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    • 43. 发明授权
    • Method and apparatus for linking and/or patterning self-assembled objects
    • 用于连接和/或构图自组装物体的方法和装置
    • US06566665B2
    • 2003-05-20
    • US09930979
    • 2001-08-17
    • John E. E. BaglinHendrik F. HamannShouheng Sun
    • John E. E. BaglinHendrik F. HamannShouheng Sun
    • H01J3730
    • B82Y30/00G03F7/038G03F7/165G11B5/855Y10S977/901
    • The invention provides a method and related apparatus to link and/or pattern self-assembled first objects to a second object. Each of the first object (e.g., a nanoparticle) can be embedded in a mobile binder (i.e., a stabilizer). The invention applies energy to the first object and stabilizer, links this first object to the second object, and provides a controlled linkage of the first object with respect to the second object. Applying this procedure to many such objects results in a larger areal arrangement of these linked objects. An appropriate solvent may be used to remove non-linked objects, yielding a patterned array. Thermal annealing can be applied to control the physical and chemical properties of the array.
    • 本发明提供一种方法和相关装置,用于将自组装的第一物体链接和/或图案化为第二物体。 第一物体(例如,纳米颗粒)中的每一个可以嵌入移动的粘合剂(即稳定剂)中。 本发明将能量应用于第一物体和稳定器,将该第一物体与第二物体相连,并且提供第一物体相对于第二物体的受控连杆。 将此过程应用于许多这样的对象导致这些链接对象的更大的面积排列。 可以使用合适的溶剂来除去未连接的物体,产生图案化的阵列。 可以应用热退火来控制阵列的物理和化学性质。
    • 46. 发明申请
    • Knowledge-Based Models for Data Centers
    • 基于知识的数据中心模型
    • US20120284216A1
    • 2012-11-08
    • US13549428
    • 2012-07-14
    • Hendrik F. HamannRaymond LloydWanli Min
    • Hendrik F. HamannRaymond LloydWanli Min
    • G06F15/18
    • G06F1/206G06N3/02H05K7/20836Y02D10/16
    • Techniques for data center analysis are provided. In one aspect, a method for modeling thermal distributions in a data center includes the following steps. Vertical temperature distribution data is obtained for a plurality of locations throughout the data center and is plotted as an s-curve, wherein the vertical temperature distribution data reflects physical conditions at each of the locations which is reflected in a shape of the s-curve. Each of the s-curves is represented with a set of parameters that characterize the shape of the s-curve, wherein the s-curve representations make up a knowledge base model of predefined s-curve types from which thermal distributions and associated physical conditions at the plurality of locations throughout the data center can be analyzed. The set of parameters that characterize the shape of the s-curve are associated with the physical conditions at the plurality of locations throughout the data center using a machine-learning model.
    • 提供数据中心分析技术。 一方面,用于对数据中心中的热分布进行建模的方法包括以下步骤。 对于整个数据中心的多个位置获得垂直温度分布数据,并将其绘制为s曲线,其中垂直温度分布数据反映了以s曲线的形状反映的每个位置处的物理条件。 每个s曲线由表征s曲线形状的一组参数表示,其中s曲线表示构成了预定S曲线类型的知识库模型,从该曲线形式中的热分布和相关的物理条件 可以分析整个数据中心的多个位置。 表征s曲线形状的参数集合与使用机器学习模型的整个数据中心的多个位置处的物理条件相关联。
    • 47. 发明授权
    • Knowledge-based models for data centers
    • 基于知识的数据中心模型
    • US08244502B2
    • 2012-08-14
    • US12540213
    • 2009-08-12
    • Hendrik F. HamannRaymond LloydWanli Min
    • Hendrik F. HamannRaymond LloydWanli Min
    • G06F17/50
    • G06F1/206H05K7/20836
    • Techniques for data center analysis are provided. In one aspect, a method for modeling thermal distributions in a data center is provided. The method includes the following steps. Vertical temperature distribution data is obtained for a plurality of locations throughout the data center. The vertical temperature distribution data for each of the locations is plotted as an s-curve, wherein the vertical temperature distribution data reflects physical conditions at each of the locations which is reflected in a shape of the s-curve. Each of the s-curves is represented with a set of parameters that characterize the shape of the s-curve, wherein the s-curve representations make up a knowledge base model of predefined s-curve types from which thermal distributions and associated physical conditions at the plurality of locations throughout the data center can be analyzed.
    • 提供数据中心分析技术。 在一方面,提供了一种用于对数据中心中的热分布建模的方法。 该方法包括以下步骤。 在整个数据中心的多个位置获得垂直的温度分布数据。 每个位置的垂直温度分布数据被绘制为s曲线,其中垂直温度分布数据反映了以s曲线的形状反映的每个位置处的物理条件。 每个s曲线用表征s曲线形状的一组参数表示,其中s曲线表示构成了预定义的s曲线类型的知识库模型,其中热分布和相关联的物理条件 可以分析整个数据中心的多个位置。
    • 50. 发明授权
    • Apparatus for thermal characterization under non-uniform heat load
    • 非均匀热负荷下热表征的装置
    • US08038343B2
    • 2011-10-18
    • US12048635
    • 2008-03-14
    • Hendrik F. HamannMadhusudan K. IyengarJames A. LaceyRoger R. Schmidt
    • Hendrik F. HamannMadhusudan K. IyengarJames A. LaceyRoger R. Schmidt
    • G01K3/00
    • H01L23/34H01L2924/0002H01L2924/00
    • A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip. The temperature distribution is used to thermally characterize said cooling device during operation.
    • 公开了一种用于热表征用于冷却电子设备的设备的新颖的计算机程序产品和方法。 被操作的冷却装置热耦合到具有接收测试芯片的表面的热管。 加热器在测试芯片的电路侧进行图案化。 加热器与测试芯片的操作电路分开。 将局部热源施加到热耦合到热管的测试芯片上的至少一个区域,以局部加热测试芯片的第二表面上的多于一个区域,以测试多于一个热点。 第二个表面是测试芯片的电路侧。 加热器对测试芯片提供偏置热量,与操作测试芯片无关,同时局部热源被选择性地直接应用于测试芯片。 温度检测器用于测量测试芯片第二表面上的温度分布。 温度分布用于在操作期间热定形所述冷却装置。