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    • 43. 发明申请
    • SELF-RECONFIGURABLE ADDRESS DECODER FOR ASSOCIATIVE INDEX EXTENDED CACHES
    • 自适应地址解码器,用于相关索引扩展的高速缓存
    • US20140025881A1
    • 2014-01-23
    • US13550762
    • 2012-07-17
    • Rajiv V. JoshiAjay N. Bhoj
    • Rajiv V. JoshiAjay N. Bhoj
    • G06F12/08
    • G06F12/0864G06F2212/1021G11C15/04
    • Associative index extended (AIX) caches can be functionally implemented through a reconfigurable decoder that employs programmable line decoding. The reconfigurable decoder features scalability in the number of lines, the number of index extension bits, and the number of banks. The reconfigurable decoder can switch between pure direct mapped (DM) mode and direct mapped-associative index extended (DM-AIX) mode of operation. For banked configurations, the reconfigurable decoder provides the ability to run some banks in DM mode and some other banks in DM-AIX mode. A cache employing this reconfigurable decoder can provide a comparable level of latency as a DM cache with minimal modifications to a DM cache circuitry of an additional logic circuit on a critical signal path, while providing low power operation at low area overhead with SA cache-like miss rates. Address masking and most-recently-used-save replacement policy can be employed with a single bit overhead per line.
    • 关联索引扩展(AIX)缓存可以通过采用可编程线解码的可重构解码器进行功能实现。 可重配置解码器具有线路数量的可扩展性,索引扩展位的数量和存储体的数量。 可重构解码器可以在纯直接映射(DM)模式和直接映射关联索引扩展(DM-AIX)操作模式之间切换。 对于组合配置,可重构解码器能够以DM模式运行某些存储区,并以DM-AIX模式运行其他存储区。 采用该可重构解码器的高速缓存器可以提供与DM高速缓存相当的延迟水平,对关键信号路径上的附加逻辑电路的DM高速缓存电路进行最小修改,同时在低区域开销提供具有SA缓存类似的低功率操作 错过率。 地址掩码和最近使用的保存替换策略可以采用每行一个位开销。
    • 44. 发明申请
    • CIRCUIT FOR MEMORY CELL RECOVERY
    • 用于记忆细胞恢复的电路
    • US20130077415A1
    • 2013-03-28
    • US13247362
    • 2011-09-28
    • Rajiv V. JoshiRouwaida N. KanjJente B. KuangCarl J. Radens
    • Rajiv V. JoshiRouwaida N. KanjJente B. KuangCarl J. Radens
    • G11C7/00
    • G11C7/00G11C7/02G11C7/04G11C11/417G11C11/419
    • An apparatus and method for combating the effects of bias temperature instability (BTI) in a memory cell. Bit lines connecting to a memory cell contain two alternate paths criss-crossing to connect a lower portion of a first bit line to an upper portion of a second bit line, and to connect a lower portion of the second bit line to an upper portion of the first bit line. Alternative to activating transistors on the bit lines to read and write to the memory cell, transistors on the alternative paths may be activated to read and write to the memory cell from the opposite bit lines. The memory cell may be read through the bit lines to a sense amplifier, the transistors on the bit lines are subsequently deactivated and the transistors on the alternate paths are activated to write transposed bit values to the memory cell, thereby reversing the biases.
