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41. 发明授权

US06227732B1 Sheet package and printer in which sheets are set by the sheet package 失效
标题翻译：纸张包装和打印机，其中纸张由纸张包装设置
公开(公告)号：US06227732B1
公开(公告)日：2001-05-08
申请号：US09156035
申请日：1998-09-17
申请人： Ken Higuchi , Hiroshi Katsuno , Masahide Fujita
发明人： Ken Higuchi , Hiroshi Katsuno , Masahide Fujita
IPC分类号： B41J1310
CPC分类号： B65H1/266 , B41J13/0081 , B41J13/103 , B65D5/5002 , B65D2203/06 , B65D2301/20 , B65H2301/42254 , B65H2405/311
摘要： A sheet package according to the present invention is formed of a synthetic resin sheet and designed in a square-cornered bag shape to have an outer shape corresponding to sheets and a height at which plural sheets are stacked. The sheet package thus constructed is supplied to a user in a state where plural sheets are beforehand stacked and accommodated in a sheet package and packed by a vinyl bag or the like by a sheet maker. Accordingly, the user merely opens the vinyl bag to set the sheets into a sheet tray of a printer by the sheet package.
摘要翻译：根据本发明的片材包装由合成树脂片形成，并且以方形袋形状设计成具有与片材相对应的外形和层叠多个片材的高度。将如此构造的片材包装件预先堆叠并容纳在片材包装中并由片材制造商由乙烯基袋等包装的状态下供给给使用者。因此，用户仅打开乙烯基袋，通过片材包装将片材设置成打印机的片材托盘。

42. 发明授权

US6076982A Ink ribbon assembly 失效
标题翻译：墨带组装
公开(公告)号：US6076982A
公开(公告)日：2000-06-20
申请号：US104054
申请日：1998-06-24
申请人： Hiroshi Katsuno
发明人： Hiroshi Katsuno
IPC分类号： B41J2/36 , B41J17/02 , B41J17/32 , B41J33/52 , B41J35/18 , B41J35/36 , B41J33/02
CPC分类号： B41J35/36 , B41J33/52 , B41J35/18
摘要： An ink ribbon assembly is disclosed which includes an ink ribbon, a support for the ink ribbon and data retention means associated with the support. The support, for example, may be a supply spool, a take-up spool, and a rotatable ring. The data retention means may be a nonvolatile memory. Data indicating the ink ribbon characteristics is stored in the memory. Such data may relate to data correcting production variations of ink, the type of ink on the ribbon, and the amount of ribbon left. The ink ribbon assembly is used with a printer device which reads the data from the data retention means, corrects the image printing information in accordance with the read correction data and performs the printing in accordance with the corrected image printing information.
摘要翻译：公开了一种墨带组件，其包括墨带，用于墨带的支撑件和与支撑件相关联的数据保持装置。支撑件例如可以是供应卷轴，卷取卷轴和可旋转环。数据保持装置可以是非易失性存储器。指示墨带特性的数据存储在存储器中。这样的数据可以涉及墨水的生产变化的数据校正，色带上的墨水类型和剩余的色带的量。墨带组件与从数据保持装置读取数据的打印机装置一起使用，根据读取的校正数据校正图像打印信息，并根据校正的图像打印信息执行打印。

43. 发明授权

US08953092B2 Optical function device and image-capturing device 有权
标题翻译：光功能装置及摄像装置
公开(公告)号：US08953092B2
公开(公告)日：2015-02-10
申请号：US13814701
申请日：2011-07-12
申请人： Yasutoshi Katsuda , Nobuyuki Kodama , Shinichi Hasegawa , Yasuo Maeda , Kazuhiko Kojima , Hiroshi Katsuno
发明人： Yasutoshi Katsuda , Nobuyuki Kodama , Shinichi Hasegawa , Yasuo Maeda , Kazuhiko Kojima , Hiroshi Katsuno
IPC分类号： H04N5/232 , G02B1/11 , G03B13/36 , G03B19/12 , H04N5/225 , G02B27/14
CPC分类号： G02B1/118 , G02B1/11 , G02B27/144 , G03B13/36 , G03B19/12 , H04N5/2254 , H04N5/23212
摘要： An optical function device includes a base material layer, a semi-transparent layer formed on a principal plane of the base material layer, the semi-transparent layer reflecting light of incident light at a ratio determined in advance and passing remaining light; and a reflection prevention layer formed on a principal plane opposite to the principal plane of the base material layer with respect to the base material layer, the reflection prevention layer preventing reflection of the light passing through the base material layer. The image-capturing device includes an optical function device, a first light receiving device for receiving transmission light from the optical function device, and a second light receiving device for receiving reflection light from the optical function device.
摘要翻译：光功能元件包括基材层，形成在基材层的主面上的半透明层，半透明层以预先确定的比例反射入射光的光并通过剩余的光; 以及反射防止层，其形成在相对于基材层与基材层的主面相反的主面上，防反射层防止穿过基材层的光的反射。摄像装置包括光功能装置，用于接收来自光功能装置的透射光的第一光接收装置和用于接收来自光功能装置的反射光的第二光接收装置。

