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41. 发明授权

US09298231B2 Methods of fabricating a coolant-cooled electronic assembly 有权
标题翻译：制造冷却剂冷却电子组件的方法
公开(公告)号：US09298231B2
公开(公告)日：2016-03-29
申请号：US14528066
申请日：2014-10-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Amilcar R. Arvelo , Levi A. Campbell , Michael J. Ellsworth, Jr. , Eric J. McKeever , Richard P. Snider
IPC分类号： B23D53/02 , G06F1/20 , F28D15/02
CPC分类号： H05K7/20254 , F16L41/10 , F28D15/0275 , F28F9/02 , Y10T29/4935
摘要： Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided, which include providing a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The method further includes providing a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and providing a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.
摘要翻译：提供制造冷却装置和冷却剂冷却的电子组件的方法，其包括提供热传递结构，其被配置为耦合到具有一个或多个要冷却的电子部件的电子卡的一侧或多侧。热传递结构包括散热器和与散热器相关联的至少一个冷却剂传送通道，以便于将热量从散热器移除到流过冷却剂传送通道的冷却剂。该方法还包括提供与电子系统的插座相邻设置的冷却剂歧管结构，其中电子卡片可操作地对接，并且提供流体和机械附接机构，其有助于热传递结构和冷却剂的选择性，流体和机械耦合或解耦歧管结构，该附接机构有助于冷却剂流在冷却剂歧管结构和热传递结构的冷却剂传送通道之间。

42. 发明授权

US09288932B2 Ground-based heat sink facilitating electronic system cooling 有权
标题翻译：地面散热器，便于电子系统冷却
公开(公告)号：US09288932B2
公开(公告)日：2016-03-15
申请号：US13671829
申请日：2012-11-08
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F24J3/08 , H05K7/20 , F28D15/02
CPC分类号： H05K7/2039 , F24T10/30 , F28D15/0266 , F28D15/0275 , H05K7/20827 , Y02E10/10 , Y02E10/16
摘要： Cooling systems and methods are provided which include a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.
摘要翻译：提供了冷却系统和方法，其包括散热器，该散热器具有带隔室的壳体，冷却剂入口和冷却剂出口。壳体构造成用于使冷却剂从冷却剂入口通过隔室流到冷却剂出口，其中冷却剂传送从一个或多个电子部件提取的热量。散热器还包括一个或多个热管，其具有设置在壳体的隔室内的第一部分和设置在壳体外部的第二部分。热管被配置为从流过隔室的冷却剂中提取热量，并且将提取的热量传送到设置在壳体外部的第二部分。壳体外部的第二部分设置成便于将提取的热量导入地面。

43. 发明授权

US09282678B2 Field-replaceable bank of immersion-cooled electronic components and separable heat sinks 有权
标题翻译：现场可更换的浸没冷却电子元件和可分离的散热片
公开(公告)号：US09282678B2
公开(公告)日：2016-03-08
申请号：US14058592
申请日：2013-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/203 , H05K7/20772 , H05K7/20781 , H05K7/20809
摘要： Cooled electronic systems and cooling methods are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the electronic system. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into, for instance, one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink is configured and disposed to physically couple to the enclosure and facilitates rejection of heat from the fluid disposed within the compartment when the field-replaceable bank of electronic components is operatively inserted into the electronic system.
摘要翻译：提供冷却的电子系统和冷却方法，其中现场可替换的电子部件组由包括至少部分围绕电子部件周围并形成隔室的外壳的设备冷却，设置在隔间内的流体和热量水槽与电子系统相关联。现场可更换组件部分地延伸穿过外壳，以便于将电子部件的操作对接到例如电子系统的一个或多个相应的接收插座。现场可更换组的电子部件至少部分地浸没在流体内以便于部件的浸入冷却，并且散热器被配置和设置成物理耦合到外壳并有利于排除来自流体的热量当现场可更换的电子组件组可操作地插入到电子系统中时，设置在隔间内。

