substrate 1, respectively. By actuating the switches individually, parasitic elements 104, 106 are individually switched between a grounded state and a float state. The direction of the radio beam emitted from the microstrip antenna is varied by selecting which of parasitic elements 104, 106 is grounded and floated. A microwave signal source connects to feed element 102 via an feed line 108 very much shorter than the wavelength, accordingly the transmission losses being low and the efficiency being excellent.
摘要翻译：微带天线在基板1的前表面上具有馈电元件102和寄生元件104,106。微波电力被施加到馈电元件102.寄生元件104,106通过穿过衬底1的通孔型引线连接到开关分别在基板1的后表面上。通过单独地驱动开关，寄生元件104,106在接地状态和浮置状态之间单独切换。通过选择寄生元件104,106中的哪一个接地并漂浮来改变从微带天线发射的无线电波束的方向。微波信号源通过比波长短得多的馈线108连接到馈电元件102，因此传输损耗低，效率优异。

3. 发明申请

US20080088510A1 Microstrip Antenna And High Frequency Sensor Using Microstrip Antenna 失效
标题翻译：微带天线和使用微带天线的高频传感器
公开(公告)号：US20080088510A1
公开(公告)日：2008-04-17
申请号：US11664292
申请日：2005-09-29
申请人： Kensuke Murata , Hiroshi Tsuboi , Kengo Iwata , Tomoyuki Abe
发明人： Kensuke Murata , Hiroshi Tsuboi , Kengo Iwata , Tomoyuki Abe
IPC分类号： H01Q3/00 , H01Q9/04
CPC分类号： H01Q3/24 , H01Q9/0407 , H01Q9/0442 , H01Q19/005 , H01Q19/28
摘要： A microstrip antenna has feed element 102 and parasitic elements 104, 106 on the front surface of substrate 1. Microwave electrical power is applied to feed element 102. Parasitic elements 104, 106 are connected via through hole type leads passing through substrate 1, to switches upon the rear surface of substrate 1, respectively. By actuating the switches individually, parasitic elements 104, 106 are individually switched between a grounded state and a float state. The direction of the radio beam emitted from the microstrip antenna is varied by selecting which of parasitic elements 104, 106 is grounded and floated. A microwave signal source connects to feed element 102 via an feed line 108 very much shorter than the wavelength, accordingly the transmission losses being low and the efficiency being excellent.
摘要翻译：微带天线具有馈电元件102和衬底1的前表面上的寄生元件104,106。微波电力施加到馈电元件102。寄生元件104,106通过穿过衬底1的通孔型引线分别连接到衬底1的后表面上。通过单独地驱动开关，寄生元件104,106在接地状态和浮置状态之间单独切换。通过选择寄生元件104,106中的哪一个接地并漂浮来改变从微带天线发射的无线电波束的方向。微波信号源通过比波长短得多的馈线108连接到馈电元件102，因此传输损耗低，效率优异。

4. 发明授权

US07249394B2 Vehicular wiper device having motor and internal space 有权
标题翻译：具有电动机和内部空间的车辆刮水器装置
公开(公告)号：US07249394B2
公开(公告)日：2007-07-31
申请号：US10983667
申请日：2004-11-09
申请人： Kengo Iwata
发明人： Kengo Iwata
IPC分类号： B60S1/24 , B60S1/18
CPC分类号： B60S1/245 , B60S1/0425 , B60S1/0427 , B60S1/0444 , B60S1/0488 , Y10T74/18184
摘要： A vehicular wiper device includes a wiper motor secured to a crank arm, a first pivot holder rotatably supporting a wiper arm and a first pivot lever, a second pivot holder rotatably supporting a wiper arm and a second pivot lever, and a link structure connected to the crank arm. Rotation power of the wiper motor is transmitted to the first pivot lever and the second pivot lever via the crank arm and the link structure. The wiper motor is secured to a rear face of a motor bracket portion of the first pivot holder on an opposite side as the wiper arm with respect to the motor bracket portion. The crank arm is arranged on the opposite side as the wiper motor with respect to the motor bracket portion. A dimension between the rear face of the motor bracket portion and the first pivot lever is set to be greater than a dimension between the rear face of the motor bracket portion and the crank arm.
摘要翻译：车辆刮水器装置包括固定到曲柄臂上的刮水器马达，可旋转地支撑刮水臂和第一枢转杆的第一枢轴保持架，可旋转地支撑刮水臂和第二枢转杆的第二枢转支架，以及连接到曲柄臂。刮水器马达的旋转动力通过曲柄臂和连杆结构传递到第一枢转杆和第二枢转杆。刮水器马达相对于马达支架部分固定在第一枢轴支架的马达托架部分的背面上，与刮臂相反的一侧。曲柄臂相对于电动机托架部分布置在刮水器马达的相对侧上。电动机托架部分的后表面和第一枢转杆之间的尺寸被设定为大于马达托架部分的后表面和曲柄臂之间的尺寸。

