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    • 43. 发明授权
    • Semiconductor component and method of manufacture
    • 半导体元件及制造方法
    • US07981757B2
    • 2011-07-19
    • US12902130
    • 2010-10-11
    • Peter A. BurkeSallie HoseSudhama C. Shastri
    • Peter A. BurkeSallie HoseSudhama C. Shastri
    • H01L21/02
    • H01L23/5223H01L21/76801H01L21/76807H01L21/76846H01L23/5227H01L23/5228H01L23/53238H01L28/20H01L28/40H01L2924/0002H01L2924/00
    • A semiconductor component that includes an integrated passive device and method for manufacturing the semiconductor component. Vertically integrated passive devices are manufactured above a substrate. In accordance with one embodiment, a resistor is manufactured in a first level above a substrate, a capacitor is manufactured in a second level that is vertically above the first level, and a copper inductor is manufactured in a third level that is vertically above the second level. The capacitor has aluminum plates. In accordance with another embodiment, a resistor is manufactured in a first level above a substrate, a copper inductor is manufactured in a second level that is vertically above the first level, and a capacitor is manufactured in a third level that is vertically above the second level. The capacitor may have aluminum plates or a portion of the copper inductor may serve as one of its plates.
    • 一种包括集成无源器件的半导体部件和用于制造半导体部件的方法。 在衬底上方制造垂直集成的无源器件。 根据一个实施例,在基板上方的第一电平中制造电阻器,在垂直于第一电平的第二电平上制造电容器,并且在垂直于第二电平的第三电平上制造铜电感器 水平。 电容器有铝板。 根据另一个实施例,在基板上方的第一电平中制造电阻器,在垂直于第一电平的第二电平上制造铜电感器,并且制造在垂直于第二电平的第三电平的电容器 水平。 电容器可以具有铝板,或者铜电感器的一部分可以用作其板之一。
    • 45. 发明申请
    • SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
    • 半导体元件及其制造方法
    • US20100123193A1
    • 2010-05-20
    • US12271092
    • 2008-11-14
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • Peter A. BurkeDuane B. BarberBrian Pratt
    • H01L27/088H01L21/28
    • H01L27/088H01L21/823487
    • A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shielding electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shielding electrodes. The gate electrodes in the trenches in the device region are connected to the gate electrodes in the trenches in the gate contact region. The shielding electrodes in the trenches in the device region are connected to the shielding electrodes in the termination region.
    • 包括栅电极和屏蔽电极的半导体部件和制造半导体部件的方法。 半导体材料具有器件区域,栅极接触区域,端接区域和漏极接触区域。 在器件区域中形成一个或多个器件沟槽,并且在边缘端接区域中形成一个或多个端接沟槽。 屏蔽电极形成在与它们的地板相邻的器件沟槽的部分中。 在器件区域的沟槽的侧壁上形成栅极电介质材料,并且在屏蔽电极之间形成栅电极并与屏蔽电极电绝缘。 器件区域中的沟槽中的栅电极连接到栅极接触区域中的沟槽中的栅电极。 器件区域的沟槽中的屏蔽电极与端接区域中的屏蔽电极相连。