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    • 47. 发明申请
    • Precisely Tuning Feature Sizes on Hard Masks Via Plasma Treatment
    • 通过等离子体处理精确调整硬面膜的特征
    • US20110201204A1
    • 2011-08-18
    • US12704665
    • 2010-02-12
    • Hongbo PengStephen M. RossnagelKatherine L. Saenger
    • Hongbo PengStephen M. RossnagelKatherine L. Saenger
    • H01L21/31
    • H01L21/0337B81B2201/058B81C1/00071H01L21/0338
    • Methods are provided for fabricating devices. A first layer is formed. A hardmask on the first layer is formed. Features on the hardmask are patterned. The sizes of features on the hardmask are reduced by applying a plasma treatment process to form reduced size features. Also, the size of features on the hardmask can be enlarged to form enlarged size features by applying the plasma treatment process and/or removing the oxidized part of the feature during plasma treatment process. Another method may include a first layer formed on a substrate and a second layer formed on the first layer. First features are patterned on the first layer, and second features are patterned on the second layer. A size of second features on the second layer is closed due to the different oxidation rate of the two layers during the plasma treatment process, to form a self-sealed channel and/or self-buried trench.
    • 提供了制造器件的方法。 形成第一层。 形成第一层上的硬掩模。 硬掩模上的特征被图案化。 通过应用等离子体处理工艺来形成尺寸减小的特征,可减少硬掩模上的特征尺寸。 此外,通过在等离子体处理过程中应用等离子体处理工艺和/或去除特征的氧化部分,可以扩大硬掩模上的特征的尺寸以形成扩大的尺寸特征。 另一种方法可以包括形成在基底上的第一层和形成在第一层上的第二层。 第一特征在第一层上被图案化,并且第二特征被图案化在第二层上。 由于在等离子体处理过程中两层的氧化速率不同,所以第二层上的第二特征的尺寸是封闭的,以形成自密封通道和/或自埋式沟槽。
    • 50. 发明授权
    • Hollow cathode enhanced magnetron sputter device
    • 空心阴极增强磁控溅射装置
    • US4588490A
    • 1986-05-13
    • US736918
    • 1985-05-22
    • Jerome J. CuomoHarold R. KaufmanStephen M. Rossnagel
    • Jerome J. CuomoHarold R. KaufmanStephen M. Rossnagel
    • C23F4/00C23C14/35H01J37/34
    • H01J37/3405
    • A plasma sputter etching/deposition system comprising an electron-emitting hollow cathode arc-source combined with a conventional plasma sputter etching/deposition system such as a magnetron. The electrons emitted are coupled into the intrinsic high energy, e.g., magnetic field and are accelerated by the plasma potential and cause a significant increase plasma density. The resultant combination allows much greater sputtering/deposition efficiency than was possible with previous devices. According to a further aspect of the invention, switched operation is possible, whereby etching may vary from isotropic to anisotropic. A side discharge hollow cathode structure is also described for enhancing certain sputtering/deposition processes, wherein electrons may be emitted from one or more openings at the side of a hollow cathode chamber to achieve more uniform electron emission in a large process chamber.
    • 等离子体溅射蚀刻/沉积系统,其包括与常规等离子体溅射蚀刻/沉积系统如磁控管组合的电子发射空心阴极电弧源。 所发射的电子被耦合到固有的高能量例如磁场中,并被等离子体电势加速并且引起显着增加的等离子体密度。 所得到的组合允许比以前的装置更大的溅射/沉积效率。 根据本发明的另一方面,切换操作是可能的,由此蚀刻可以从各向同性到各向异性。 还描述了用于增强某些溅射/沉积工艺的侧面放电中空阴极结构,其中电子可以从中空阴极室侧面的一个或多个开口发射,以在大的处理室中实现更均匀的电子发射。