44. 发明授权

US09282675B2 Thermal expansion-enhanced heat sink for an electronic assembly 有权
标题翻译：用于电子组件的热膨胀增强型散热器
公开(公告)号：US09282675B2
公开(公告)日：2016-03-08
申请号：US14063162
申请日：2013-10-25
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： G06F1/20 , H05K5/00 , H05K7/20 , F28F7/00 , F28D15/00 , H01L23/40 , H01L23/427 , H01L23/473 , H01L23/367
CPC分类号： H05K7/20 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4087 , H01L2224/16 , Y10T29/49002 , Y10T29/4935 , Y10T29/49353
摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
摘要翻译：散热器和制造方法被提供用于从电子部件去除热量。散热器包括散热器底座和框架。基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。热界面材料设置在基底表面和电子部件之间。

45. 发明授权

US09210830B2 Immersion-cooled and conduction-cooled method for electronic system 有权
标题翻译：电子系统的浸入式冷却和传导冷却方法
公开(公告)号：US09210830B2
公开(公告)日：2015-12-08
申请号：US13758166
申请日：2013-02-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： G06F1/16 , H05K5/00 , H05K7/00 , H05K7/20 , G06F1/20
CPC分类号： H05K7/20236 , G06F1/20 , H05K7/203 , H05K7/20318 , H05K7/20336 , H05K7/2079 , H05K7/20809
摘要： A method of facilitating cooling of an electronics board having a plurality of electronic components mounted to the board by providing an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.
摘要翻译：一种通过提供一种包括浸没冷却电子部件部分和传导冷却电子部件部分的装置，有助于冷却具有安装到板上的多个电子部件的电子板的方法。浸没冷却部分包括至少部分地围绕和形成围绕安装到电子板的电子部件的多个电子部件的隔室以及设置在隔间内的流体的外壳。多个电子部件至少部分地浸入流体中以便于这些部件的浸入冷却。传导冷却的电子部件部分包括安装到电子板的电子部件的至少一个电子部件，并且至少一个电子部件至少部分地通过从至少一个电子元件

46. 发明授权

US09148983B2 Separate control of coolant flow through coolant circuits 有权
标题翻译：通过冷却剂回路分离冷却剂流量
公开(公告)号：US09148983B2
公开(公告)日：2015-09-29
申请号：US13781993
申请日：2013-03-01
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： G06F19/00 , H05K7/20 , G05D23/19 , G06F1/20
CPC分类号： H05K7/2079 , G05D23/1934 , G06F1/206 , H05K7/20836
摘要： Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.
摘要翻译：提供了用于自动冷却剂流控制的方法，例如，促进多个不同电子系统的冷却。这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂电路i基于传输到冷却剂的确定的热负荷。不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。

47. 发明授权

US09144178B2 Selective clamping of electronics card to coolant-cooled structure 有权
标题翻译：将电子卡选择性夹紧到冷却液冷却结构中
公开(公告)号：US09144178B2
公开(公告)日：2015-09-22
申请号：US13782357
申请日：2013-03-01
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Amilcar R. Arvelo , Mark A. Brandon , Levi A. Campbell , Tan D. Doan , Michael J. Ellsworth, Jr. , Randall G. Kemink , Eric J. McKeever
IPC分类号： H05K7/20 , B23P15/26 , G06F1/20 , H01L23/473 , F28F1/00
CPC分类号： H05K7/20254 , B23P15/26 , G06F1/20 , H01L23/473 , H01L2924/0002 , H05K7/20772 , Y10T29/4935 , H01L2924/00
摘要： Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.
摘要翻译：提供了冷却装置和冷却剂冷却的电子组件，其包括被配置为耦合到可操作地插入到电子系统中的电子卡的热转印结构。热传递结构包括可在打开位置和夹紧位置之间移动的夹紧结构。与电子系统可操作地插入的电子系统相关联的冷却剂冷却结构驻留在电子卡之间，并且至少部分地通过将电子卡插入电子系统中的夹持结构。夹紧结构的打开位置便于电子系统内的电子卡与卡之间的冷却剂冷却结构与至少部分地夹持结构之间的卡止结构，并且夹紧结构向夹紧位置的移动有利于夹紧冷却剂冷却结构的热传递结构以及从卡到冷却剂冷却结构的热传导。

