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    • 41. 发明授权
    • Plasma processing method and apparatus
    • 等离子体处理方法和装置
    • US5922223A
    • 1999-07-13
    • US749847
    • 1996-11-15
    • Tomohiro OkumuraHideo HaraguchiIchiro NakayamaYoshihiro Yanagi
    • Tomohiro OkumuraHideo HaraguchiIchiro NakayamaYoshihiro Yanagi
    • H01J37/32B23K10/00
    • H01J37/32522H01J37/321
    • A plasma processing method and apparatus, wherein evaluation is effected while a suitable gas is introduced into a vacuum vessel, and then a high frequency voltage is applied by a high frequency discharge coil power source to a spiral discharge coil while the interior of the vacuum vessel is kept under adequate pressure, whereby a high frequency magnetic field is generated within the vacuum vessel through a dielectric plate so that electrons are accelerated by an induction field due to the high frequency magnetic field to generate plasma within the vacuum vessel for processing a substrate, characterized in that the dielectric plate is heated by a planar heater to 80.degree. C. or more, whereby the thickness of a thin film to be deposited on the dielectric plate is substantially reduced thereby to inhibit dust generation and thus substantially reduce the frequency of maintenance required for the dielectric plate. The apparatus includes a ceramic plate formed with a discharge coil fixing groove and mounted on the dielectric plate, and the planar spiral discharge coil is mounted on the ceramic plate.
    • 一种等离子体处理方法和装置,其中在合适的气体被引入真空容器中时进行评价,然后通过高频放电线圈电源将高频电压施加到螺旋放电线圈,同时真空容器的内部 保持在足够的压力下,由此通过电介质板在真空容器内产生高频磁场,使得由于高频磁场而通过感应场加速电子,以在真空容器内产生用于处理衬底的等离子体, 其特征在于,通过平面加热器将电介质板加热至80℃以上,由此沉积在电介质板上的薄膜的厚度大大降低,从而抑制灰尘产生,从而显着降低维护频率 电介质板所需的。 该装置包括形成有放电线圈固定槽并安装在电介质板上的陶瓷板,并且平面螺旋放电线圈安装在陶瓷板上。
    • 43. 发明申请
    • PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
    • 等离子体加工设备和等离子体处理方法
    • US20120325777A1
    • 2012-12-27
    • US13582557
    • 2011-05-11
    • Tomohiro OkumuraIchiro NakayamaMitsuo Saitoh
    • Tomohiro OkumuraIchiro NakayamaMitsuo Saitoh
    • H01L21/465B44C1/22C23C16/50
    • H05H1/30H01J37/3211H01J37/32376H01J37/32825H01L21/324
    • A base material is placed on a base material placement face of a base material placement table. An inductively coupled plasma torch unit is structured with a cylindrical chamber structured with a cylinder made of an insulating material and provided with a rectangular slit-like plasma jet port, and lids closing opposing ends of the cylinder, a gas jet port that supplies gas into the cylindrical chamber, and a solenoid coil that generates a high frequency electromagnetic field in the cylindrical chamber. By a high frequency power supply supplying a high frequency power to the solenoid coil, plasma is generated in the cylindrical chamber, and the plasma is emitted from the plasma jet port to the base material. While relatively shifting the plasma torch unit and the base material placement table, a base material surface can be subjected to heat treatment.
    • 基材放置在基材放置台的基材放置面上。 电感耦合等离子体焰炬单元构造为具有由绝缘材料构成的圆柱形腔室,该圆柱形腔体由绝缘材料构成,并设置有矩形裂缝状等离子体喷射口,并且盖住气缸的相对端部,气体喷射口将气体供应到 圆柱形腔室和在圆柱形腔室中产生高频电磁场的螺线管线圈。 通过向螺线管线圈提供高频电力的高频电源,在圆筒形室中产生等离子体,等离子体从等离子体喷射口发射到基体材料。 在相对移动等离子体焰炬单元和基材放置台的同时,可以对基材表面进行热处理。
    • 47. 发明申请
    • Plasma Doping Method and Apparatus
    • 等离子体掺杂法和装置
    • US20090233383A1
    • 2009-09-17
    • US11884924
    • 2006-02-14
    • Tomohiro OkumuraYuichiro SasakiKatsumi OkashitaHiroyuki ItoBunji MizunoCheng-Guo JinIchiro Nakayama
    • Tomohiro OkumuraYuichiro SasakiKatsumi OkashitaHiroyuki ItoBunji MizunoCheng-Guo JinIchiro Nakayama
    • H01L21/66B05C11/00
    • H01L21/2236H01J37/321H01J37/32412H01J2237/2001
    • It is intended to provide a plasma doping method and apparatus which are superior in the controllability of the concentration of an impurity that is introduced into a surface layer of a sample.A prescribed gas is introduced into a vacuum container 1 from a gas supply apparatus 2 while being exhausted by a turbomolecular pump 3 as an exhaust apparatus. The pressure in the vacuum container 1 is kept at a prescribed value by a pressure regulating valve 4. High-frequency electric power of 13.56 MHz is supplied from a high-frequency power source 5 to a coil 8 disposed close to a dielectric window 7 which is opposed to a sample electrode 6, whereby induction-coupled plasma is generated in the vacuum container 1. A high-frequency power source 10 for supplying high-frequency electric power to the sample electrode 6 is provided. Every time a prescribed number of samples have been processed, a dummy sample is subjected to plasma doping and then to heating. The conditions for processing of a sample are controlled so that the measurement value of the surface sheet resistance becomes equal to a prescribed value, whereby the controllability of the impurity concentration can be increased.
