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    • 2. 发明授权
    • Electronic component packaging means, and supply mechanism for and
method of supplying electronic components by using the electronic
component packaging means
    • 电子部件包装装置,以及使用电子部件包装机构供给电子部件的供给机构和方法
    • US5368193A
    • 1994-11-29
    • US993734
    • 1992-12-17
    • Tetsuo TakahashiShinichi ArayaKuniaki TakahashiKunio MogiKoji KudoTakeshi ItoHiroshi Ikeda
    • Tetsuo TakahashiShinichi ArayaKuniaki TakahashiKunio MogiKoji KudoTakeshi ItoHiroshi Ikeda
    • H05K13/00H05K13/04B65G59/00
    • H05K13/0434H05K13/0084Y10T29/53261
    • Electronic component packaging case comprising a substantially plate-like body having a substantially spiral passageway formed in its interior, a linear passageway formed therein as a continuation of an outermost circular portion of the sapiral passageway, an outlet formed therein as a continuation of the linear passageway to communicate with the exterior of the body, a plurality of electronic components received in a row in the spiral passageway, and a plurality of air-intakes for facilitating forwarding of the electronic components along the spiral passageway to the outlet, the air-intakes being formed in the casing body in a manner to communicate between respective circular portions of the spiral passageway and the exterior of the casing body, the case being adapted to be supported on a base of an electronic component supply mechanism with the body standing on the base when the case is used as an electronic component supply source, the outlet being formed at a portion of the casing body which is located at an upper position when the case is supported on the base, the outlet being faced upward, above which outlet the mounting head is adapted to wait. Also, an electronic component supply mechanism for and a method of supplying electronic components to the mounting head by using the packaging case are disclosed.
    • 电子部件包装盒包括基本上为板状的主体,该主体具有形成在其内部的基本螺旋形通道,形成在其中的线性通道,作为所述黑色通道的最外圆形部分的延续部,其中形成为所述直线通道 与身体的外部连通,在螺旋通道中一排地容纳的多个电子部件,以及用于促进电子部件沿着螺旋通道转移到出口的多个进气口,进气口为 在壳体内以螺旋形通道的各圆形部分和壳体外部连通的方式形成在壳体内,该壳体适于支撑在电子部件供应机构的基座上,其身体站在基座上, 该壳体用作电子部件供应源,该出口形成在壳体的一部分 当壳体被支撑在基座上时位于上部位置的主体,出口面向上方,安装头的出口适于在其上方等待。 此外,公开了一种电子部件供给机构,以及通过使用包装盒向安装头供给电子部件的方法。
    • 3. 发明授权
    • Chip packaging means and supply mechanism for supplying chips by using
the chip packaging means
    • 用于通过使用芯片封装装置供应芯片的芯片封装装置和供电机构
    • US5143253A
    • 1992-09-01
    • US402041
    • 1989-09-01
    • Kuniaki TakahashiKoji KudoTetsuo Takahashi
    • Kuniaki TakahashiKoji KudoTetsuo Takahashi
    • B65G51/03H05K13/02
    • H05K13/027B65G51/03
    • A chip packaging casing for packing chips and also serving as a chip supply source comprises a substantially plate-like body having a spiral passageway formed in its interior, and a plurality of chips received in a row in the spiral passageway of the body. The plate-like body further has a chip-outlet formed therein as a continuation of the spiral passageway to communicate with the exterior of the body and at least one air-intake formed therein to communicate between the passageway and the exterior of the body. The air-intake is adapted to be connected to an air supply source and serves to facilitate the forwarding of the chips along the passageway toward the outlet to discharge the chips form the outlet. A chip supply mechanism is provided for supplying chips to a mounting head of an automatic chip mounting apparatus by using the chip packaging casing.
