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41. 发明授权

US5382471A Adherent metal coating for aluminum nitride surfaces 失效
标题翻译：用于氮化铝表面的粘附金属涂层
公开(公告)号：US5382471A
公开(公告)日：1995-01-17
申请号：US12824
申请日：1993-02-03
申请人： John K. Arledge , Thomas J. Swirbel , James L. Davis
发明人： John K. Arledge , Thomas J. Swirbel , James L. Davis
IPC分类号： C04B41/52 , C04B41/89 , C23C14/02 , C23C14/18 , C23C26/00 , H05K3/38 , B32B15/04
CPC分类号： C04B41/009 , C04B41/52 , C04B41/89 , C23C14/022 , C23C14/18 , C23C26/00 , H05K3/388 , Y10T428/265
摘要： A metallized aluminum nitride substrate (40) has a first layer (42) of deposited metal, comprising chromium, chromium oxide, and an aluminum nitride/chromium oxide complex represented by the formulaAl.sub.a N.sub.b O.sub.c Cr.sub.dwhere a, b, c and d are numbers representing relative combining ratios. The first layer is formed by sputtering about 10-500 .ANG.ngstroms of chromium onto the substrate under vacuum, and then heating the substrate in an oxygen-containing atmosphere at conditions of time and temperature sufficient to convert at least portions of the deposited chromium to chromium oxide, in order to form an adherent metal system. A second layer (44) of metal such as chromium covers the first layer. A third layer (46) of metal is deposited on the second layer in a manner sufficient to prevent oxidation of the second layer.
摘要翻译：金属化氮化铝衬底（40）具有沉积金属的第一层（42），其包含铬，氧化铬和由式AlaNbOcCrd表示的氮化铝/铬氧化物络合物，其中a，b，c和d表示相对组合比。第一层是通过在真空下将大约10-500埃的铬溅射到衬底上形成的，然后在足够的时间和温度的条件下在含氧气氛中加热衬底，以将至少部分沉积的铬转化成铬氧化物，以形成粘附金属体系。金属如铬的第二层（44）覆盖第一层。金属的第三层（46）以足以防止第二层氧化的方式沉积在第二层上。

42. 发明授权

US5378298A Radiation sensitive adhesive composition and method of photoimagingsame 失效
标题翻译：辐射敏感性粘合剂组合物和光学吸光剂的方法
公开(公告)号：US5378298A
公开(公告)日：1995-01-03
申请号：US69798
申请日：1993-06-01
申请人： Melanie Williams , Thomas J. Swirbel
发明人： Melanie Williams , Thomas J. Swirbel
IPC分类号： G02F1/1339 , G03F7/00 , H05K3/30 , H05K3/32 , B03C1/94
CPC分类号： H05K3/305 , G03F7/0012 , G02F1/13394 , H05K2203/0514 , H05K3/321 , Y02P70/613
摘要： A method of photodelineating an adhesive on a substrate. The first step (10) is to coat the substrate with a layer of photopolymeric adhesive, typically spin coated. The adhesive is then briefly `soft baked` at a moderate temperature to set it (20). Portions of the adhesive are then selectively exposed to actinic radiation to partially cure them, while other portions are not exposed (30). A photomask is used to selectively expose the photopolymeric adhesive to ultraviolet light at an intensity and for a time sufficient to partially cure the photopolymeric adhesive. The adhesive is developed (40) to selectively remove those portions that were not exposed to radiation, usually in an appropriate solvent, creating a pattern in the adhesive. The developed adhesive pattern is then heated for a time and temperature sufficient to completely cure it (50).
摘要翻译：一种将基底上的粘合剂光线照射的方法。第一步（10）是用一层光聚合物粘合剂涂覆基材，通常是旋涂的。然后将粘合剂在适度的温度下短暂地“软烘烤”以设定（20）。然后将部分粘合剂选择性地暴露于光化辐射以部分固化它们，而其它部分不暴露（30）。使用光掩模以强度和足以部分固化光聚合物粘合剂的时间将光聚合物粘合剂选择性地暴露于紫外光。显影粘合剂（40）以选择性地去除通常在合适的溶剂中暴露于辐射的那些部分，从而在粘合剂中产生图案。然后将显影的粘合剂图案加热足以完全固化的时间和温度（50）。