    • 一种用于抵抗存储单元中偏置温度不稳定性(BTI)的影响的装置和方法。 连接到存储器单元的位线包含两个交替的交替路径,以将第一位线的下部连接到第二位线的上部,并且将第二位线的下部连接到第二位线的上部 第一个位线。 在位线上激活晶体管以读取和写入存储器单元的替代方案是替代路径上的晶体管可被激活以从相对的位线读取和写入存储器单元。 存储器单元可以通过位线读取到读出放大器,位线上的晶体管随后被去激活,并且激活交替路径上的晶体管以将转置的位值写入存储器单元,从而反转偏置。
    • 45. 发明授权
    • Equivalent device statistical modeling for bitline leakage modeling
    • 用于位线泄漏建模的等效设备统计建模
    • US08346528B2
    • 2013-01-01
    • US12551777
    • 2009-09-01
    • Rajiv V. JoshiRouwaida N. KanjSani R. Nassif
    • Rajiv V. JoshiRouwaida N. KanjSani R. Nassif
    • G06F17/50
    • G06F17/5036
    • Mechanisms are provided for modeling a plurality of devices of an integrated circuit design as a single statistically equivalent wide device. An integrated circuit design is analyzed to identify a portion of the integrated circuit design having the plurality of devices. For the plurality of devices, a statistical model of a single statistically equivalent wide device is generated which has a statistical distribution of at least one operating characteristic of the single statistically equivalent wide device that captures statistical operating characteristic distributions of individual devices in the plurality of devices. At least one statistical operating characteristic of the single statistically equivalent wide device is a complex non-linear function of the statistical operating characteristics of the individual devices. The integrated circuit design is modeled using the single statistically equivalent wide device.
    • 提供了用于将集成电路设计的多个装置建模为单个统计上等同的宽装置的机构。 分析集成电路设计以识别具有多个装置的集成电路设计的一部分。 对于多个装置,产生统计模型的单个统计学上等效的宽装置,该统计模型具有捕获多个装置中的各个装置的统计工作特性分布的单个统计学等效的宽装置的至少一个操作特性的统计分布 。 单个统计学等效的宽设备的至少一个统计工作特性是各个设备的统计操作特性的复杂非线性函数。 集成电路设计采用单一统计学上等效的宽设备进行建模。
    • 46. 发明授权
    • Techniques for impeding reverse engineering
    • 阻止逆向工程的技术
    • US08324102B2
    • 2012-12-04
    • US13169248
    • 2011-06-27
    • Louis L. HsuRajiv V. JoshiDavid W. Kruger
    • Louis L. HsuRajiv V. JoshiDavid W. Kruger
    • H01L21/00
    • H01L21/76816H01L21/76825H01L21/76831H01L21/76834H01L23/573H01L27/02H01L27/0203H01L2924/0002H01L2924/00
    • Anti-reverse engineering techniques are provided. In one aspect, a method for forming at least one feature in an insulating layer is provided. The method comprises the following steps. Ions are selectively implanted in the insulating layer so as to form at least one implant region within the insulating layer, the implanted ions being configured to alter an etch rate through the insulating layer within the implant region. The insulating layer is etched to, at the same time, form at least one void both within the implant region and outside of the implant region, wherein the etch rate through the insulating layer within the implant region is different from an etch rate through the insulating layer outside of the implant region. The void is filled with at least one conductor material to form the feature in the insulating layer.
    • 提供了反逆向工程技术。 一方面,提供了一种在绝缘层中形成至少一个特征的方法。 该方法包括以下步骤。 离子选择性地植入绝缘层中,以在绝缘层内形成至少一个注入区域,所述注入离子被配置为改变通过植入区域内的绝缘层的蚀刻速率。 蚀刻绝缘层,同时在植入区域内和植入区域外部形成至少一个空隙,其中通过绝缘层在植入区域内的蚀刻速率与通过绝缘体的蚀刻速率不同 在植入区域外侧。 空隙填充有至少一种导体材料以在绝缘层中形成特征。
    • 47. 发明授权
    • Robust local bit select circuitry to overcome timing mismatch
    • 强大的本地位选择电路,以克服时序不匹配
    • US08184475B2
    • 2012-05-22
    • US12705780
    • 2010-02-15
    • Rajiv V. JoshiRouwaida N. KanjAntonio R. PelellaSudesh Saroop
    • Rajiv V. JoshiRouwaida N. KanjAntonio R. PelellaSudesh Saroop
    • G11C11/41
    • G11C7/12G11C7/18G11C11/413G11C2207/002
    • An integrated circuit can include an SRAM array having cells arranged in columns, each column being connected to true and complementary read local bitlines RLBLT and RLBLC. A local bit-select circuit can be connected to the cells of a column of the SRAM array, which can include first and second pull-down devices for pulling down a respective one of RLBLT and RLBLC at a timing controlled by a write control signal WRT. The circuit can include cross-coupled p-type field effect transistors (“PFETs”) including a first PFET having a gate connected to RLBLT and having a drain connected to RLBLC, and a second PFET of the pair having a gate connected to RLBLC and having a drain connected to RLBLT. A first device can control a strength of the cross-coupled PFETs. A pair of cross-coupled n-type field effect transistors (“NFETs”) can have gates connected to gates of the first and second pull-down devices. A second device can control a strength of the cross-coupled NFETs. The operation of the first and second devices can be controlled by applying first and second signals having programmed levels thereto. The levels of the first and second signals may selectively activate either the first device or the second device, so as to activate either the cross-coupled PFETs or the cross-coupled NFETs at one time.
