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    • 41. 发明授权
    • Enhanced resist strip in a dielectric etcher using downstream plasma
    • 使用下游等离子体的介质蚀刻器中增强的抗蚀剂条
    • US06362110B1
    • 2002-03-26
    • US09539294
    • 2000-03-30
    • Jeffrey Marks
    • Jeffrey Marks
    • H01L213065
    • H01J37/32082G03F7/427H01J37/32357H01J2237/3342H01L21/31138
    • A method and apparatus for performing a dielectric etch, etch mask stripping, and etch chamber clean. A wafer is placed in an etch chamber. A dielectric etch is performed on the wafer using an in situ plasma generated by an in situ plasma device in the etch chamber. The etch mask is stripped using a remote plasma generated in a remote plasma device connected to the etch chamber. The wafer is removed from the etch chamber and either the in situ plasma or the remote plasma may be used to clean the etch chamber. In etch chambers that do not use confinement rings, a heater may be used to heat the etch chamber wall to provide improved cleaning.
    • 用于执行电介质蚀刻,蚀刻掩模剥离和蚀刻室清洁的方法和装置。 将晶片放置在蚀刻室中。 使用在蚀刻室中由原位等离子体装置产生的原位等离子体在晶片上进行电介质蚀刻。 使用在连接到蚀刻室的远程等离子体装置中产生的远程等离子体来剥离蚀刻掩模。 晶片从蚀刻室中移除,原位等离子体或远程等离子体可用于清洁蚀刻室。 在不使用限制环的蚀刻室中,可以使用加热器来加热蚀刻室壁以提供改进的清洁。
    • 46. 发明申请
    • Reduction of etch mask feature critical dimensions
    • 蚀刻掩模的减少具有关键尺寸
    • US20060134917A1
    • 2006-06-22
    • US11016455
    • 2004-12-16
    • Zhisong HuangS.M. SadjadiJeffrey Marks
    • Zhisong HuangS.M. SadjadiJeffrey Marks
    • H01L21/4757C23F1/00
    • H01L21/67069H01L21/0337H01L21/0338H01L21/31144
    • A method for forming features in an etch layer in an etch stack with an etch mask over the etch layer, wherein the etch mask has etch mask features with sidewalls, where the etch mask features have a first critical dimension, is provided. A cyclical critical dimension reduction is performed to form deposition layer features with a second critical dimension, which is less than the first critical dimension. Each cycle, comprises a depositing phase for depositing a deposition layer over the exposed surfaces, including the vertical sidewalls, of the etch mask features and an etching phase for etching back the deposition layer leaving a selective deposition on the vertical sidewalls. Features are etched into the etch layer, wherein the etch layer features have a third critical dimension, which is less than the first critical dimension.
    • 一种用于在蚀刻层上的蚀刻层中形成蚀刻层中的特征的方法,其中蚀刻掩模具有带侧壁的蚀刻掩模特征,其中蚀刻掩模特征具有第一临界尺寸。 执行周期性临界尺寸降低以形成具有小于第一临界尺寸的第二临界尺寸的沉积层特征。 每个循环包括沉积相,用于在包括垂直侧壁的蚀刻掩模特征的暴露表面上沉积沉积层,以及用于蚀刻回沉积层的蚀刻阶段,在垂直侧壁上留下选择性沉积。 将特征蚀刻到蚀刻层中,其中蚀刻层特征具有小于第一临界尺寸的第三临界尺寸。
    • 47. 发明授权
    • Method for planarizing an integrated circuit structure using low melting
inorganic material
    • 使用低熔点无机材料平面化集成电路结构的方法
    • US5204288A
    • 1993-04-20
    • US845544
    • 1992-03-04
    • Jeffrey MarksKam S. LawDavid N. WangDan Maydan
    • Jeffrey MarksKam S. LawDavid N. WangDan Maydan
    • H01L21/3105H01L21/316H01L21/768H01L23/31
    • H01L21/3105H01L21/31055H01L21/31604H01L21/76819H01L23/3157H01L2924/0002Y10S148/133Y10S438/913
    • A planarizing process for planarizing an integrated circuit structure in a CVD apparatus is disclosed using a low melting inorganic planarizing material which comprises flowing white depositing a low melting inorganic planarizing layer such as a boron oxide glass over a layer of insulating material such as an oxide of silicon, then dry etching the low melting inorganic planarizing layer to planarize the structure, and then depositing a further layer of an insulating material to encapsulate any remaining portions of the low melting glass planarizing layer which may be hygroscopic. The method eliminates the need for separate coating, drying, and curing steps associated with the application of organic-based planarizing layers usually carried out outside of a vacuum apparatus. In a preferred embodiment, the deposition steps and the etching step are all carried out without removing the integrated circuit structure from the apparatus. In a particularly preferred embodiment, all of the steps are carried out in the same chamber of the apparatus. An additional etching step may be carried out after depositing the first insulating layer and prior to deposition of the planarizing layer to remove any voids formed in the insulating layer.