    • 用于包装芯片并且还用作芯片供应源的芯片封装壳体包括在其内部形成有螺旋形通道的基本上板状的主体,以及在主体的螺旋通道中并排接收的多个芯片。 板状体还具有形成在其中作为螺旋通道的延续部分的芯片出口,其与主体的外部连通并且形成在其中的至少一个进气口在主体的通道和外部之间连通。 进气口适于连接到空气供应源,并且用于促进沿着通道朝向出口排出切屑以从出口排出芯片。 提供了一种芯片供给机构,用于通过使用芯片封装壳体将芯片供应到自动芯片安装装置的安装头。
    • 9. 发明申请
    • EXTERNAL RESONATOR-TYPE WAVELENGTH TUNABLE LASER DEVICE
    • 外部谐振器型波长激光器激光器件
    • US20100246618A1
    • 2010-09-30
    • US12664294
    • 2008-05-22
    • Shinya SudoKenji SatoKoji KudoKenji MizutaniJan De Merlier
    • Shinya SudoKenji SatoKoji KudoKenji MizutaniJan De Merlier
    • H01S3/13
    • H01S5/141H01S5/02248H01S5/028H01S5/0287H01S5/1039
    • The present invention provides an external resonator-type wavelength tunable laser device that can properly fulfill a wavelength tuning function even with the use of a planar wavelength tunable reflector involving a considerable level of residual reflection. The external resonator-type wavelength tunable laser device includes a planar reflection structure enabling a reflection spectral peak wavelength to be varied and a semiconductor element as a semiconductor gain medium. The semiconductor gain medium is composed of a multiple quantum well in which product Γ·L of optical confinement constant Γ and semiconductor gain medium length L (μm) of a gain layer is at least 25 μm and at most 40 μm and in which gain peak wavelength λ0 (nm) observed during carrier injected with a maximum modal gain equal to an internal loss of the semiconductor gain medium is larger than −3·ΔR/2+(λc+35) and smaller than (−(Γ·L)/7+8)·ΔR+(−(Γ·L)+λc+45). Here, ΔR (dB) denotes a reflectance difference, and he (nm) denotes a wavelength at a center of an operating wavelength range of the wavelength tunable laser device.
    • 本发明提供一种外部谐振器型波长可调激光器件,其即使使用涉及相当程度的残余反射的平面波长可调谐反射器也能适当地实现波长调谐功能。 外部谐振器型波长可调激光器件包括能够使反射光谱峰值波长变化的平面反射结构和半导体元件作为半导体增益介质。 半导体增益介质由多重量子阱组成,其中光学限制常数Ggr; 并且增益层的半导体增益介质长度L(μm)为至少25μm且至多40μm,并且其中以最大模态增益注入的载流子注入的增益峰值波长λ0(nm)等于半导体的内部损耗 增益介质大于-3·&Dgr; R / 2 +(λc+ 35)且小于( - (&Ggr;·L)/ 7 + 8)·&Dgr; R +( - (&Ggr;·L)+λc+ 45)。 这里,&Dgr; R(dB)表示反射率差,he(nm)表示波长可调激光器件的工作波长范围的中心处的波长。
    • 10. 发明申请
    • Semiconductor Laser, Module and Optical Transmitter
    • 半导体激光器,模块和光发射机
    • US20090274187A1
    • 2009-11-05
    • US12086287
    • 2007-01-10
    • Koji KudoShinya SudoKenji SatoKenji Mizutani
    • Koji KudoShinya SudoKenji SatoKenji Mizutani
    • H01S5/028H01S5/026H01S5/24
    • H01S5/026
    • A semiconductor optical waveguide-A having an optical amplification function and a semiconductor optical waveguide-B having a light control function are integrated together on the same substrate. A facet of the semiconductor optical waveguide-A facing an isolation trench and a facet of the semiconductor optical waveguide-B facing the isolation trench are configured as a composite optical reflector/optical connector using an optical interference. The facet of the semiconductor optical waveguide-A achieves an optical reflectivity not higher than the reflectivity corresponding to a cleaved facet and not smaller than several percent, and an optical coupling coefficient of not lower than 50% between the semiconductor optical waveguide-A and the semiconductor optical waveguide-B.
    • 具有光放大功能的半导体光波导A和具有光控功能的半导体光波导-B一起集成在同一基板上。 面向隔离沟槽的半导体光波导A的面和面向隔离沟槽的半导体光波导-B的面被配置为使用光学干涉的复合光反射器/光连接器。 半导体光波导A的小面实现不高于对应于切割面的反射率并且不小于几个百分比的光学反射率,并且半导体光波导A与第二半导体光波导A之间的光耦合系数不低于50% 半导体光波导-B。