    • 集成电路可以包括具有排列成列的单元的SRAM阵列,每列连接到真实和互补读局部位线RLBLT和RLBLC。 局部位选择电路可以连接到SRAM阵列的列的单元,其可以包括用于在由写控制信号WRT控制的定时下拉RLBLT和RLBLC中的相应一个的第一和第二下拉器件 。 电路可以包括交叉耦合p型场效应晶体管(“PFET”),其包括具有连接到RLBLT并且具有连接到RLBLC的漏极的栅极的第一PFET,并且具有连接到RLBLC的栅极的第二PFET, 漏极连接到RLBLT。 第一器件可以控制交叉耦合PFET的强度。 一对交叉耦合的n型场效应晶体管(“NFET”)可以具有连接到第一和第二下拉器件的栅极的栅极。 第二器件可以控制交叉耦合NFET的强度。 第一和第二装置的操作可以通过向其施加具有编程电平的第一和第二信号来控制。 第一和第二信号的电平可以选择性地激活第一器件或第二器件,以便一次激活交叉耦合的PFET或交叉耦合的NFET。
    • 49. 发明授权
    • Dielectric interconnect structures and methods for forming the same
    • 介电互连结构及其形成方法
    • US08169077B2
    • 2012-05-01
    • US12185759
    • 2008-08-04
    • Chih-Chao YangLouis C. HsuRajiv V. Joshi
    • Chih-Chao YangLouis C. HsuRajiv V. Joshi
    • H01L23/52
    • H01L21/76834H01L21/76814H01L21/76826H01L21/76843H01L21/76844H01L21/76846
    • Dielectric interconnect structures and methods for forming the same are provided. Specifically, the present invention provides a dielectric interconnect structure having a noble metal layer (e.g., Ru, Ir, Rh, Pt, RuTa, and alloys of Ru, Ir, Rh, Pt, and RuTa) that is formed directly on a modified dielectric surface. In a typical embodiment, the modified dielectric surface is created by treating an exposed dielectric layer of the interconnect structure with a gaseous ion plasma (e.g., Ar, He, Ne, Xe, N2, H2, NH3, and N2H2). Under the present invention, the noble metal layer could be formed directly on an optional glue layer that is maintained only on vertical surfaces of any trench or via formed in the exposed dielectric layer. In addition, the noble metal layer may or may not be provided along an interface between the via and an internal metal layer.
    • 提供介电互连结构及其形成方法。 具体地说,本发明提供一种具有贵金属层(例如,Ru,Ir,Rh,Pt,RuTa以及Ru,Ir,Rh,Pt和RuTa的合金)的电介质互连结构,其直接形成在改性电介质上 表面。 在典型的实施方案中,通过用气态离子等离子体(例如Ar,He,Ne,Xe,N 2,H 2,NH 3和N 2 H 2)处理互连结构的暴露介电层来产生修饰的电介质表面。 在本发明中,贵金属层可以直接形成在只保留在暴露的介电层中形成的任何沟槽或通孔的垂直表面上的任选的胶层上。 此外,贵金属层可以沿着通孔和内部金属层之间的界面设置也可以不设置。