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    • 44. 发明授权
    • Semiconductor image sensor
    • 半导体图像传感器
    • US4673985A
    • 1987-06-16
    • US610283
    • 1984-05-09
    • Jun-ichi Nishizawa
    • Jun-ichi Nishizawa
    • H01L27/14H01L27/146H04N5/335H04N5/355H04N5/357H04N5/374H04N3/12H01L29/80
    • H01L27/14679
    • A semiconductor image sensor is formed by static induction transistors, each provided with a control gate region which is a first gate region for control use and a shielding gate region which is a second gate region. The distance between an n.sup.+ source region and the control gate region is larger than the distance between the n.sup.+ source region and the shielding gate region. It is also possible to adopt such a structure that a light-shielding mask is provided on the shielding gate region. The isolation of adjacent photoconductive cells and the integration of adjacent photoconductive cells are improved, and the integration density is sharply increased.
    • PCT No.PCT / JP83 / 00303 Sec。 371日期1984年5月9日 102(e)日期1984年5月9日PCT提交1983年9月9日PCT公布。 公开号WO84 / 01076 日期:1984年3月15日。半导体图像传感器由静电感应晶体管形成,每个静电感应晶体管设置有作为用于控制使用的第一栅极区域和作为第二栅极区域的屏蔽栅极区域的控制栅极区域。 n +源极区域和控制栅极区域之间的距离大于n +源极区域和屏蔽栅极区域之间的距离。 也可以采用在屏蔽栅极区域上设置遮光掩模的结构。 相邻光导电池的隔离和相邻光导电池的集成得到改善,集成密度急剧增加。
    • 47. 发明授权
    • Solid state image pick-up element of static induction transistor type
    • 静态感应晶体管型固态摄像元件
    • US4616249A
    • 1986-10-07
    • US555988
    • 1983-11-29
    • Jun-ichi NishizawaTsutomu Nakamura
    • Jun-ichi NishizawaTsutomu Nakamura
    • H01L29/80H01L27/146H01L27/14H01L31/00
    • H01L27/14679
    • In a solid state image pick-up element of static induction transistor type having an n.sup.+ source region, an n.sup.+ drain region, an n.sup.- channel region formed between the source and drain regions and a p.sup.+ signal storing gate region formed in the channel region for storing charge carriers induced in the channel region in response to light input, an n.sup.+ resetting region is formed in the signal storing gate region to form a p-n junction therebetween and an electrode is provided on the resetting region to control a bias voltage applied to the resetting region. Upon a resetting operation, when the p-n junction is selectively biased in the forward direction, it is possible to completely discharge charge carriers stored in thegate region through the resetting region in an accurate manner. Since the resetting region is formed in the signal storing gate region, the integration density is not reduced.
    • 在具有n +源极区域,n +漏极区域,形成在源极区域和漏极区域之间的n沟道区域的静态感应晶体管类型的固体摄像元件和形成在沟道区域中的p +信号存储栅极区域 存储响应于光输入在沟道区域中感应的电荷载流子,在信号存储栅极区域中形成n +复位区域以在其间形成pn结,并且在复位区域上设置电极以控制施加到复位的偏置电压 地区。 在复位操作中,当p-n结被选择性地向正方向偏置时,可以以准确的方式通过复位区域完全放电存储在门区域中的电荷载流子。 由于在信号存储栅极区域中形成复位区域,所以不降低积分密度。
    • 48. 发明授权
    • GaAs semiconductor device
    • GaAs半导体器件
    • US4506281A
    • 1985-03-19
    • US295816
    • 1981-08-24
    • Jun-ichi NishizawaTadahiro Ohmi
    • Jun-ichi NishizawaTadahiro Ohmi
    • H01L29/80H01L21/314H01L21/8222H01L21/8226H01L21/8252H01L27/02H01L27/06H01L27/082H01L29/739H03K19/094H01J27/02
    • H01L21/8252H01L21/3144H01L27/0225H01L29/739
    • This invention relates to a GaAs semiconductor device and more particularly to a GaAs static induction transistor integrated circuit which operates at a very high speed. Gallium arsenide has the features that the mobility of electrons is higher than that in silicon and that the band structure has a direct gap. The mobility of electrons in gallium arsenide is several times as high as that in silicon; this is very suitable for the manufacture of a semiconductor device of high-speed operation. Further, since gallium arsenide has the direct gap, the electron-hole recombination rate is high and the minority carrier storage effect is extremely small. By causing the recombination at the direct gap, light emission can be achieved more efficiently. Accordingly, a light receiving and emitting semiconductor device can be obtained through the use of gallium arsenide. As the propagation velocity of light is very fast, signal transfer between semiconductor chips can be achieved at ultra-high speed. By combining this with the high mobility of electrons in gallium arsenide, an ultra-high speed logical operation device can be realized.