44. 发明授权

US08859307B2 Semiconductor device and method for manufacturing same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08859307B2
公开(公告)日：2014-10-14
申请号：US13601120
申请日：2012-08-31
申请人： Satoshi Mitsugi , Toshiyuki Oka , Shinya Nunoue , Hiroshi Katsuno
发明人： Satoshi Mitsugi , Toshiyuki Oka , Shinya Nunoue , Hiroshi Katsuno
IPC分类号： H01L21/00 , B23K26/00 , B23K26/20 , B23K26/18 , H01L23/34 , H01L23/00
CPC分类号： H01L23/34 , B23K26/0006 , B23K26/009 , B23K26/18 , B23K26/20 , B23K2103/56 , H01L24/29 , H01L24/32 , H01L24/83 , H01L33/0079 , H01L2224/29099 , H01L2224/291 , H01L2224/29139 , H01L2224/29144 , H01L2224/29149 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29166 , H01L2224/29171 , H01L2224/29172 , H01L2224/29184 , H01L2224/32502 , H01L2224/32506 , H01L2224/75262 , H01L2224/75985 , H01L2224/83 , H01L2224/83193 , H01L2224/83224 , H01L2224/83399 , H01L2224/834 , H01L2224/83449 , H01L2224/83455 , H01L2224/83457 , H01L2224/8346 , H01L2224/83466 , H01L2224/83471 , H01L2224/83472 , H01L2224/83484 , H01L2224/83805 , H01L2924/12041 , H01L2924/12042 , H01L2924/351 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01032 , H01L2924/00
摘要： According to an embodiment, a method for manufacturing a semiconductor device includes a placement step and a bonding step. The placement step faces a semiconductor active portion toward a support substrate portion via a bonding portion disposed between the semiconductor active portion and the support substrate portion. The bonding portion includes a bonding layer and a light absorption layer, absorptance of the light absorption layer for laser light being higher than or equal to absorptance of the bonding layer for the laser light. The bonding step bonds the semiconductor active portion and the support substrate portion by irradiating the light absorption layer with the laser light through the support substrate portion and melting the bonding layer by thermal conduction from the light absorption layer heated by the laser light.
摘要翻译：根据实施例，半导体器件的制造方法包括放置步骤和接合步骤。放置步骤经由设置在半导体有源部分和支撑衬底部分之间的接合部分朝向支撑衬底部分面向半导体有源部分。接合部包括接合层和光吸收层，激光用光吸收层的吸收率高于或等于激光接合层的吸收率。接合步骤通过用激光照射光吸收层并通过支撑基板部分粘合半导体活性部分和支撑基板部分，并且通过由激光加热的光吸收层进行热传导来熔化接合层。

45. 发明授权

US08847271B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US08847271B2
公开(公告)日：2014-09-30
申请号：US13729563
申请日：2012-12-28
申请人： Hiroshi Katsuno , Satoshi Mitsugi , Toshihide Ito , Shinya Nunoue
发明人： Hiroshi Katsuno , Satoshi Mitsugi , Toshihide Ito , Shinya Nunoue
IPC分类号： H01L33/38 , H01L29/20 , H01L33/62 , H01L33/22 , H01L33/44 , H01L33/20
CPC分类号： H01L33/42 , H01L29/2003 , H01L33/0025 , H01L33/06 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a second semiconductor layer, a light emitting layer, a dielectric layer, a first electrode, a second electrode and a support substrate. The first layer has a first and second surface. The second layer is provided on a side of the second surface of the first layer. The emitting layer is provided between the first and the second layer. The dielectric layer contacts the second surface and has a refractive index lower than that of the first layer. The first electrode includes a first and second portion. The first portion contacts the second surface and provided adjacent to the dielectric layer. The second portion contacts with an opposite side of the dielectric layer from the first semiconductor layer. The second electrode contacts with an opposite side of the second layer from the emitting layer.
摘要翻译：根据一个实施例，半导体发光器件包括第一半导体层，第二半导体层，发光层，电介质层，第一电极，第二电极和支撑衬底。第一层具有第一和第二表面。第二层设置在第一层的第二表面的一侧。发光层设置在第一和第二层之间。电介质层接触第二表面，折射率低于第一层的折射率。第一电极包括第一和第二部分。第一部分接触第二表面并邻近介电层设置。第二部分与第一半导体层与电介质层的相对侧接触。第二电极与第二层与发光层的相对侧接触。

