会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 44. 发明授权
    • Semiconductor photonic element, method of fabricating the same, and semiconductor photonic device equipped therewith
    • 半导体光子元件及其制造方法以及配备有该半导体光子器件的半导体光子器件
    • US06323507B1
    • 2001-11-27
    • US09488508
    • 2000-01-20
    • Yoshitaka YokoyamaKoji KudoMasayoshi Tsuji
    • Yoshitaka YokoyamaKoji KudoMasayoshi Tsuji
    • H01L3300
    • H01S5/227H01S5/0265H01S5/2077H01S5/2215H01S5/2272H01S5/4031H01S5/4087
    • A semiconductor photonic element is provided, which realize low threshold current and satisfactory characteristics in the high temperatures and/or high output operating condition. This element is comprised of (a) a semiconductor substrate; (b) a mesa structure formed on a first surface of the substrate to extend in a specific direction; the mesa structure including an active layer and a pair of p- and n-type cladding layers located respectively at top and bottom sides of the active layer, forming a double heterojunction; (c)a current-constricting structure for constricting an injection current formed at each side of the mesa structure to expose a top of the mesa structure from the current-constricting structure; the current-constricting structure comprising a first current-blocking part and a second current-blocking part; the first current-blocking part having a dielectric current-blocking layer that extends to the mesa structure; the dielectric current-blocking layer being contacted with top edges of the mesa structure; the second current-blocking part having a semiconductor current-blocking layer; and (d) a semiconductor burying layer formed to cover the mesa structure and the multilayer current-constricting structure; the semiconductor burying layer being contacted with the top of the mesa structure.
    • 提供半导体光子元件,其在高温和/或高输出操作条件下实现低阈值电流和令人满意的特性。 该元件由(a)半导体衬底构成; (b)形成在所述基板的第一表面上以沿特定方向延伸的台面结构; 所述台面结构包括分别位于所述有源层的顶侧和底侧的有源层和一对p型和n型覆层,形成双异质结; (c)用于收缩形成在台面结构的每一侧的注入电流的电流收缩结构,以从电流收缩结构暴露台面结构的顶部; 所述电流收缩结构包括第一电流阻挡部分和第二电流阻挡部分; 所述第一电流阻挡部分具有延伸到所述台面结构的介电阻流层; 所述介质电流阻挡层与所述台面结构的顶部边缘接触; 所述第二电流阻挡部分具有半导体电流阻挡层; 以及(d)形成为覆盖所述台面结构和所述多层电流收缩结构的半导体掩埋层; 半导体掩埋层与台面结构的顶部接触。
    • 46. 发明授权
    • Chip packaging means and supply mechanism for supplying chips by using
the chip packaging means
    • 用于通过使用芯片封装装置供应芯片的芯片封装装置和供电机构
    • US5143253A
    • 1992-09-01
    • US402041
    • 1989-09-01
    • Kuniaki TakahashiKoji KudoTetsuo Takahashi
    • Kuniaki TakahashiKoji KudoTetsuo Takahashi
    • B65G51/03H05K13/02
    • H05K13/027B65G51/03
    • A chip packaging casing for packing chips and also serving as a chip supply source comprises a substantially plate-like body having a spiral passageway formed in its interior, and a plurality of chips received in a row in the spiral passageway of the body. The plate-like body further has a chip-outlet formed therein as a continuation of the spiral passageway to communicate with the exterior of the body and at least one air-intake formed therein to communicate between the passageway and the exterior of the body. The air-intake is adapted to be connected to an air supply source and serves to facilitate the forwarding of the chips along the passageway toward the outlet to discharge the chips form the outlet. A chip supply mechanism is provided for supplying chips to a mounting head of an automatic chip mounting apparatus by using the chip packaging casing.
    • 用于包装芯片并且还用作芯片供应源的芯片封装壳体包括在其内部形成有螺旋形通道的基本上板状的主体,以及在主体的螺旋通道中并排接收的多个芯片。 板状体还具有形成在其中作为螺旋通道的延续部分的芯片出口,其与主体的外部连通并且形成在其中的至少一个进气口在主体的通道和外部之间连通。 进气口适于连接到空气供应源,并且用于促进沿着通道朝向出口排出切屑以从出口排出芯片。 提供了一种芯片供给机构,用于通过使用芯片封装壳体将芯片供应到自动芯片安装装置的安装头。
    • 50. 发明授权
    • Electric power measurement system, electric power measurement method, and information processing device
    • 电力测量系统,电力测量方法和信息处理装置
    • US09513141B2
    • 2016-12-06
    • US13513584
    • 2010-10-15
    • Koji KudoYukiko MoriokaHiroo HongoHisato Sakuma
    • Koji KudoYukiko MoriokaHiroo HongoHisato Sakuma
    • G01D4/00H02J13/00
    • G01D4/004G01D4/002H02J13/0006Y02B70/3266Y02B90/242Y02B90/246Y04S20/242Y04S20/322Y04S20/42
    • An electric device has an electric power measurement unit with an electric power detection element measuring consumed electric power and an information communication element transmitting the measured power. An electric power meter has an information communication element measuring and transmitting total electric power consumed indoors. An information processing unit stores the measured values in every predetermined sampling period. If a difference α of two measurement values of the electric power detection element is a finite value, the information processing unit calculates and stores both a difference β of two measurement values of the electric power meter corresponding to the two measurement values and β/α, and calibrates the amount of electric power consumed by the electric device and that is measured by the electric power detection element using a median of values of β/α obtained in a predetermined measurement period or a median of a predetermined number of values of β/α.
    • 电气设备具有电力测量单元,其具有测量消耗电力的电力检测元件和传送测量功率的信息通信元件。 电力计具有测量和传送室内消耗的总电力的信息通信元件。 信息处理单元在每个预定采样周期中存储测量值。 如果电力检测元件的两个测量值的差值α为有限值,则信息处理单元计算并存储与两个测量值相对应的电力计量器的两个测量值的差值β和β/α, 并且校准由电气设备消耗的电力量,并且由电力检测元件使用在预定测量周期中获得的β/α值的中值或预定数量的β/α的中值来测量的电力量 。