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41. 发明申请

US20090250717A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20090250717A1
公开(公告)日：2009-10-08
申请号：US12487651
申请日：2009-06-19
申请人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
发明人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L2224/16 , H01L2224/48091 , H01L2924/01068 , H01L2924/01079 , H01L2924/00014
摘要： A light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof, and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light reflecting portion is disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency.
摘要翻译：发光装置包括：发光元件，其具有设置在其光输出表面侧的至少两个电极;以及基座部件，具有凹部和与电极对应的引线部分，发光元件安装在基座部件上并且容纳在凹部中，其中光输出表面面向凹口的开口，其在接近光输出表面时变小，并且电极分别与从连接位置延伸到外部边缘的引线部分电连接用于电源连接的基座构件，并且光反射部分设置在与光输出表面相邻的凹部中，使得从发光元件发射的光可以被反射到凹部的壁以形成基本上准直的光束，从而提高光效。

42. 发明申请

US20090246477A1 ASSEMBLY STRUCTURE 有权
标题翻译：装配结构
公开(公告)号：US20090246477A1
公开(公告)日：2009-10-01
申请号：US12125250
申请日：2008-05-22
申请人： Ming-Te Lin , Chin-Yung Chen
发明人： Ming-Te Lin , Chin-Yung Chen
IPC分类号： B32B3/00 , B32B9/00
CPC分类号： H05K3/361 , H05K1/117 , H05K3/323 , H05K2201/09418 , Y10T428/24752 , Y10T428/31504
摘要： An assembly structure is provided. The assembly structure includes a first substrate, a second substrate and a medium layer disposed between the first and second substrates. The medium layer includes a side edge, and the second substrate includes at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer.
摘要翻译：提供组装结构。组装结构包括第一衬底，第二衬底和布置在第一和第二衬底之间的介质层。所述介质层包括侧边缘，并且所述第二基板包括至少一根引线。当第二基板设置在介质层上时，第二基板的引线相对于介质层的侧边缘倾斜。

43. 发明授权

US07544524B2 Alternating current light-emitting device 有权
标题翻译：交流发光装置
公开(公告)号：US07544524B2
公开(公告)日：2009-06-09
申请号：US11432366
申请日：2006-05-12
申请人： Ming-Te Lin , Hsi-Hsuan Yen , Wen-Yung Yeh , Ming-Yao Lin , Sheng-Pan Huang
发明人： Ming-Te Lin , Hsi-Hsuan Yen , Wen-Yung Yeh , Ming-Yao Lin , Sheng-Pan Huang
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , H01L2924/0002 , H05B33/0803 , H05B33/0821 , H01L2924/00
摘要： An alternating current light-emitting device and the fabrication method thereof is disclosed. The alternating current light-emitting device includes at least one alternating current micro-die light-emitting module formed on a substrate and composed of at least two micro-dies connected to one another. The micro-dies, each includes at least two active layers, are electrically connected by a conductive structure, such that the active layers of the micro-dies take turns emitting light during positive and negative half cycles of alternating current, thereby providing a full-scale light-emitting area for all-time light emission.
摘要翻译：公开了一种交流发光器件及其制造方法。交流发光装置包括至少一个形成在基板上并由至少两个彼此连接的微模组成的交流微模发光模块。微管芯每个包括至少两个有源层，通过导电结构电连接，使得微管的有源层在交流电的正半周期和负半周期内轮流发光，规模发光面积全面发光。

44. 发明申请

US20070138495A1 AC_LED System in Single Chip with Three Metal Contacts 有权
标题翻译：具有三个金属触点的单芯片AC_LED系统
公开(公告)号：US20070138495A1
公开(公告)日：2007-06-21
申请号：US11608786
申请日：2006-12-08
申请人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
发明人： Ming-Te Lin , Wen-Yung Yeh , Chia-Chang Kuo , Hsi-Hsuan Yen , Sheng-Pan Huang
IPC分类号： H01L33/00
CPC分类号： H05B33/0803 , H05B33/0809 , H05B33/0821
摘要： A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip with three metal contacts to be driven by three-phase voltage sources. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed to be driven by four-phase voltage sources.
摘要翻译：多个AC_LED单元耦合并设置在单个芯片上以形成单芯片中的AC_LED系统，其中三个金属触点由三相电压源驱动。或者，也公开了具有四个金属触点的单芯片中的AC LED系统由四相电压源驱动。

