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    • 46. 发明申请
    • Honeycomb structure
    • 蜂窝结构
    • US20060292338A1
    • 2006-12-28
    • US11368446
    • 2006-03-07
    • Kazushige OhnoMasafumi KuniedaKazutake Ogyu
    • Kazushige OhnoMasafumi KuniedaKazutake Ogyu
    • B32B3/12
    • B01D39/2086B01D39/2089Y10T428/24149Y10T428/24157
    • A honeycomb structure is disclosed that includes plural honeycomb units bonded together by using a sealing material layer, each of the honeycomb units including plural through-holes separated by plural partition walls and provided in parallel along a longitudinal direction. Each of the honeycomb units includes at least ceramic particles, and inorganic fibers and/or whiskers; a cross sectional area of the honeycomb unit is from about 5 cm2 to about 50 cm2; and an outer surface of each honeycomb unit and the sealing material layer satisfy: about 0.5≦κ/d×(dc/κc+df/κf)≦about 1, where, κf (W/mK) and df (mm) represent a thermal conductivity and a thickness of the outer surface of the honeycomb units, respectively, κc (W/mK) and dc (mm) represent a thermal conductivity and a thickness of the sealing material layer, respectively, and κ (W/mK) and d (mm) represent a thermal conductivity and a thickness of the combination of the outer surface and the sealing material layer.
    • 公开了一种蜂窝结构体,其包括通过使用密封材料层接合在一起的多个蜂窝单元,每个蜂窝单元包括由多个分隔壁分隔开并沿着纵向方向平行设置的多个通孔。 每个蜂窝单元至少包括陶瓷颗粒和无机纤维​​和/或晶须; 蜂窝单元的横截面积为约5cm 2至约50cm 2; 并且每个蜂窝单元的外表面和密封材料层满足:<?in-line-formula description =“In-line Formulas”end =“lead”≥> 0.5 ... = kappa / dx(dc / kappac + df / kappaf)<=约1,<?in-line-formula description =“在线公式”end =“tail”?>其中,kappaf(W / mK)和df(mm)表示导热率和厚度 (W / mK)和dc(mm)分别表示密封材料层的热导率和厚度,κ(W / mK)和d(mm)分别表示蜂窝单元的外表面 导热性和外表面和密封材料层的组合的厚度。