46. 发明申请

US20130135519A1 OPTICAL FUNCTION DEVICE AND IMAGE-CAPTURING DEVICE 有权
标题翻译：光学功能器件和图像捕获器件
公开(公告)号：US20130135519A1
公开(公告)日：2013-05-30
申请号：US13814701
申请日：2011-07-12
申请人： Yasutoshi Katsuda , Nobuyuki Kodama , Shinichi Hasegawa , Yasuo Maeda , Kazuhiko Kojima , Hiroshi Katsuno
发明人： Yasutoshi Katsuda , Nobuyuki Kodama , Shinichi Hasegawa , Yasuo Maeda , Kazuhiko Kojima , Hiroshi Katsuno
IPC分类号： H04N5/232 , G02B1/11 , G02B27/14
CPC分类号： G02B1/118 , G02B1/11 , G02B27/144 , G03B13/36 , G03B19/12 , H04N5/2254 , H04N5/23212
摘要： An optical function device includes a base material layer, a semi-transparent layer formed on a principal plane of the base material layer, the semi-transparent layer reflecting light of incident light at a ratio determined in advance and passing remaining light; and a reflection prevention layer formed on a principal plane opposite to the principal plane of the base material layer with respect to the base material layer, the reflection prevention layer preventing reflection of the light passing through the base material layer. The image-capturing device includes an optical function device, a first light receiving device for receiving transmission light from the optical function device, and a second light receiving device for receiving reflection light from the optical function device.
摘要翻译：光功能元件包括基材层，形成在基材层的主面上的半透明层，半透明层以预先确定的比例反射入射光的光并通过剩余的光; 以及反射防止层，其形成在相对于基材层与基材层的主面相反的主面上，防反射层防止穿过基材层的光的反射。摄像装置包括光功能装置，用于接收来自光功能装置的透射光的第一光接收装置和用于接收来自光功能装置的反射光的第二光接收装置。

47. 发明申请

US20130087806A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
公开(公告)号：US20130087806A1
公开(公告)日：2013-04-11
申请号：US13404607
申请日：2012-02-24
申请人： Toshihide ITO , Hiroshi Katsuno , Shinya Nunoue
发明人： Toshihide ITO , Hiroshi Katsuno , Shinya Nunoue
IPC分类号： H01L33/32 , H01L33/60
CPC分类号： H01L33/32 , H01L33/0075 , H01L33/405 , H01L33/44 , H01L2933/0016 , H01L2933/0025
摘要： According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a light emitting unit, a second semiconductor layer, a reflecting electrode, an oxide layer and a nitrogen-containing layer. The first semiconductor layer is of a first conductivity type. The light emitting unit is provided on the first semiconductor layer. The second semiconductor layer is provided on the light emitting unit and is of a second conductivity type. The reflecting electrode is provided on the second semiconductor layer and includes Ag. The oxide layer is provided on the reflecting electrode. The oxide layer is insulative and has a first opening. The nitrogen-containing layer is provided on the oxide layer. The nitrogen-containing layer is insulative and has a second opening communicating with the first opening.