45. 发明申请

US20070069219A1 Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：US20070069219A1
公开(公告)日：2007-03-29
申请号：US11429235
申请日：2006-05-08
申请人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
发明人： Ming-Te Lin , Ming-Yao Lin , Chia-Chang Kuo , Sheng-Pan Huang , Wen-Yung Yeh
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L2224/16 , H01L2224/48091 , H01L2924/01068 , H01L2924/01079 , H01L2924/00014
摘要： A light emitting device is proposed, which emits light while connected to the power. The light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection. The light emitting device of the present invention has advantages of short current path, low series thermal resistance and low cost. In addition, the depth of the recess can further be increased to improve light collecting efficiency.
摘要翻译：提出了一种发光装置，其在连接到电源时发光。发光装置包括发光元件，其具有设置在其光输出表面侧的至少两个电极; 以及具有凹部的基座部件和与电极对应的引线部，所述发光元件安装在所述基座部件上并被容纳在所述凹部中，其中，所述光输出面朝向所述凹部的开口，所述凹部在接近所述光输出时变小表面，并且电极分别与从基座的连接位置延伸到外缘的引线部分电连接以进行电力连接。本发明的发光器件具有电流路短，串联热阻低，成本低的优点。此外，可以进一步增加凹部的深度，以提高聚光效率。

46. 发明授权

US07089628B2 Hinge design for a computer 有权
公开(公告)号：US07089628B2
公开(公告)日：2006-08-15
申请号：US10942006
申请日：2004-09-16
申请人： Ming-Te Lin , Chih-Feng Jian , Yung-Lu Wu
发明人： Ming-Te Lin , Chih-Feng Jian , Yung-Lu Wu
IPC分类号： E05C17/64
CPC分类号： G06F1/1637 , G06F1/1616 , G06F1/1681 , Y10T16/5403 , Y10T16/54038
摘要： A new hinge design is used to connect a base unit and its display panel of a notebook computer. The new hinge design consists of a hinge bracket and a hinge shaft. The hinge bracket consists of a horizontal band, a vertical band, a barrel part and a bent band. The horizontal band and the vertical band are both mounted inside the base unit via holes thereon. The bent band bends from the vertical to the desired direction so as to shift a position of the hinge shaft. Owing to the position shift of the hinge shaft, the center of gravity of a notebook computer will also shift. The hinge shaft includes an attachment plate for mounting on the display panel.

47. 发明授权

US06797984B1 Light-emitting diode packaging structure having rectification circuit 有权
标题翻译：具有整流电路的发光二极管封装结构
公开(公告)号：US06797984B1
公开(公告)日：2004-09-28
申请号：US10658330
申请日：2003-09-10
申请人： Ming-Te Lin , Ming-Yao Lin
发明人： Ming-Te Lin , Ming-Yao Lin
IPC分类号： H01L3112
CPC分类号： H05B33/0821 , H01L25/167 , H01L2224/48091 , H01L2224/48247 , H05B33/0803 , H01L2924/00014
摘要： A light emitting diode (LED) packaging structure with built-in rectification circuit is disclosed. The LED packaging structure includes an LED and a rectification circuit is formed inside the LED. Thus, the LED packaging structure is capable to receive an alternate current from an electrical main by the rectification circuit which converts the alternate current into a direct current for the LED whereby the LED can be directly connected to the electrical main and powered thereby without use of additional and external rectification device.
摘要翻译：公开了一种具有内置整流电路的发光二极管（LED）封装结构。 LED封装结构包括LED，LED内部形成整流电路。因此，LED封装结构能够通过整流电路接收来自电主机的交流电流，该整流电路将交流电流转换为LED的直流电流，由此LED可以直接连接到电主机并由此供电，而不使用附加和外部整流装置。

