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41. 发明授权

US5258062A Electroless gold plating solutions 失效
标题翻译：化学镀金解决方案
公开(公告)号：US5258062A
公开(公告)日：1993-11-02
申请号：US531151
申请日：1990-05-31
申请人： Masao Nakazawa , Masaaki Yoshitani , Shinichi Wakabayashi
发明人： Masao Nakazawa , Masaaki Yoshitani , Shinichi Wakabayashi
IPC分类号： C23C18/44 , C23C18/42
CPC分类号： C23C18/44
摘要： An electroless gold plating solution comprises a base solution containing an alkaline hydroxide, water-soluble gold salt, boron hydrides, amino branes, and alkali metal cyanate, and further contains at least one of chemicals that of a fatty unsaturated alcohol, fatty unsaturated polyhydric alcohol, fatty unsaturated carboxylic acid, and derivatives thereof.
摘要翻译：无电镀金液包含含有碱性氢氧化物，水溶性金盐，硼氢化物，氨基糠碱和碱金属氰酸盐的碱溶液，并且还包含至少一种脂肪族不饱和醇，脂肪族不饱和多元醇，脂肪族不饱和羧酸及其衍生物。

42. 发明授权

US08675145B2 Projector 有权
标题翻译：投影机
公开(公告)号：US08675145B2
公开(公告)日：2014-03-18
申请号：US12972772
申请日：2010-12-20
申请人： Shinichi Wakabayashi , Eiji Yokoyama
发明人： Shinichi Wakabayashi , Eiji Yokoyama
IPC分类号： G02F1/1335
CPC分类号： H04N9/3167 , G03B21/16 , G03B21/2066 , G03B21/2073 , H04N9/3144
摘要： A projector includes: a reflection-type polarizing plate which separates entering luminous flux by polarization into first linearly polarized light and second linearly polarized light whose polarization directions cross each other at right angles; a reflection-type light modulation device disposed inclined to the reflection-type polarizing plate to modulate the first linearly polarized light separated by polarization by the reflection-type polarizing plate according to image information and emit the modulated first linearly polarized light toward the reflection-type polarizing plate; a supporting body which supports the reflection-type polarizing plate and the reflection-type light modulation device; and a light shielding member disposed in an area to emit side of the second linearly polarized light which entering the reflection-type polarizing plate before modulation by the reflection-type light modulation device and separated by polarization, and connected with the supporting body.
摘要翻译：投影机包括：反射型偏振板，其将通过偏振的入射光束分离为第一直线偏振光;以及偏振方向以直角彼此交叉的第二直线偏振光; 反射型光调制装置，与反射式偏振片倾斜配置，根据图像信息调制由偏振光偏振片分离的第一线偏振光，并将调制后的第一线偏振光朝向反射型偏振光发射偏光板; 支撑反射型偏振板和反射型光调制装置的支撑体; 以及遮光部件，其设置在发射侧的所述第二线偏振光的一侧的区域，所述第二线偏振光在被所述反射型光调制装置调制之前进入所述反射型偏振片，并且被偏振分离，并与所述支撑体连接。

43. 发明授权

US08632191B2 Projector 有权
标题翻译：投影机
公开(公告)号：US08632191B2
公开(公告)日：2014-01-21
申请号：US13160006
申请日：2011-06-14
申请人： Shinichi Wakabayashi
发明人： Shinichi Wakabayashi
IPC分类号： G03B21/14 , G03B21/22 , G03B3/00 , G02B7/02 , G02B15/14
CPC分类号： G03B21/142 , G03B21/147 , G03B2205/0092
摘要： A projector includes: an electro-optic device which modulates light emitted from a light source; a projection lens which projects the light modulated by the electro-optic device; and a lens shift mechanism which shifts the projection lens in a direction perpendicular to the optical axis of the projection lens, wherein the lens shift mechanism includes a shift unit which supports the projection lens and shifts the projection lens in the direction perpendicular to the optical axis, a guide unit which guides the shift of the shift unit, and a drive unit which moves the shift unit, and the drive unit includes a rotation section as a rotated part which has a first bevel gear rotating around a center axis extending in the same direction as that of the optical axis, and a transmission section which has a second bevel gear engaging with the first bevel gear and transmits the rotation of the rotation section to the shift unit.
摘要翻译：投影仪包括：调制从光源发出的光的电光装置; 投射由电光装置调制的光的投影透镜; 以及透镜移动机构，其在与投影透镜的光轴垂直的方向上移动投影透镜，其中透镜移位机构包括移动单元，该移动单元支撑投影透镜并使投影透镜沿垂直于光轴的方向移动引导换档单元的移动的引导单元和移动换档单元的驱动单元，并且驱动单元包括作为旋转部的旋转部，该旋转部具有围绕其延伸的中心轴旋转的第一锥齿轮方向作为光轴的方向，以及具有与第一锥齿轮啮合的第二锥齿轮并将旋转部的旋转传递给换档单元的变速部。

