会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 48. 发明授权
    • Method of plasma etching amorphous carbon films
    • 等离子体蚀刻无定形碳膜的方法
    • US4975144A
    • 1990-12-04
    • US324663
    • 1989-03-17
    • Shunpei YamazakiKenji Itoh
    • Shunpei YamazakiKenji Itoh
    • H01L21/311H01L21/3213H01L21/48
    • H01L21/481H01L21/31116H01L21/31144H01L21/32139
    • An etching method for selectively eliminating carbon material deposited on a substrate is described. A layer of masking material may be applied over areas of the carbon coating whose removal is not desired. After disposing the substrate coated with the carbon material in a CVD reaction chamber, NF.sub.3 is admitted to the chamber and converted into a plasma etchant comprising fluorine ions or radicals by inputting high frequency energy. The fluorine ions or radicals remove all unmasked carbon, leaving a carbon film pattern on the substrate which may be used in the manufacture of an IC. The carbon material elimination method can also be used for chamber cleaning to removing carbon deposited debris from the inside of the CVD reaction chamber.
    • 描述了用于选择性地去除沉积在基板上的碳材料的蚀刻方法。 可以将一层掩模材料施加在不需要去除的碳涂层的区域上。 将涂覆有碳材料的基材设置在CVD反应室中之后,通过输入高频能量,将NF3进入室并转化为包含氟离子或自由基的等离子体蚀刻剂。 氟离子或自由基除去所有未掩蔽的碳,在基板上留下可用于制造IC的碳膜图案。 碳材料消除方法也可以用于室内清洁以从CVD反应室的内部除去碳沉积的碎屑。