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1. 发明申请

US20110279967A1 Techniques for Data Center Cooling 失效
标题翻译：数据中心冷却技术
公开(公告)号：US20110279967A1
公开(公告)日：2011-11-17
申请号：US13189515
申请日：2011-07-24
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要翻译：提供了数据中心冷却技术。在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口; 以及一个或多个：安装到围绕至少一部分空气入口的计算机设备机架的进气管道，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸和较小的长度比计算机设备机架的长度以及安装到围绕至少一部分排气出口的计算机设备机架的排气管道，排气管道具有接近计算机设备机架的横向尺寸的横向尺寸和长度小于计算机设备机架的长度。

2. 发明授权

US08009430B2 Techniques for data center cooling 有权
标题翻译：数据中心冷却技术
公开(公告)号：US08009430B2
公开(公告)日：2011-08-30
申请号：US11750322
申请日：2007-05-17
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
IPC分类号： H05K7/20 , H05K5/00 , A47B81/00
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要翻译：提供了数据中心冷却技术。在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口，以及一个或多个：安装到计算机设备机架上的空气入口管道，其围绕空气入口的至少一部分，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸并且长度小于计算机设备机架的长度，以及安装在围绕至少一部分排气出口的计算机设备机架上的排气管，排气管具有接近侧向尺寸的横向尺寸计算机设备机架的长度小于计算机设备机架的长度。

3. 发明授权

US08593815B2 Techniques for data center cooling 失效
公开(公告)号：US08593815B2
公开(公告)日：2013-11-26
申请号：US13189515
申请日：2011-07-24
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
IPC分类号： H05K5/00 , H05K7/20 , A47B81/00
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

4. 发明申请

US20080285232A1 Techniques for Data Center Cooling 有权
标题翻译：数据中心冷却技术
公开(公告)号：US20080285232A1
公开(公告)日：2008-11-20
申请号：US11750322
申请日：2007-05-17
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard Van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard Van Kessel
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要翻译：提供了数据中心冷却技术。在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口，以及一个或多个：安装到计算机设备机架上的空气入口管道，其围绕空气入口的至少一部分，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸并且长度小于计算机设备机架的长度，以及安装在围绕至少一部分排气出口的计算机设备机架上的排气管，排气管具有接近侧向尺寸的横向尺寸计算机设备机架的长度小于计算机设备机架的长度。

5. 发明授权

US07979250B2 Method of laying out a data center using a plurality of thermal simulators 有权
标题翻译：使用多个热模拟器布置数据中心的方法
公开(公告)号：US07979250B2
公开(公告)日：2011-07-12
申请号：US11950747
申请日：2007-12-05
申请人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G06F17/50 , G06G7/56 , G06G7/50 , H02B1/00 , G01K13/00 , G01K1/08 , G01K7/16 , G01K11/30 , G01K1/16 , G01N9/36
CPC分类号： G06F17/509 , G06F1/20 , G06F17/5004 , G06F2217/78 , G06F2217/80
摘要： A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.
摘要翻译：提供了一种便于在数据中心内安装一个或多个电子机架的方法。该方法包括：将多个热模拟器放置在数据中心中的数据中心布局中，以建立热仿真数据中心，每个热模拟器模拟多个模拟数据中心的相应电子机架的气流吸入或加热气流排气中的至少一个电子机架要安装在数据中心; 监测多个位置的热仿真数据中心内的温度，以及如果测量温度在包含多个电子机架时数据中心的可接受温度范围内，则验证数据中心布局; 以及使用已验证的数据中心布局在所述数据中心内建立所述多个电子机架，所述建立包括用相应的电子机架重新配置或替换每个热模拟器中的至少一个。

6. 发明授权

US07651260B2 Apparatus for thermal characterization under non-uniform heat load 有权
标题翻译：非均匀热负荷下热表征的装置
公开(公告)号：US07651260B2
公开(公告)日：2010-01-26
申请号：US12048620
申请日：2008-03-14
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
IPC分类号： G01N25/72
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.
摘要翻译：所公开的是用于确定用于从电子设备传递热量的冷却装置的冷却特性的装置。该装置包括热耦合到热管的冷却装置。该热管具有用于选择性地在其上施加热量的暴露表面。选择性地将局部热源施加到暴露表面的至少一个区域。热源优选地能够相对于暴露的表面和热强度都在位置上变化。优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与局部热源隔离。当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。然后使用温度分布来热定形冷却装置。

7. 发明申请

US20080281551A1 METHOD AND APPARATUS FOR THREE-DIMENSIONAL MEASUREMENTS 有权
公开(公告)号：US20080281551A1
公开(公告)日：2008-11-13
申请号：US12110698
申请日：2008-04-28
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
IPC分类号： G01K13/00
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.

8. 发明授权

US08210741B2 Apparatus for thermal characterization under non-uniform heat load 有权
标题翻译：非均匀热负荷下热表征的装置
公开(公告)号：US08210741B2
公开(公告)日：2012-07-03
申请号：US12611519
申请日：2009-11-03
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
IPC分类号： G01N25/72 , G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要翻译：设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。操作冷却装置热耦合到热管。热管具有用于选择性地在其上施加热量的暴露表面。来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。热源优选能够相对于暴露的表面和热强度在位置上都变化。优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。然后将温度分布用于热操作冷却装置的特征。

9. 发明授权

US07756667B2 Apparatus for three-dimensional measurements of physical characteristics within a data center 有权
标题翻译：用于数据中心内物理特性三维测量的装置
公开(公告)号：US07756667B2
公开(公告)日：2010-07-13
申请号：US12110698
申请日：2008-04-28
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
IPC分类号： G01K1/06 , G06F17/40
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译：公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。该装置包括支撑多个传感器的推车。购物车可在数据中心内移动。传感器捕获房间内的温度或其他物理参数。传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。

10. 发明申请

US20080239539A1 METHOD AND APPARATUS FOR THREE-DIMENSIONAL MEASUREMENTS 有权
标题翻译：三维测量方法与装置
公开(公告)号：US20080239539A1
公开(公告)日：2008-10-02
申请号：US12110732
申请日：2008-04-28
申请人： HENDRIK F. HAMANN , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： HENDRIK F. HAMANN , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
IPC分类号： G11B27/36
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译：公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。该装置包括支撑多个传感器的推车。购物车可在数据中心内移动。传感器捕获房间内的温度或其他物理参数。传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。

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