44. 发明授权

US08545027B2 Light control apparatus and projector 有权
标题翻译：灯光控制装置和投影仪
公开(公告)号：US08545027B2
公开(公告)日：2013-10-01
申请号：US13159944
申请日：2011-06-14
申请人： Shinichi Wakabayashi , Kanji Yoshida
发明人： Shinichi Wakabayashi , Kanji Yoshida
IPC分类号： G03B21/14
CPC分类号： G03B21/14
摘要： A light control apparatus that controls the amount of light passing therethrough by blocking part of an incident light flux, includes: a pair of pivotal members having pivotal axes extending along a direction substantially perpendicular to a central axis of the light flux; and a pair of light blocking members held by the pair of pivotal members and changing the size of a light blocking area as the pair of pivotal members pivot, the light blocking area blocking part of the light flux, wherein the pivotal axes are located in positions that overlap with an area where the light flux passes, and the pair of light blocking members are located in positions that do not overlap with the pivotal axes.
摘要翻译：一种光控制装置，其通过阻挡入射光束的一部分来控制通过其的光量，包括：一对枢转构件，其具有沿着与所述光通量的中心轴线基本垂直的方向延伸的枢轴; 以及一对遮光构件，由一对枢转构件保持，并且当所述一对枢转构件枢转时改变遮光区域的尺寸，所述遮光区域阻挡所述光束的一部分，其中所述枢转轴位于所述位置其与光束通过的区域重叠，并且该对遮光构件位于不与枢转轴线重叠的位置。

45. 发明授权

US07707713B2 Component-embedded circuit board fabrication method 有权
标题翻译：组件嵌入式电路板制造方法
公开(公告)号：US07707713B2
公开(公告)日：2010-05-04
申请号：US12004431
申请日：2007-12-21
申请人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
发明人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
IPC分类号： H05K3/30
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/24011 , H01L2224/2402 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/8203 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01056 , H01L2924/01073 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , Y10T29/49004 , Y10T29/49117 , Y10T29/49126 , Y10T29/49131 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/532 , H01L2224/82 , H01L2924/00
摘要： A method of fabricating a component-embedded board including detecting, before the board is covered with an insulating layer, the actual position of an electronic component formed on the surface of the board, calculating a displacement between the design position of the electronic component and the actual position of the electronic component on the surface of the board, and for holding the displacement as displacement data, and correcting, based on the displacement data, design data to be used for processing the board after the board is covered with the insulating layer.
摘要翻译：一种制造部件嵌入式基板的方法，包括在板被绝缘层覆盖之前检测形成在电路板表面上的电子部件的实际位置，计算电子部件的设计位置和电子部件在板的表面上的实际位置，并将位移保持为位移数据，并且基于位移数据，校正在板被绝缘层覆盖之后用于处理板的设计数据。

46. 发明申请

US20080110021A1 Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board 有权
标题翻译：组件嵌入式板制造方法和装置，用于高精度和容易地制造嵌入在电路板中的电子部件的部件嵌入式板
公开(公告)号：US20080110021A1
公开(公告)日：2008-05-15
申请号：US12004431
申请日：2007-12-21
申请人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
发明人： Masatoshi Akagawa , Kazunari Sekigawa , Shinichi Wakabayashi
IPC分类号： H01K3/10 , G06F19/00
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/24011 , H01L2224/2402 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/8203 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01056 , H01L2924/01073 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H05K1/185 , Y10T29/49004 , Y10T29/49117 , Y10T29/49126 , Y10T29/49131 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/53061 , Y10T29/53087 , Y10T29/53174 , Y10T29/532 , H01L2224/82 , H01L2924/00
摘要： An apparatus 1 for fabricating a component-embedded board according to the present invention comprises: a detecting unit 11 for detecting, before the board 21 is covered with an insulating layer 23, the actual position of an electronic component 22 formed on the surface of the board 21; a holding unit 12 for calculating a displacement between the design position of the electronic component 22 and the actual position of the electronic component 22 on the surface of the board 21, and for holding the displacement as displacement data; and a correcting unit 13 for correcting, based on the displacement data, design data to be used for processing the board 21 after the board 21 is covered with the insulating layer 23.
摘要翻译：根据本发明的用于制造部件嵌入式基板的装置1包括：检测单元11，用于在板21被绝缘层23覆盖之前检测形成在该表面上的电子部件22的实际位置板21; 用于计算电子部件22的设计位置与电子部件22在电路板21的表面上的实际位置之间的位移并保持位移作为位移数据的保持单元12; 以及校正单元13，用于基于位移数据，校正板21被绝缘层23覆盖之后用于处理板21的设计数据。