    • 旨在提供一种等离子体掺杂方法和装置,该等离子体掺杂方法和装置在引入样品的表面层中的杂质的浓度的可控性方面是优异的。 将规定的气体从作为排气装置的涡轮分子泵3排出而从气体供给装置2引入真空容器1。 真空容器1中的压力通过压力调节阀4保持在规定值。13.56MHz的高频电力从高频电源5供给到靠近电介质窗7设置的线圈8, 与样品电极6相对,从而在真空容器1中产生感应耦合等离子体。提供了用于向样品电极6提供高频电力的高频电源10。 每当处理规定数量的样品时,将虚拟样品进行等离子体掺杂,然后进行加热。 控制处理样品的条件使得表面薄层电阻的测量值等于规定值,从而可以提高杂质浓度的可控性。
    • 48. 发明授权
    • Plasma processing method and apparatus
    • 等离子体处理方法和装置
    • US07510667B2
    • 2009-03-31
    • US11397626
    • 2006-04-05
    • Tomohiro OkumuraIchiro Nakayama
    • Tomohiro OkumuraIchiro Nakayama
    • C23F1/00
    • H01J37/32082C23F4/00Y02E50/30
    • A plasma processing apparatus includes a vacuum vessel, a substrate electrode for supporting a substrate, and an antenna disposed in opposition to the substrate electrode and covered with an insulating antenna cover. A first high-frequency power supplies a high-frequency power of a 30 MHz to 3 GHz frequency to the antenna, and a second high-frequency power supply supplies a high-frequency power of a 100 kHz to 20 MHz. A refrigerant supply unit is provided for supplying a refrigerant flow to the antenna, and an electrically conductive sheet is provided between the antenna and the antenna cover. The electrically conductive sheet has a surface that is parallel to the substrate electrode and is larger than an opposing surface of the antenna.
    • 等离子体处理装置包括真空容器,用于支撑基板的基板电极和与基板电极相对设置且被绝缘天线盖覆盖的天线。 第一高频电源向天线提供30MHz至3GHz频率的高频功率,而第二高频电源提供100kHz至20MHz的高频功率。 设置制冷剂供给单元,用于向天线供给制冷剂流,在天线和天线罩之间设置导电片。 导电片具有平行于衬底电极并且大于天线的相对表面的表面。
    • 49. 发明授权
    • Plasma processing method and apparatus
    • 等离子体处理方法和装置
    • US07465407B2
    • 2008-12-16
    • US10649670
    • 2003-08-28
    • Mitsuo SaitohTomohiro OkumuraIchiro Nakayama
    • Mitsuo SaitohTomohiro OkumuraIchiro Nakayama
    • C23C16/00
    • H01J37/32009C23C16/5096H01J37/32376
    • In a plasma processing method for supplying an electric power to a first electrode, making a first electrode have a ground potential, or making a first electrode have a floating potential while supplying gas to a plasma source arranged in a vicinity of an object to be processed at a pressure in a vicinity of an atmospheric pressure. The method includes processing a part of the object to be processed with a plasma in a state where an area of a surface of a potentially controlled second electrode, arranged in a position opposite to the plasma source via the object to be processed, is made superposed on the object to be processed smaller than an area of a surface of the plasma source superposed on the object to be processed.
    • 在用于向第一电极供给电力的等离子体处理方法中,使第一电极具有接地电位,或者使第一电极具有浮置电位,同时向布置在待处理物体附近的等离子体源供给气体 在大气压力附近的压力下。 该方法包括在等离子体处理待处理物体的一部分的状态,其中经由待处理物体布置在与等离子体源相反的位置的潜在受控的第二电极的表面的面积被叠加 对待处理的物体小于叠加在待处理物体上的等离子体源的表面的面积。