48. 发明授权

US5564581A Vacuum canister 失效
标题翻译：真空罐
公开(公告)号：US5564581A
公开(公告)日：1996-10-15
申请号：US518445
申请日：1995-08-23
申请人： Ming-Te Lin
发明人： Ming-Te Lin
IPC分类号： B65B31/04 , B65D81/20 , B65D51/16 , B65D55/00
CPC分类号： B65B31/047 , B65D81/2038
摘要： A vacuum canister comprises a container section and a cover with an integrally formed air suction device. The air suction device includes a sleeve pipe, an eduction membrane and a piston tube. One end of the sleeve pipe has an anchor plate and a grating plate. A flexible eduction membrane is located between the anchor plate and the grating plate, and fastened to the anchor plate. The anchor plate has a flow hole therethrough and the grating plate has an air hole therethrough. The membrane is movable between a first position in which the membrane allows airflow through the air hole and a second position in which the membrane blocks airflow through the air hole. The piston tube is received by, and moves within, the sleeve pipe. One end of the piston tube has a front retaining edge, a rear retaining edge, and a flexible O-ring movable therebetween. The front and rear retaining ends are separated by an interval of space. The O-ring has a thickness smaller than the interval of space. The piston tube also has a relief hole formed therethrough along a portion of the interval of space. The O-ring moves within the interval of space between a first position in which the O-ring blocks airflow through the relief hole and a second position in which the O-ring does not block airflow the relief hole. The piston tube further has an overflow hole near its other end for ultimately expelling air from the canister.
摘要翻译：真空罐包括容器部分和具有整体形成的空气抽吸装置的盖子。吸气装置包括套管，排气膜和活塞管。套管的一端具有锚板和格栅板。柔性排水膜位于锚板和格栅板之间，并固定在锚板上。锚板具有穿过其中的流动孔，并且格栅板具有穿过其中的空气孔。膜可在其中膜允许气流通过空气孔的第一位置和第二位置之间移动，在第二位置，膜阻挡通过气孔的气流。活塞管由套筒管接收并移动。活塞管的一端具有前保持边缘，后保持边缘和可在其间移动的柔性O形环。前后保持端与空间间隔开。 O形环的厚度小于空间的间隔。活塞管还具有沿空间间隔的一部分形成的释放孔。所述O形环在所述O形环阻止通过所述释放孔的气流的第一位置与所述O形环不阻挡所述排放孔的第二位置之间的空间间隔内移动。活塞管在其另一端附近还具有溢流孔，以最终从罐排出空气。

49. 发明授权

US08931924B2 Heat sink for LED lamp 有权
标题翻译： LED灯泡散热片
公开(公告)号：US08931924B2
公开(公告)日：2015-01-13
申请号：US13270582
申请日：2011-10-11
申请人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
发明人： Ming-Te Lin , Ming-Yao Lin , Heng Qiu
IPC分类号： F21V29/00 , F21K99/00 , F21V3/02 , F21V3/00
CPC分类号： F21K9/23 , F21V3/02 , F21V29/506 , F21V29/777 , F21V29/83 , F21V29/86 , F21V29/89 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A LED lamp is disclosed which is composed of a plurality of light unit, each of the light unit has metal its leads inserted into a heat sink for heat dissipation. A circuit board is optionally to use for electrically coupling the metal leads of each light unit to a control circuit for controlling the on/off of each of the light units.
摘要翻译：公开了一种LED灯，其由多个光单元组成，每个灯单元具有金属引线，其插入散热器中用于散热。电路板可选地用于将每个光单元的金属引线电耦合到用于控制每个光单元的开/关的控制电路。

50. 发明授权

US08502250B2 Light emitting diode package and light emitting diode module 有权
标题翻译：发光二极管封装和发光二极管模块
公开(公告)号：US08502250B2
公开(公告)日：2013-08-06
申请号：US12980358
申请日：2010-12-29
申请人： Ming-Te Lin , Ming-Yao Lin , Sheng-Chieh Tai , Chih-Hsuan Liu , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Sheng-Chieh Tai , Chih-Hsuan Liu , Kuang-Yu Tai
IPC分类号： H01L33/60 , H01L33/08
CPC分类号： F21V3/00 , F21K9/232 , F21V29/67 , F21V29/677 , F21V29/70 , F21Y2107/40 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided.
摘要翻译：提供了包括载体，LED芯片，透镜和荧光体层的发光二极管（LED）封装。设置在载体上的LED芯片。封装LED芯片的透镜具有围绕LED芯片的多个翅片和圆锥形凹口。翅片径向向后延伸LED芯片。每个翅片具有至少一个发光表面和邻近发光表面的至少一个反射表面。锥形凹陷的底面作为全反射面。荧光体层设置在透镜的发光面上。还提供LED封装和LED模块。

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