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    • 41. 发明授权
    • Non-volatile memory devices having trenches
    • 具有沟槽的非易失性存储器件
    • US07259421B2
    • 2007-08-21
    • US11020920
    • 2004-12-23
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L29/788
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。
    • 44. 发明申请
    • Charge trap-type 3-level non-volatile semiconductor memory device and method of driving the same
    • 电荷陷阱型3级非易失性半导体存储器件及其驱动方法
    • US20070030756A1
    • 2007-02-08
    • US11341341
    • 2006-01-26
    • Ki-Tae ParkJung-Dal Choi
    • Ki-Tae ParkJung-Dal Choi
    • G11C7/10
    • G11C11/5671
    • Disclosed herein is a charge trap-type 3-level non-volatile semiconductor memory device and method of driving the same. The charge trap-type 3-level non-volatile semiconductor memory device includes a memory array including a plurality of memory elements, each capable of storing data in at least two charge trap regions depending on the direction of current flow, and a page buffer driven to map three data bits to threshold voltage groups of the two charge trap regions. The charge trap-type non-volatile semiconductor memory device has charge trap regions each storing 1.5 bits of data. That is, a single memory element has charge trap regions for storing 3 bits of data, thereby improving device integration while maintaining a high operating speed during programming and reading operations.
    • 本文公开了一种电荷陷阱型3级非易失性半导体存储器件及其驱动方法。 电荷陷阱型3级非易失性半导体存储器件包括存储器阵列,该存储器阵列包括多个存储器元件,每个存储元件能够根据电流的方向存储至少两个电荷陷阱区域中的数据,以及驱动了页缓冲器 将三个数据位映射到两个电荷陷阱区域的阈值电压组。 电荷陷阱型非易失性半导体存储器件具有每个存储1.5位数据的电荷陷阱区。 也就是说,单个存储元件具有用于存储3位数据的电荷陷阱区域,从而在编程和读取操作期间保持高操作速度的同时提高器件集成度。
    • 45. 发明申请
    • Non-volatile memory devices having trenches and methods of forming the same
    • 具有沟槽的非易失性存储器件及其形成方法
    • US20060027855A1
    • 2006-02-09
    • US11020920
    • 2004-12-23
    • Sung-Hoi HurJung-Dal Choi
    • Sung-Hoi HurJung-Dal Choi
    • H01L29/788
    • H01L27/115H01L27/11519H01L27/11521H01L27/11524H01L27/11526H01L27/11529
    • A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective one of which is on a respective opposing side of the trench. A split source/drain region is formed in the substrate between the first gate pattern and the second gate pattern such that the split source/drain region is divided by the trench. The split source/drain region includes a first source/drain subregion between the first gate pattern and the trench and a second source/drain subregion between the second gate pattern and the trench and spaced apart from the first source/drain subregion. A connecting region is formed in the substrate that extends around the trench from the first source/drain subregion to the second source/drain subregion. Related methods are also discussed.
    • 半导体存储器件包括其中具有沟槽的半导体衬底。 第一和第二栅极图案形成在与沟槽相邻的衬底的表面上,其相应的一个位于沟槽的相应的相对侧上。 在第一栅极图案和第二栅极图案之间的衬底中形成分离源极/漏极区域,使得分离源极/漏极区域被沟槽分开。 分离源极/漏极区域包括在第一栅极图案和沟槽之间的第一源极/漏极子区域和在第二栅极图案和沟槽之间并与第一源极/漏极子区域间隔开的第二源极/漏极子区域。 在从第一源/漏区域到第二源极/漏极子区域的沟槽周围延伸的衬底中形成连接区域。 还讨论了相关方法。
    • 49. 发明授权
    • Nand-type flash memory device and method of forming the same
    • Nand型闪存器件及其形成方法
    • US06576513B2
    • 2003-06-10
    • US10272972
    • 2002-10-16
    • Yong-Sik YimJung-Dal Choi
    • Yong-Sik YimJung-Dal Choi
    • H01L218247
    • H01L27/11521H01L27/115
    • A NAND-type flash memory device for preventing punchthrough and a method for forming the same are provided. The NAND-type flash memory device includes a string selection transistor, a plurality of cell memory transistors, and a ground selection transistor being sequentially connected in series. The device further includes a bitline contact connected to a drain region of the string selection transistor, and a common source line connected to a source region of the ground selection transistor. Impurities are heavily doped to a drain-to-channel interface in the string selection transistor and a channel-to-source interface in the ground selection transistor, forming pockets for preventing punchthrough. The pockets are preferably formed using a tilted ion implantation using the vertical gate structures as masks.
    • 提供了一种用于防止穿透的NAND型闪存器件及其形成方法。 NAND型闪速存储器件包括串联选择晶体管,多个单元存储晶体管和接地选择晶体管,其串联连接。 该器件还包括连接到串选择晶体管的漏极区的位线接点和连接到接地选择晶体管的源极区的公共源极线。 杂质被重掺杂到串选择晶体管中的漏极至沟道界面以及接地选择晶体管中的沟道到源极接口,形成用于防止穿透的凹穴。 凹穴优选使用垂直栅极结构作为掩模使用倾斜离子注入形成。