5. 发明申请

US20050097700A1 Vehicular wiper device having motor and internal space 有权
标题翻译：具有电动机和内部空间的车辆刮水器装置
公开(公告)号：US20050097700A1
公开(公告)日：2005-05-12
申请号：US10983667
申请日：2004-11-09
申请人： Kengo Iwata
发明人： Kengo Iwata
IPC分类号： B60S1/34 , B60S1/04 , B60S1/08 , B60S1/18 , B60S1/24 , B60S1/06
CPC分类号： B60S1/245 , B60S1/0425 , B60S1/0427 , B60S1/0444 , B60S1/0488 , Y10T74/18184
摘要： A vehicular wiper device includes a wiper motor secured to a crank arm, a first pivot holder rotatably supporting a wiper arm and a first pivot lever, a second pivot holder rotatably supporting a wiper arm and a second pivot lever, and a link structure connected to the crank arm. Rotation power of the wiper motor is transmitted to the first pivot lever and the second pivot lever via the crank arm and the link structure. The wiper motor is secured to a rear face of a motor bracket portion of the first pivot holder on an opposite side as the wiper arm with respect to the motor bracket portion. The crank arm is arranged on the opposite side as the wiper motor with respect to the motor bracket portion. A dimension between the rear face of the motor bracket portion and the first pivot lever is set to be greater than a dimension between the rear face of the motor bracket portion and the crank arm.
摘要翻译：车辆刮水器装置包括固定到曲柄臂上的刮水器马达，可旋转地支撑刮水臂和第一枢转杆的第一枢轴保持架，可旋转地支撑刮水臂和第二枢转杆的第二枢轴保持架以及连接到曲柄臂。刮水器马达的旋转动力通过曲柄臂和连杆结构传递到第一枢转杆和第二枢转杆。刮水器马达相对于马达支架部分固定在第一枢轴支架的马达托架部分的背面上，与刮臂相反的一侧。曲柄臂相对于电动机托架部分布置在刮水器马达的相对侧上。电动机托架部分的后表面和第一枢转杆之间的尺寸被设定为大于马达托架部分的后表面和曲柄臂之间的尺寸。

