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    • 43. 发明申请
    • High voltage mosfet having Si/SiGe heterojunction structure and method of manufacturing the same
    • 具有Si / SiGe异质结结构的高电压mosfet及其制造方法
    • US20060105528A1
    • 2006-05-18
    • US11182671
    • 2005-07-15
    • Young Kyun ChoSung Ku KwonTae Moon RohDae Woo LeeJong Dae Kim
    • Young Kyun ChoSung Ku KwonTae Moon RohDae Woo LeeJong Dae Kim
    • H01L21/8234
    • H01L29/7835H01L21/823807H01L29/1054H01L29/66659
    • Provided are high voltage metal oxide semiconductor field effect transistor (HVMOSFET) having a Si/SiGe heterojunction structure and method of manufacturing the same. In this method, a substrate on which a Si layer, a relaxed SiGe epitaxial layer, a SiGe epitaxial layer, and a Si epitaxial layer are stacked or a substrate on which a Si layer having a well region, a SiGe epitaxial layer, and a Si epitaxial layer are stacked is formed. For the device having the heterojunction structure, the number of conduction carriers through a potential well and the mobility of the carriers increase to reduce an on resistance, thus increasing saturation current. Also, an intensity of vertical electric field decreases so that a breakdown voltage can be maintained at a very high level. Further, a reduction in vertical electric field due to the heterojunction structure leads to a gain in transconductance (Gm), with the results that a hot electron effect is inhibited and the reliability of the device is enhanced.
    • 提供了具有Si / SiGe异质结结构的高压金属氧化物半导体场效应晶体管(HVMOSFET)及其制造方法。 在该方法中,层叠有Si层,弛豫SiGe外延层,SiGe外延层和Si外延层的基板或其上具有阱区的Si层,SiGe外延层和 Si外延层被形成。 对于具有异质结结构的器件,通过势阱的导电载流子数量和载流子的迁移率增加,以降低导通电阻,从而增加饱和电流。 此外,垂直电场的强度降低,使得击穿电压可以保持在非常高的水平。 此外,由于异质结构造成的垂直电场的减少导致跨导增益(Gm),结果是热电子效应被抑制,并且器件的可靠性增强。
    • 48. 发明授权
    • High voltage MOSFET having Si/SiGe heterojuction structure and method of manufacturing the same
    • 具有Si / SiGe异质结构的高压MOSFET及其制造方法
    • US07233018B2
    • 2007-06-19
    • US11182671
    • 2005-07-15
    • Young Kyun ChoSung Ku KwonTae Moon RohDae Woo LeeJong Dae Kim
    • Young Kyun ChoSung Ku KwonTae Moon RohDae Woo LeeJong Dae Kim
    • H01L29/06H01L31/00
    • H01L29/7835H01L21/823807H01L29/1054H01L29/66659
    • Provided are high voltage metal oxide semiconductor field effect transistor (HVMOSFET) having a Si/SiGe heterojunction structure and method of manufacturing the same. In this method, a substrate on which a Si layer, a relaxed SiGe epitaxial layer, a SiGe epitaxial layer, and a Si epitaxial layer are stacked or a substrate on which a Si layer having a well region, a SiGe epitaxial layer, and a Si epitaxial layer are stacked is formed. For the device having the heterojunction structure, the number of conduction carriers through a potential well and the mobility of the carriers increase to reduce an on resistance, thus increasing saturation current. Also, an intensity of vertical electric field decreases so that a breakdown voltage can be maintained at a very high level. Further, a reduction in vertical electric field due to the heterojunction structure leads to a gain in transconductance (Gm), with the results that a hot electron effect is inhibited and the reliability of the device is enhanced.
    • 提供了具有Si / SiGe异质结结构的高压金属氧化物半导体场效应晶体管(HVMOSFET)及其制造方法。 在该方法中,层叠有Si层,弛豫SiGe外延层,SiGe外延层和Si外延层的基板或其上具有阱区的Si层,SiGe外延层和 Si外延层被形成。 对于具有异质结结构的器件,通过势阱的导电载流子数量和载流子的迁移率增加,以降低导通电阻,从而增加饱和电流。 此外,垂直电场的强度降低,使得击穿电压可以保持在非常高的水平。 此外,由于异质结构造成的垂直电场的减小导致跨导(Gm)的增益,结果是热电子效应被抑制,并且器件的可靠性增强。
    • 49. 发明授权
    • Method for fabricating a high-voltage high-power integrated circuit device
    • 高压大功率集成电路器件的制造方法
    • US06855581B2
    • 2005-02-15
    • US10153975
    • 2002-05-23
    • Tae Moon RohDae Woo LeeYil Suk YangIl Yong ParkSang Gi KimJin Gun KooJong Dae Kim
    • Tae Moon RohDae Woo LeeYil Suk YangIl Yong ParkSang Gi KimJin Gun KooJong Dae Kim
    • H01L21/76H01L21/84H01L27/12
    • H01L27/1203H01L21/84
    • The present invention relates to a method of fabricating a high-voltage high-power integrated circuit device using a substrate of a SOI structure in which an insulating film and a silicon layer are sequentially stacked on a silicon substrate. The method comprising the steps of sequentially forming an oxide film and a photoresist film on the silicon layer and then performing a photolithography process using a trench mask to pattern the photoresist film; patterning the oxide film using the patterned photoresist film as a mask and then removing the photoresist film remained after the patterning; etching the silicon layer using the patterned oxide film as a mask until the insulating film is exposed to form a trench; forming a nitride film on the entire surface including the trench, performing an annealing process and depositing polysilicon on the entire surface so that the trench is buried; and sequentially removing the polysilicon and the nitride film until the silicon layer is exposed to flatten the surface, thus forming a device isolating film for electrical isolation between devices within the trench. Therefore, the present invention can effectively reduce the isolation area of the trench between the high-voltage high-power device and the logic CMOS device and can easily control the concentration of a deep well.
    • 本发明涉及使用其中绝缘膜和硅层依次层叠在硅衬底上的SOI结构的衬底的高压大功率集成电路器件的制造方法。 该方法包括以下步骤:在硅层上依次形成氧化物膜和光致抗蚀剂膜,然后使用沟槽掩模进行光刻工艺以对光刻胶膜进行图案化; 使用图案化的光致抗蚀剂膜作为掩模来图案化氧化膜,然后在图案化之后除去光致抗蚀剂膜; 使用所述图案化氧化膜作为掩模蚀刻所述硅层,直到所述绝缘膜暴露以形成沟槽; 在包括沟槽的整个表面上形成氮化物膜,执行退火处理并在整个表面上沉积多晶硅,使得沟槽被埋置; 并且顺序地去除多晶硅和氮化物膜,直到硅层暴露以使表面变平,从而形成用于在沟槽内的器件之间进行电隔离的器件隔离膜。 因此,本发明能够有效地降低高压大功率器件与逻辑CMOS器件之间的沟槽的隔离面积,能够容易地控制深井的浓度。