48. 发明授权

US09095942B2 Wicking and coupling element(s) facilitating evaporative cooling of component(s) 有权
标题翻译：促进部件蒸发冷却的芯吸和耦合元件
公开(公告)号：US09095942B2
公开(公告)日：2015-08-04
申请号：US13627256
申请日：2012-09-26
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： B23P15/26 , H05K7/203 , H05K7/20336 , H05K7/20809 , Y10T29/4935 , Y10T29/49396
摘要： Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.
摘要翻译：提供冷却装置和方法以便于电子系统的电子部件的冷却。冷却装置包括至少部分地围绕和形成围绕部件的隔室的壳体，并且浸入冷却流体设置在隔间内。电子系统的至少一个部件至少部分地非浸没在隔室中的流体内。芯吸膜元件物理耦合到至少一个部件的主表面并且部分地设置在隔室内的流体内。耦合元件将芯吸膜元件物理地耦合到至少一个部件的主表面，而没有覆盖部件主表面的耦合元件。作为增强，芯吸膜元件包裹在部件上以物理耦合到部件的两个相对的主侧。

49. 发明授权

US09025332B2 Inlet-air-cooling door assembly for an electronics rack 有权
标题翻译：用于电子机架的入口 - 空气冷却门组件
公开(公告)号：US09025332B2
公开(公告)日：2015-05-05
申请号：US13782020
申请日：2013-03-01
申请人： International Business Machines Corporation
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons , Daniel E. Zambrano
IPC分类号： H05K7/20 , F28D15/00 , F28F9/00
CPC分类号： F28D15/00 , F28F9/00 , H05K7/2079 , H05K7/20827
摘要： A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.
摘要翻译：提供了一种方法，其包括提供用于电子机架的冷却装置，其包括构造成耦合到电子机架的空气入口侧的门组件。门组件包括：一个或多个气流开口，便于气流通过门组件并进入电子机架; 一个或多个空气冷却剂热交换器被设置成使得通过气流开口的气流穿过热交换器，该热交换器被配置为从穿过其的气流中提取热量; 以及一个或多个气流再分布器，其布置在气流通过热交换器的下游并且至少部分对准的气流开口的方向上。气流再分布器有助于通过空气 - 液体热交换器的气流再次分布到电子机架的空气入口侧的所需气流图案，例如穿过空气入口侧的均匀气流分布的架子。

50. 发明授权

US09013872B2 Dry-cooling unit with gravity-assisted coolant flow 有权
标题翻译：具有重力辅助冷却剂流的干冷单元
公开(公告)号：US09013872B2
公开(公告)日：2015-04-21
申请号：US13692235
申请日：2012-12-03
申请人： International Business Machines Corporation , Kevin P. Radigan
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F28F9/00 , F25B1/00 , H05K7/20
CPC分类号： F28F9/00 , F25B1/00 , H05K7/20772 , H05K7/2079 , Y10T29/4935
摘要： A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.
摘要翻译：提供了一种制造冷却单元的方法，以便冷却通过冷却剂回路的冷却剂。冷却单元包括一个或多个散热单元和升高的冷却剂箱。散热单元将通过冷却剂回路的冷却剂的热量排除通过散热单元的空气。散热单元包括联接到冷却剂回路的一个或多个热交换组件，用于至少一部分冷却剂通过一个或多个热交换组件。在冷却剂回路的至少一部分上方升高的升高的冷却剂箱与散热单元的一个或多个热交换组件流体连通地联接，并且便于冷却剂返回到冷却剂回路基本恒定的压力。

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