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    • 41. 发明授权
    • Resist stripping methods using backfilling material layer
    • 使用回填材料层的抗剥落方法
    • US07935637B2
    • 2011-05-03
    • US11839934
    • 2007-08-16
    • Nicholas C. M. FullerSivananda KanakasabapathyYing Zhang
    • Nicholas C. M. FullerSivananda KanakasabapathyYing Zhang
    • H01L21/302H01L21/461
    • H01L21/31133H01L21/31058H01L21/31138
    • A method for fabricating a microelectronic structure provides for forming a backfilling material layer at least laterally adjacent, and preferably laterally adjoining, a resist layer located over a substrate. Preferably, the resist layer comprises a surface treated resist layer. Optionally, the backfilling material layer may be surface treated similarly to the surface treated resist layer. Under such circumstances: (1) surface portions of the backfilling material layer and resist layer; and (2) remaining portions of the backfilling material layer and resist layer, may be sequentially stripped using a two step etch method, such as a two step plasma etch method. Alternatively, a surface portion of the surface treated resist layer only may be stripped while using a first etch method, and the remaining portions of the resist layer and backfilling material layer may be planarized prior to being simultaneously stripped while using a second etch method.
    • 用于制造微电子结构的方法提供了形成位于衬底上方的至少侧向邻近且优选地横向邻接的抗蚀剂层的回填材料层。 优选地,抗蚀剂层包括表面处理的抗蚀剂层。 任选地,回填材料层可以与表面处理的抗蚀剂层类似地进行表面处理。 在这种情况下:(1)回填材料层和抗蚀剂层的表面部分; 和(2)回填材料层和抗蚀剂层的剩余部分可以使用两步蚀刻方法,例如两步等离子体蚀刻方法来顺序剥离。 或者,仅使用第一蚀刻方法剥离表面处理的抗蚀剂层的表面部分,并且可以在使用第二蚀刻方法同时剥离之前将抗蚀剂层和回填材料层的其余部分平坦化。
    • 43. 发明授权
    • Flexible polymer, particles prepared therefrom and process for preparing the same
    • 柔性聚合物,由其制备的颗粒及其制备方法
    • US07867952B2
    • 2011-01-11
    • US12001956
    • 2007-12-12
    • Pingmei WangJianhui LuoYuzhang LiuHuaijiang ZhuChunming XiongQiang LiuRuyi JiangYikun LiYing Zhang
    • Pingmei WangJianhui LuoYuzhang LiuHuaijiang ZhuChunming XiongQiang LiuRuyi JiangYikun LiYing Zhang
    • C07C43/00
    • C09K8/516C08F222/26C08F236/10C09K2208/18
    • Disclosed are a flexible polymer, particles made from same, and a process for preparing the particles. This flexible polymer is obtained from copolymerizing monomer (A) and monomer (B), wherein monomer (A) is one or more water-insoluble unsaturated diene monomers; monomer (B) is at least one compound with the general formula of wherein R is C1-C12alkyl, C1-C12 alkyl aryl, C1-C12 alkyl ether or C1-C12alkyl ester. Monomer (A) is in an amount of 60-90% by weight of the total combined weight of monomer (A) and monomer (B). Monomer (B) is in an amount of 10-40% by weight of the total combined weight of monomer (A) and monomer (B). The flexible polymer particles show excellent flexibility, deformability, elasticity as well as stability. They can be used in oilfields in nearby wellbore profile control and in-depth profile control or as in-depth flooding fluid diverting agents. They can also be applied in water shutoff in high temperature and high salinity production wells; preventing chemical channeling in polymer and ASP (alkali-surfactant-polymer) flooding; temporarily plugging in acidization; huff and puff; and preventing in-depth channeling in steam flooding, loss of circulation control and filtration control, and the like.