6. 发明授权

US07952534B2 Microstrip antenna 失效
标题翻译：微带天线
公开(公告)号：US07952534B2
公开(公告)日：2011-05-31
申请号：US10593392
申请日：2005-03-23
申请人： Kengo Iwata , Hiroshi Tsuboi , Kensuke Murata , Toshio Koguro , Youichi Murase
发明人： Kengo Iwata , Hiroshi Tsuboi , Kensuke Murata , Toshio Koguro , Youichi Murase
IPC分类号： H01Q21/00 , H01Q1/38
CPC分类号： H01Q9/0407 , H01Q9/0421 , H01Q9/0442 , H01Q21/065
摘要： A plurality of antenna electrodes 11, 12, 13, 14 on a substrate 1 can be connected to a ground electrode on the substrate 1 via connectors at spots 11A-11C, 12A-12C, 13A-13C, and 14A-14C. Each connector can be opened/closed by a switch; or provided with a impedance varying device. Any one of the antenna electrodes may be connected to the ground electrode by the switch or the impedance varying device. The radio wave beam outputted from this antenna electrode shifts in phase from the radio wave beams outputted from the other antenna electrodes, whereby the direction of the integrated radio wave beam is inclined. Connecting one or another of the spots 11A-11C, 12A-12C, 13A-13C, and 14A-14C to the ground electrode changes the direction and the magnitude of the integrated radio wave beam.
摘要翻译：基板1上的多个天线电极11,12,13,14可以通过点11A-11C，12A-12C，13A-13C和14A-14C处的连接器连接到基板1上的接地电极。每个连接器可以由开关打开/关闭; 或设置有阻抗变化装置。天线电极中的任何一个可以通过开关或阻抗变化装置连接到接地电极。从该天线电极输出的无线电波从与其他天线电极输出的无线电波相位移位，由此集成无线电波束的方向倾斜。将点11A-11C，12A-12C，13A-13C和14A-14C中的一个或另一个连接到接地电极改变了集成无线电波束的方向和大小。

7. 发明申请

US20050196949A1 Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls 有权
标题翻译：具有优异的微粘附防止性能和润湿性的焊球和防止焊球微粘附的方法
公开(公告)号：US20050196949A1
公开(公告)日：2005-09-08
申请号：US11067727
申请日：2005-03-01
申请人： Kengo Iwata , Koji Sato
发明人： Kengo Iwata , Koji Sato
IPC分类号： H01L21/44 , H01L21/60 , H05K3/34
CPC分类号： H01L24/11 , H01L2224/13099 , H01L2924/00013 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H05K3/3478 , H05K2201/0224 , H05K2203/041 , H05K2203/121 , H01L2224/29099
摘要： The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present invention provides a solder ball obtained by solidification and spheroidization in a gas phase and having metal soap molecules, preferably a metal soap molecules film of 3 nm or less in thickness, adsorbed on its surface. As the metal soap, there can be used, for example, calcium stearate, magnesium stearate or barium stearate. The present invention is preferably applied to solder balls with a diameter of 400 μm or less. The present invention also provides a method for preventing the micro-adhesion of solder balls which comprises immersing solder balls obtained by solidification and spheroidization in a gas phase, in a solution containing a metal soap dispersed therein, preferably, a solution containing a metal soap dispersed therein to a concentration of less than 5 ppm; taking out the solder balls from the solution; vaporizing the solvent on the surfaces of the solder balls; and then drying the surfaces. The drying is preferably conducted in an atmosphere having a relative humidity RH≦40%.
摘要翻译：本发明提供了一种解决微粘附问题的焊球，并且还解决了微粘附性和润湿性的两个问题，以及防止焊球微粘附的方法。也就是说，本发明提供一种在气相中凝固和球化获得的焊料球，并且具有吸附在其表面上的金属皂分子，优选厚度为3nm以下的金属皂分子膜。作为金属皂，可以使用例如硬脂酸钙，硬脂酸镁或硬脂酸钡。本发明优选应用于直径为400μm以下的焊球。本发明还提供了一种防止焊锡球的微粘附的方法，其包括将通过固化和球化获得的焊球浸入气相中，在其中分散有金属皂的溶液中，优选将含有分散的金属皂的溶液其浓度小于5ppm; 从溶液中取出焊球; 汽化锡球表面的溶剂; 然后干燥表面。干燥优选在相对湿度RH <= 40％的气氛中进行。