47. 发明授权

US07220657B2 Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device 有权
标题翻译：具有柱状电极的半导体晶片和半导体器件及其制造方法
公开(公告)号：US07220657B2
公开(公告)日：2007-05-22
申请号：US10323645
申请日：2002-12-20
申请人： Yoshihiro Ihara , Tsuyoshi Kobayashi , Shinichi Wakabayashi
发明人： Yoshihiro Ihara , Tsuyoshi Kobayashi , Shinichi Wakabayashi
IPC分类号： H01L21/283
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05026 , H01L2224/05569 , H01L2224/1146 , H01L2224/1147 , H01L2224/11849 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2924/013
摘要： A semiconductor wafer provided with columnar electrodes which have plated nickel, palladium, and gold films successively formed at the top thereof, or have a plated solder film at their top. The semiconductor wafer can be preferably used for producing a chip-sized semiconductor device provided with columnar electrodes to which an external connection terminal, such as a solder ball, is to be bonded. Methods of producing the semiconductor wafer and device by use of plating are also disclosed.
摘要翻译：具有在其顶部依次形成有镀镍，钯和金膜的柱状电极的半导体晶片，或者在其顶部具有电镀焊料膜。半导体晶片可以优选用于制造具有柱状电极的芯片尺寸的半导体器件，其中诸如焊球的外部连接端子要被接合。还公开了通过电镀制造半导体晶片和器件的方法。

48. 发明申请

US20060215956A1 Encoder/decoder for optical CDMA 失效
标题翻译：用于光CDMA的编码器/解码器
公开(公告)号：US20060215956A1
公开(公告)日：2006-09-28
申请号：US11444428
申请日：2006-06-01
申请人： Jingo Adachi , Akihiro Itoh , Shinichi Wakabayashi
发明人： Jingo Adachi , Akihiro Itoh , Shinichi Wakabayashi
IPC分类号： G02B6/26
CPC分类号： H04J14/005
摘要： An encoder according to the present invention is an encoder for encoding an optical wavelength-multiplexed signal compliant with optical CDMA into a code having a code pattern, including: L optical fibers 36 and 42 (where L is an integer equal to or greater than two) each having a plurality of gratings 37 to 47; and a circulator 52 for coupling the plurality of optical fibers 36 and 42. The code pattern contains time bins t1 to t3. A plurality of wavelengths λ1, λ4 and λ5 are assigned to the time bin t1. If a sum of an optical path difference in each optical fiber from the grating which reflects the optical signal of the wavelength λ1 to the grating which reflects the optical signal of the wavelength λ4 is calculated for all of the optical fibers 36 and 42, the sum equals zero.
摘要翻译：根据本发明的编码器是用于将符合光CDMA的光波分复用信号编码成具有码模式的编码器的编码器，包括：L光纤36和42（其中L是等于或大于2的整数），每个具有多个光栅37至47; 以及用于连接多根光纤36和42的循环器52。代码图案包含时间段t 1到t 3。将多个波长λ1，λ4和λ5分配给时间段t 1。如果针对所有光纤36和42计算出反射波长λ4的光信号的反射波长λ1的光信号的光栅的每个光纤与光栅的光程差的和，总和等于零。

49. 发明申请

US20060001179A1 Interposer, method of fabricating the same, and semiconductor device using the same 有权
公开(公告)号：US20060001179A1
公开(公告)日：2006-01-05
申请号：US11151193
申请日：2005-06-14
申请人： Katsuya Fukase , Shinichi Wakabayashi
发明人： Katsuya Fukase , Shinichi Wakabayashi
IPC分类号： H01L21/48 , H01L23/52
CPC分类号： H01L23/147 , H01L21/6835 , H01L23/14 , H01L23/3677 , H01L23/492 , H01L23/49827 , H01L25/0657 , H01L2224/16225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/3511 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/0401
摘要： An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor and an interposer portion provided around the foregoing interposer portion integrally therewith. On both surfaces of the interposer portions, wiring patterns are formed via insulating layers. The wiring patterns are electrically connected via through holes formed at required positions in the interposer portions. The outer interposer portion is made of an insulator or a metal body. Further, external connection terminals are bonded to one surface of the interposer.

50. 发明授权

US06744949B2 Single-element optical wavelength bandpass filter formed in optical fiber or optical waveguide and method of manufacture thereof 失效
标题翻译：在光纤或光波导中形成的单元件光波长带通滤波器及其制造方法
公开(公告)号：US06744949B2
公开(公告)日：2004-06-01
申请号：US09963588
申请日：2001-09-27
申请人： Yoshinori Takeuchi , Shinichi Wakabayashi
发明人： Yoshinori Takeuchi , Shinichi Wakabayashi
IPC分类号： G02B634
CPC分类号： G02B6/29389 , G02B6/02085 , G02B6/02138 , G02B6/02204 , G02B6/29322 , G02B6/29395
摘要： An optical wavelength filter having one or more bands of transmission wavelengths of light, within a reflection spectrum of the filter, is formed using a section of an optical fiber as an optical fiber grating. The optical fiber core is configured with a periodically varying diffraction coefficient structure formed such that the grating pitch continuously varies in a fixed direction, with that structure containing one or more regions of interruption of the continuous variation of pitch, whereby the bands of transmission wavelengths are respectively defined by these interruption regions.
摘要翻译：使用光纤的一部分作为光纤光栅，形成在滤光器的反射光谱内具有一个或多个发光波长带的光波长滤波器。光纤芯被配置为周期性变化的衍射系数结构，其形成为使得光栅节距在固定方向上连续变化，该结构包含间距连续变化的一个或多个中断区域，由此传输波长的频带为分别由这些中断区域限定。

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