    • 本发明涉及一种GaAs半导体器件,更具体地说,涉及以非常高的速度工作的GaAs静态感应晶体管集成电路。 砷化镓具有电子迁移率高于硅中的迁移率,并且带结构具有直接间隙的特征。 砷化镓中电子的迁移率是硅中的几倍; 这非常适合制造高速运行的半导体器件。 此外,由于砷化镓具有直接间隙,电子 - 空穴复合率高,少数载流子的保存效果极小。 通过在直接间隙引起复合,可以更有效地实现发光。 因此,可以通过使用砷化镓来获得光接收和发射半导体器件。 由于光的传播速度非常快,半导体芯片之间的信号传输可以以超高速度实现。 通过将其与砷化镓中的电子的高迁移率组合,可以实现超高速逻辑运算装置。
    • 49. 发明授权
    • Static induction type semiconductor device
    • 静电感应式半导体器件
    • US4504847A
    • 1985-03-12
    • US386313
    • 1982-06-08
    • Jun-ichi Nishizawa
    • Jun-ichi Nishizawa
    • H01L29/10H01L29/739H01L29/772H01L29/80
    • H01L29/7392H01L29/1025H01L29/7722
    • In a static induction type semiconductor device comprising a semiconductor region having one conductivity type and a low impurity concentration and gate regions having an opposite conductivity type and a high impurity concentration formed in the semiconductor region to thereby define a channel region between these gate regions, there is provided a subsidiary semiconductor region having the one conductivity type and a relatively high impurity concentration either around each gate region to leave an effective channel region in the semiconductor region, or adjacent to the effective channel region in the entire channel region on the drain side. By so constructing the device, this effective channel region has a relatively low potential difference even when the channel region is completely depleted, and provides a relatively wide current path. The subsidiary semiconductor regions establish a relatively high potential difference near the gate regions so that the distance between the gate regions can be made substantially small. In case the subsidiary semiconductor regions are provided around the gate regions, the built-in potential at the junction will become large so that, even at the time of forward biasing, the minority carrier injection from the gate to the channel will become small. Also, this composite channel structure can be effectively applied to recessed gate device and split gate device as well.
    • 在具有一个导电类型和低杂质浓度的半导体区域和形成在该半导体区域中具有相反导电类型和高杂质浓度的栅区的静电感应型半导体器件中,由此限定这些栅区之间的沟道区, 在每个栅极区域周围提供具有一种导电类型和相对高的杂质浓度的辅助半导体区域,以在半导体区域中留下有效沟道区域,或者在漏极侧的整个沟道区域中与有效沟道区域相邻。 通过构造该器件,即使当沟道区域完全耗尽时,该有效沟道区域也具有相对较低的电位差,并且提供相对较宽的电流路径。 辅助半导体区域在栅极区域附近建立相对高的电位差,使得栅极区域之间的距离可以被大大地减小。 在辅助半导体区域设置在栅极区域周围的情况下,接合处的内置电位变大,使得即使在向前偏置时,从栅极到沟道的少数载流子注入也将变小。 此外,该复合沟道结构也可以有效地应用于凹陷栅极器件和分离栅极器件。
    • 50. 发明授权
    • Heterojunction emitter transistor with saturation drift velocity
gradient in base
    • 基极具有饱和漂移速度梯度的异质结发射极晶体管
    • US4482910A
    • 1984-11-13
    • US574648
    • 1984-01-30
    • Jun-ichi NishizawaTadahiro Ohmi
    • Jun-ichi NishizawaTadahiro Ohmi
    • H01L29/73H01L21/331H01L29/165H01L29/205H01L29/76H01L29/203H01L29/72
    • H01L29/7606H01L29/165
    • A thermionic emission transistor comprising: an emitter region formed with a semiconductor material having a first conductivity type and a high impurity concentration; a collector region formed with a semiconductor material having a first conductivity type and a high impurity concentration; a base region made of a semiconductor material having a second conductivity type opposite to said first conductivity type and a high impurity concentration, that portion of said emitter region located adjacent to said base region having an energy band gap broader than that of the base region, that portion of said base region located adjacent to the emitter region having an impurity concentration of about 3.times.10.sup.18 cm.sup.-3 or more. Such new transistor has a large transconductance and can be operated with a very large current gain in spite of a very small size of the whole device, and is very suitable for integrated circuit. This transistor requires a small driving power and has a large capability of driving subsequent stages and load, and allows a number of fan-outs is taken and the operating speed is very high.
    • 一种热离子发射晶体管,包括:发射区,其形成有具有第一导电类型和高杂质浓度的半导体材料; 形成有具有第一导电类型和高杂质浓度的半导体材料的集电极区域; 由具有与所述第一导电类型相反的第二导电类型和高杂质浓度的半导体材料制成的基极区域,位于所述基极区域附近的所述发射极区域的部分具有比基极区域更宽的能带隙, 所述基极区域的位于发射极区域附近的部分具有约3×10 18 cm -3以上的杂质浓度。 这种新晶体管具有大的跨导,并且尽管整个器件的尺寸非常小,但可以以非常大的电流增益来操作,并且非常适合于集成电路。 该晶体管需要小的驱动功率,并且具有驱动后续级和负载的大的能力,并且允许采用多个扇出并且操作速度非常高。