8. 发明申请

US20080036662A1 Microstrip Antenna 失效
标题翻译：微带天线
公开(公告)号：US20080036662A1
公开(公告)日：2008-02-14
申请号：US10593392
申请日：2005-03-23
申请人： Kengo Iwata , Hiroshi Tsuboi , Kensuke Murata , Toshio Koguro , Youichi Murase
发明人： Kengo Iwata , Hiroshi Tsuboi , Kensuke Murata , Toshio Koguro , Youichi Murase
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0407 , H01Q9/0421 , H01Q9/0442 , H01Q21/065
摘要： A plurality of antenna electrodes 11, 12, 13, 14 on a substrate 1 can be connected to a ground electrode on the substrate 1 via connectors at spots 11A-11C, 12A-12C, 13A-13C, and 14A-14C. Each connector can be opened/closed by a switch; or provided with a impedance varying device. Any one of the antenna electrodes may be connected to the ground electrode by the switch or the impedance varying device. The radio wave beam outputted from this antenna electrode shifts in phase from the radio wave beams outputted from the other antenna electrodes, whereby the direction of the integrated radio wave beam is inclined. Connecting one or another of the spots 11A-11C, 12A-12C, 13A-13C, and 14A-14C to the ground electrode changes the direction and the magnitude of the integrated radio wave beam.
摘要翻译：基板1上的多个天线电极11,12,13,14可以通过11-11C，12A-12C，13A-13C的连接器连接到基板1上的接地电极，并且 14 A- 14 C.每个连接器都可以由开关打开/关闭; 或设置有阻抗变化装置。天线电极中的任何一个可以通过开关或阻抗变化装置连接到接地电极。从该天线电极输出的无线电波从与其他天线电极输出的无线电波相位移位，由此集成无线电波束的方向倾斜。将一个或另一个点11A-11C，12A-12C，13A-13C和14A-14C连接到接地电极改变了集成无线电波束的方向和大小。

9. 发明授权

US07198983B2 Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls 有权
标题翻译：具有优异的微粘附防止性能和润湿性的焊球和防止焊球微粘附的方法
公开(公告)号：US07198983B2
公开(公告)日：2007-04-03
申请号：US11067727
申请日：2005-03-01
申请人： Kengo Iwata , Koji Sato
发明人： Kengo Iwata , Koji Sato
IPC分类号： H01L21/00
CPC分类号： H01L24/11 , H01L2224/13099 , H01L2924/00013 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H05K3/3478 , H05K2201/0224 , H05K2203/041 , H05K2203/121 , H01L2224/29099
摘要： The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present invention provides a solder ball obtained by solidification and spheroidization in a gas phase and having metal soap molecules, preferably a metal soap molecules film of 3 nm or less in thickness, adsorbed on its surface. As the metal soap, there can be used, for example, calcium stearate, magnesium stearate or barium stearate. The present invention is preferably applied to solder balls with a diameter of 400 μm or less. The present invention also provides a method for preventing the micro-adhesion of solder balls which comprises immersing solder balls obtained by solidification and spheroidization in a gas phase, in a solution containing a metal soap dispersed therein, preferably, a solution containing a metal soap dispersed therein to a concentration of less than 5 ppm; taking out the solder balls from the solution; vaporizing the solvent on the surfaces of the solder balls; and then drying the surfaces. The drying is preferably conducted in an atmosphere having a relative humidity RH≦40%.
摘要翻译：本发明提供了一种解决微粘附问题的焊球，并且还解决了微粘附性和润湿性的两个问题，以及防止焊球微粘附的方法。也就是说，本发明提供一种在气相中凝固和球化获得的焊料球，并且具有吸附在其表面上的金属皂分子，优选厚度为3nm以下的金属皂分子膜。作为金属皂，可以使用例如硬脂酸钙，硬脂酸镁或硬脂酸钡。本发明优选应用于直径为400μm以下的焊球。本发明还提供了一种防止焊锡球的微粘附的方法，其包括将通过固化和球化获得的焊球浸入气相中，在其中分散有金属皂的溶液中，优选将含有分散的金属皂的溶液其浓度小于5ppm; 从溶液中取出焊球; 汽化锡球表面的溶剂; 然后干燥表面。干燥优选在相对湿度RH <= 40％的气氛中进行。

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