    • 公开了使用低熔点无机平面化材料来平坦化CVD装置中的集成电路结构的平面化工艺,该无机平面化材料包括使诸如氧化硼玻璃之类的低熔点无机平面化层在诸如氧化物 硅,然后干法蚀刻低熔点无机平面化层以使结构平坦化,然后沉积另外的绝缘材料层以封装可能是吸湿性的低熔点玻璃平坦化层的任何剩余部分。 该方法消除了对通常在真空装置外进行的有机基平坦化层的应用的独立涂布,干燥和固化步骤的需要。 在优选实施例中,沉积步骤和蚀刻步骤全部进行而不从集成电路结构从设备中移除。 在特别优选的实施例中,所有步骤在装置的相同腔室中进行。 在沉积第一绝缘层之后并且在沉积平坦化层以去除在绝缘层中形成的任何空隙之前,可以进行另外的蚀刻步骤。
    • 48. 发明申请
    • CVD BASED METAL/SEMICONDUCTOR OHMIC CONTACT FOR HIGH VOLUME MANUFACTURING APPLICATIONS
    • 基于CVD的金属/半导体OHMIC联系人用于高容量制造应用
    • US20140308812A1
    • 2014-10-16
    • US13862048
    • 2013-04-12
    • Reza ArghavaniJeffrey MarksBenjamin A. Bonner
    • Reza ArghavaniJeffrey MarksBenjamin A. Bonner
    • H01L21/768H01L21/67
    • H01L21/7688H01L21/285H01L21/76831H01L21/76834H01L23/485H01L29/0895H01L2924/0002H01L2924/00
    • An apparatus and method for manufacturing an interconnect structure to provide ohmic contact in a semiconductor device is provided. The method includes providing a semiconductor device, such as a transistor, comprising a substrate, a gate dielectric, a gate electrode, and source and drain regions in the substrate. An ultra-thin interfacial dielectric is deposited by chemical vapor deposition (CVD) over the source and drain regions, where the interfacial dielectric can have a thickness between about 3 Å and about 20 Å. The ultra-thin interfacial dielectric is configured to unpin the metal Fermi level from the source and drain regions. Other steps such as the deposition of a metal by CVD and the cleaning of the substrate surface can be performed in an integrated process tool without a vacuum break. The method further includes forming one or more vias through a pre-metal dielectric over the source and drain regions of the substrate.
    • 提供一种用于制造在半导体器件中提供欧姆接触的互连结构的装置和方法。 该方法包括在衬底中提供诸如晶体管的半导体器件,其包括衬底,栅极电介质,栅极电极以及源极和漏极区域。 通过在源极和漏极区域上的化学气相沉积(CVD)沉积超薄界面电介质,其中界面电介质可以具有在约和之间的厚度。 超薄界面电介质被配置为从源极和漏极区域去除金属费米能级。 其他步骤,例如通过CVD沉积金属和清洁基板表面可以在没有真空断裂的集成工艺工具中进行。 该方法还包括在衬底的源极和漏极区域上形成通过前金属电介质的一个或多个通孔。
    • 49. 发明申请
    • Pitch reduction
    • 节距减少
    • US20070264830A1
    • 2007-11-15
    • US11432194
    • 2006-05-10
    • Zhisong HuangJeffrey MarksS.M. Sadjadi
    • Zhisong HuangJeffrey MarksS.M. Sadjadi
    • H01L21/311H01L21/306
    • H01L21/0337H01L21/0338H01L21/3086H01L21/3088H01L21/31144H01L21/32139
    • A method for providing features in an etch layer is provided. A sacrificial patterned layer with sacrificial features is provided over an etch layer. Conformal sidewalls are formed in the sacrificial features, comprising at least two cycles of a sidewall formation process, wherein each cycle comprises a sidewall deposition phase and a sidewall profile shaping phase. Parts of the sacrificial patterned layer between conformal sidewalls are removed leaving the conformal sidewalls with gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed. Features are etched in the etch layer using the conformal sidewalls as an etch mask, wherein the features in the etch layer are etched through the gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed.
    • 提供了一种用于在蚀刻层中提供特征的方法。 在蚀刻层上提供具有牺牲特征的牺牲图案层。 保形侧壁形成在牺牲特征中,包括侧壁形成工艺的至少两个循环,其中每个循环包括侧壁沉积阶段和侧壁轮廓成形阶段。 除去共形侧壁之间的牺牲图案层的部分,留下保形侧壁,其中保形侧壁之间的间隙被选择性地去除牺牲图案层的部分。 使用保形侧壁作为蚀刻掩模在蚀刻层中蚀刻特征,其中蚀刻层中的特征被蚀刻通过牺牲图案层的部分被选择性去除的共形侧壁之间的间隙。