    • 公开了柔性聚合物,由其制成的颗粒和制备颗粒的方法。 该柔性聚合物由共聚单体(A)和单体(B)得到,其中单体(A)为一种或多种水不溶性不饱和二烯单体; 单体(B)是至少一种具有通式的化合物,其中R是C 1 -C 12烷基,C 1 -C 12烷基芳基,C 1 -C 12烷基醚或C 1 -C 12烷基酯。 单体(A)的单体(A)和单体(B)的总组合重量的60-90重量%。 单体(B)的单体(A)和单体(B)的总组合重量的量为10-40重量%。 柔性聚合物颗粒显示出优异的柔韧性,变形性,弹性以及稳定性。 它们可用于油田附近的井筒剖面控制和深度剖面控制,或用作深度淹没液体转向剂。 也可应用于高温高盐生产井的关闭水中; 防止聚合物和ASP(碱 - 表面活性剂 - 聚合物)淹水中的化学通道; 暂时酸化; 气喘吁吁; 并防止蒸汽溢流的深入沟通,流通控制和过滤控制的损失等。
    • 47. 发明授权
    • Method of making double-gated self-aligned finFET having gates of different lengths
    • 制造具有不同长度的栅极的双门控自对准finFET的方法
    • US07785944B2
    • 2010-08-31
    • US12077973
    • 2008-03-24
    • Huilong ZhuBruce B. DorisXinlin WangJochen BeintnerYing ZhangPhilip J. Oldiges
    • Huilong ZhuBruce B. DorisXinlin WangJochen BeintnerYing ZhangPhilip J. Oldiges
    • H01L21/84
    • H01L29/785H01L29/66795H01L29/7855H01L29/7856
    • A method is provided of making a gated semiconductor device. Such method can include patterning a single-crystal semiconductor region of a substrate to extend in a lateral direction parallel to a major surface of a substrate and to extend in a direction at least substantially vertical and at least substantially perpendicular to the major surface, the semiconductor region having a first side and a second side opposite, e.g., remote from the first side. A first gate may be formed overlying the first side, the first gate having a first gate length in the lateral direction. A second gate may be formed overlying the second side, the second gate having a second gate length in the lateral direction which is different from the first gate length. In one embodiment, the second gate length may be shorter than the first gate length. In one embodiment, the first gate may consist essentially of polycrystalline silicon germanium and the second gate may consist essentially of polysilicon.
    • 提供了一种制造门控半导体器件的方法。 这种方法可以包括图案化衬底的单晶半导体区域,以在与衬底的主表面平行的横向方向上延伸并且沿至少基本上垂直且至少基本垂直于主表面的方向延伸,半导体 区域具有第一侧和第二侧,例如远离第一侧。 第一栅极可以形成在第一侧上,第一栅极在横向上具有第一栅极长度。 第二栅极可以形成在第二侧上,第二栅极在横向上具有与第一栅极长度不同的第二栅极长度。 在一个实施例中,第二栅极长度可以比​​第一栅极长度短。 在一个实施例中,第一栅极可以主要由多晶硅锗组成,第二栅极可以由多晶硅组成。
    • 50. 发明授权
    • Structures and methods for making strained MOSFETs
    • 制造应变MOSFET的结构和方法
    • US07749842B2
    • 2010-07-06
    • US11754627
    • 2007-05-29
    • Huilong ZhuSteven W. BedellBruce B. DorisYing Zhang
    • Huilong ZhuSteven W. BedellBruce B. DorisYing Zhang
    • H01L21/336
    • H01L29/785H01L29/66795H01L29/7842H01L29/78687
    • A method and device providing a strained Si film with reduced defects is provided, where the strained Si film forms a fin vertically oriented on a surface of a non-conductive substrate. The strained Si film or fin may form a semiconductor channel having relatively small dimensions while also having few defects. The strained Si fin is formed by growing Si on the side of a relaxed SiGe block. A dielectric gate, such as, for example, an oxide, a high “k” material, or a combination of the two, may be formed on a surface of the strained Si film. Additionally, without substantially affecting the stress in the strained Si film, the relaxed SiGe block may be removed to allow a second gate oxide to be formed on the surface previously occupied by the relaxed SiGe block. Accordingly, a semiconductor device having a strained Si fin vertically oriented on a non-conductive substrate may be formed where the strained Si film is oriented such that it may form a channel of small dimensions allowing access to both sides and top in order to from single gate, double gate, or more gate MOSFETs and finFETs with a channel having a reduced number of defects and/or reduced dimensions.
    • 提供了提供具有减小的缺陷的应变Si膜的方法和装置,其中应变Si膜在非导电基板的表面上形成垂直取向的翅片。 应变Si膜或翅片可以形成具有相对较小尺寸的半导体通道,同时也具有很少的缺陷。 应变Si翅片通过在松弛的SiGe块的一侧生长Si而形成。 可以在应变Si膜的表面上形成诸如氧化物,高“k”材料或两者的组合的电介质栅极。 另外,在基本上不影响应变Si膜中的应力的情况下,可以去除弛豫的SiGe块,以允许在松弛的SiGe块先前占据的表面上形成第二栅极氧化物。 因此,可以形成具有垂直取向在非导电衬底上的应变Si鳍片的半导体器件,其中应变Si膜被定向成使得其可以形成允许接近两侧和顶部的小尺寸的通道,以便从单个 栅极,双栅极或更多栅极MOSFET和finFET,沟道具有减少的缺陷数量和/或减小的尺寸。