43. 发明授权

US5355016A Shielded EPROM package 失效
标题翻译：屏蔽EPROM封装
公开(公告)号：US5355016A
公开(公告)日：1994-10-11
申请号：US56278
申请日：1993-05-03
申请人： Thomas J. Swirbel , Lonnie L. Barnardoni , Melanie Williams , James L. Davis
发明人： Thomas J. Swirbel , Lonnie L. Barnardoni , Melanie Williams , James L. Davis
IPC分类号： G11C5/00 , G11C16/18 , H01L23/552 , H01L25/04 , H01L23/28
CPC分类号： H01L23/552 , G11C16/18 , H01L2224/32014 , H01L2224/32225 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025
摘要： A shielded, erasable-programmable-read-only-memory (EPROM) package is provided. A circuit carrying substrate (10), contains an area for mounting an EPROM chip (16), having conductive interconnecting patterns (12) adjacent to the chip mounting area. The EPROM chip is mounted on the circuit carrying substrate, and the pad electrodes on the EPROM chip are connected to pads on the conductive patterns of the substrate by wire bonds (17) or other means. An ultraviolet (UV) light transmitting resin (18) is transfer molded onto the circuit carrying substrate, covering the EPROM chip (16) and the wire bonds (17) so as to provide an optical path through the material to the top surface of the EPROM chip, and sealing the EPROM chip from the exterior of the package. An adherent metal coating (19) is sputtered over the transfer molded resin, and the metal coating is coated with a protective organic resin (15). Both the metal coating and the organic resin are at least partially transparent to ultraviolet light.
摘要翻译：提供屏蔽，可擦写可编程只读存储器（EPROM）封装。电路承载基板（10）包含用于安装EPROM芯片（16）的区域，其具有与芯片安装区域相邻的导电互连图案（12）。 EPROM芯片安装在电路承载基板上，EPROM芯片上的焊盘电极通过引线接合（17）或其他方式连接到基板的导电图案上的焊盘。紫外线（UV）透光树脂（18）被传递模塑到电路承载基板上，覆盖EPROM芯片（16）和引线接合（17），以便提供通过材料的光路到达 EPROM芯片，并将EPROM芯片从封装的外部密封。在传递模塑树脂上溅射粘附金属涂层（19），金属涂层涂覆有保护性有机树脂（15）。金属涂层和有机树脂对紫外光至少部分透明。

44. 发明授权

US5296271A Microwave treatment of photoresist on a substrate 失效
标题翻译：微波处理基片上的光致抗蚀剂
公开(公告)号：US5296271A
公开(公告)日：1994-03-22
申请号：US4478
申请日：1993-01-12
申请人： Thomas J. Swirbel , Richard J. Kolcz , James L. Davis
发明人： Thomas J. Swirbel , Richard J. Kolcz , James L. Davis
IPC分类号： B05D3/02 , G03F7/38 , H05K3/06 , B05D1/32
CPC分类号： G03F7/38 , B05D3/029 , H05K3/064 , H05K2203/102 , H05K2203/1105
摘要： Photoreactive polymers are treated by exposure to microwave energy. A film of a photoreactive polymer (12), such as a photoresist, is applied to a substrate (10) and selectively exposed to ultraviolet light. The latent image produced is further cured or polymerized by treating the photoresist with microwave energy. Combinations of microwave and thermal energies are also used. The treated photoresist is then developed, producing a sidewall (17) that is vertical, and is improved by reduction of anomolies such as scum or a foot (16) at the base of the resist.
摘要翻译：通过暴露于微波能量来处理光反应聚合物。将诸如光致抗蚀剂的光反应性聚合物（12）的膜施加到基板（10）并选择性地暴露于紫外光。通过用微波能量处理光致抗蚀剂，进一步固化或聚合产生的潜像。微波和热能的组合也被使用。经处理的光致抗蚀剂然后显影，产生垂直的侧壁（17），并且通过在抗蚀剂的底部减少诸如浮渣或脚（16）的异常来改进。

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