48. 发明授权

US07651287B2 Printer device having ink ribbon cartridge with protection plate for thermal head 失效
标题翻译：具有带有热头保护板的墨带盒的打印机装置
公开(公告)号：US07651287B2
公开(公告)日：2010-01-26
申请号：US11712975
申请日：2007-03-02
申请人： Koichi Numata , Kazuyoshi Murata , Hiroshi Katsuno , Sunao Kushiro , Atsushi Yanbe , Shuichi Ota , Hideki Yoneoka
发明人： Koichi Numata , Kazuyoshi Murata , Hiroshi Katsuno , Sunao Kushiro , Atsushi Yanbe , Shuichi Ota , Hideki Yoneoka
IPC分类号： B41J2/32
CPC分类号： B41J2/325
摘要： A printer device is disclosed. The printer device includes: a base chassis that accepts therein and ejects therefrom the printing medium; a top chassis that is disposed to be able to freely open and close in a direction vertical to the basis chassis; an ink ribbon cartridge holder that is disposed between the top chassis and the base chassis, and is attached with an ink ribbon cartridge including therein the ink ribbon; and a thermal head that prints an image to the printing medium by heating the ink ribbon in the ink ribbon cartridge attached to the ink ribbon cartridge holder.
摘要翻译：公开了一种打印机装置。打印机装置包括：底座，其接纳并从中喷射打印介质; 上部底盘，其设置成能够在垂直于底盘的方向上自由地打开和关闭; 设置在顶部底盘和底架之间的墨带盒保持器，并且附着有包括墨带的墨带盒; 以及通过加热安装在色带盒保持器上的色带盒中的色带将图像打印到打印介质的热敏头。

49. 发明授权

US09105810B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US09105810B2
公开(公告)日：2015-08-11
申请号：US13404607
申请日：2012-02-24
申请人： Toshihide Ito , Hiroshi Katsuno , Shinya Nunoue
发明人： Toshihide Ito , Hiroshi Katsuno , Shinya Nunoue
IPC分类号： H01L33/00 , H01L33/32 , H01L33/40
CPC分类号： H01L33/32 , H01L33/0075 , H01L33/405 , H01L33/44 , H01L2933/0016 , H01L2933/0025
摘要： According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a light emitting unit, a second semiconductor layer, a reflecting electrode, an oxide layer and a nitrogen-containing layer. The first semiconductor layer is of a first conductivity type. The light emitting unit is provided on the first semiconductor layer. The second semiconductor layer is provided on the light emitting unit and is of a second conductivity type. The reflecting electrode is provided on the second semiconductor layer and includes Ag. The oxide layer is provided on the reflecting electrode. The oxide layer is insulative and has a first opening. The nitrogen-containing layer is provided on the oxide layer. The nitrogen-containing layer is insulative and has a second opening communicating with the first opening.
摘要翻译：根据一个实施例，半导体发光器件包括第一半导体层，发光单元，第二半导体层，反射电极，氧化物层和含氮层。第一半导体层是第一导电类型。发光单元设置在第一半导体层上。第二半导体层设置在发光单元上并且是第二导电类型。反射电极设置在第二半导体层上并且包括Ag。氧化物层设置在反射电极上。氧化物层是绝缘的并且具有第一开口。含氧层设置在氧化物层上。含氮层是绝缘的，并且具有与第一开口连通的第二开口。

50. 发明申请

US20130075374A1 MEMBER SEPARATION APPARATUS AND MEMBER SEPARATION METHOD 审中-公开
标题翻译：会员分离装置和会员分离方法
公开(公告)号：US20130075374A1
公开(公告)日：2013-03-28
申请号：US13404698
申请日：2012-02-24
申请人： Satoshi MITSUGI , Hiroshi Katsuno
发明人： Satoshi MITSUGI , Hiroshi Katsuno
IPC分类号： B23K26/00
CPC分类号： H01L33/0079 , B23K26/0613 , B23K26/361
摘要： According to one embodiment, a member separation apparatus includes a stage and a light source. The stage is configured to mount a workpiece. The workpiece includes a first member and a second member. The first member is transmissive to light in a wavelength region. The wavelength region includes a first wavelength. The second member contacts with the first member. The second member has a higher absorptance for light in the wavelength region than the first member. The light source generates laser light and irradiates the workpiece with the laser light. The laser light contains a component of the first wavelength and a component of a second wavelength. The second wavelength includes the wavelength region different from the first wavelength.
摘要翻译：根据一个实施例，构件分离装置包括平台和光源。工作台配置为安装工件。工件包括第一构件和第二构件。第一构件对波长区域中的光透射。波长区域包括第一波长。第二个成员与第一个成员接触。第二部件对波长区域的光的吸收率比第一部件高。光源产生激光并用激光照射工件。激光包含第一波长的分量和第二波长的分量。第二波长包括与第一波长不同的波长区域。

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