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41. 发明授权

US07288436B2 Semiconductor chip package manufacturing method including screen printing process 失效
标题翻译：半导体芯片封装制造方法包括丝网印刷工艺
公开(公告)号：US07288436B2
公开(公告)日：2007-10-30
申请号：US11003378
申请日：2004-12-06
申请人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han , Hyun-Ik Hwang
发明人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han , Hyun-Ik Hwang
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/52 , H01L23/48 , H01L21/20
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L2224/2919 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2224/92147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/30105 , H01L2924/00
摘要： A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.
摘要翻译：用于制造半导体芯片封装的方法可以包括使用丝网印刷掩模在基板上丝网印刷粘合剂。粘合剂可以在第一固化过程中被加热。半导体芯片可以附着在基板上的粘合剂上。粘合剂可以在第二固化过程中被加热。粘合剂的物理性能可以在丝网印刷过程之前和之后转化，以改善粘合剂的操作性能和/或质量。

42. 发明申请

US20060134757A1 Microorganism and the process for the production of teicoplanin 失效
标题翻译：微生物和生产替考拉宁的过程
公开(公告)号：US20060134757A1
公开(公告)日：2006-06-22
申请号：US11013736
申请日：2004-12-17
申请人： Soo-Ryun Cheong , Sang-Young Kim , Youn-Woo Lee , Jung-Kul Lee , Hyeon-Cheol Lee , Hyung-Moo Jung , Bong-Seoung Koo
发明人： Soo-Ryun Cheong , Sang-Young Kim , Youn-Woo Lee , Jung-Kul Lee , Hyeon-Cheol Lee , Hyung-Moo Jung , Bong-Seoung Koo
IPC分类号： C12P19/28 , C12N1/20
CPC分类号： C12R1/045 , C12P19/60
摘要： The present invention provides a newly isolated mutant culture of Actinoplanes teichomyceticus BNG 2315. This culture is capable of producing teicoplanin more than 60 times productivity than those reported before (e.g., Actinoplanes teichomyceticus nov. sp. ATCC 31121). The present invention also provides a fermentation process for the production of teicoplanin in an aerobic condition using the mutant strain Actinoplanes teichomyceticus BNG 2315 in a culture-medium comprising carbon sources, nitrogen sources and mineral salts.
摘要翻译：本发明提供了一种新近分离的灭活细胞巨噬细胞BNG2315的突变培养物。该培养物能够产生超过60倍生产力的泰可菌素（例如，Actinoplanes teichomyceticus nov。sp。ATCC 31121）。本发明还提供了在含有碳源，氮源和矿物盐的培养基中，使用突变体细胞壁虫TNG 2315在需氧条件下生产替考拉宁的发酵方法。

43. 发明申请

US20060102996A1 Stack package using anisotropic conductive film (ACF) and method of making same 有权
标题翻译：使用各向异性导电膜（ACF）的堆叠封装及其制作方法
公开(公告)号：US20060102996A1
公开(公告)日：2006-05-18
申请号：US11133317
申请日：2005-05-20
申请人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
发明人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L2224/06136 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/01079 , H01L2924/3511 , H01L2924/00 , H01L2924/00012
摘要： Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.
摘要翻译：提供了一种使用各向异性导电膜（ACF）的堆叠封装，用于在从多个CSP初始制造堆叠封装期间减少施加在芯片级封装（CSP）上的热应力，并且用于促进堆叠封装的修复和/或返工， CSP同时减少对CSP的损害的可能性。在包括使用ACF堆叠的多个CSP的堆叠封装中，每个CSP通常将包括安装在电路板上并电连接到电路板的电路板，半导体芯片，以及将半导体芯片布置在外围设备上的焊球或其它导电结构电路板区域。还提供了用于初始生产这种堆叠包装的方法以及用于这种堆叠包装的修理和返工的补充方法。

44. 发明授权

US06638638B2 Hollow solder structure having improved reliability and method of manufacturing same 有权
标题翻译：具有改进的可靠性的中空焊料结构及其制造方法
公开(公告)号：US06638638B2
公开(公告)日：2003-10-28
申请号：US09954026
申请日：2001-09-18
申请人： Sang-Young Kim , Ho-Jeong Moon , Dong-Kil Shin , Seung-Kon Mok
发明人： Sang-Young Kim , Ho-Jeong Moon , Dong-Kil Shin , Seung-Kon Mok
IPC分类号： B22F300
CPC分类号： H01L24/10 , B23K1/0008 , B23K35/0222 , B23K35/0244 , B23K2101/40 , H01L24/13 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13011 , H01L2224/13099 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , H05K1/111 , H05K3/3436 , H05K2201/09381 , H05K2201/0969 , H05K2201/10257 , H05K2203/0465 , Y02P70/611 , Y02P70/613 , Y10T428/12014 , Y10T428/12222 , H01L2224/29099 , H01L2924/00
摘要： A solder structure comprising a radially-curved exterior surface enclosing a predetermined-sized cavity used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an annular conductive pad and the other planar element having either a corresponding annular or circular conductive pad, separated by a spherical solder compound comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.
摘要翻译：焊料结构包括径向弯曲的外表面，其包围预定尺寸的空腔，用于在预定的导电接触点处柔性地接合两个具有不同性质的平面元件。通过以分层布置组装两个平面元件，一个平面元件具有环形导电焊盘，另一个平面元件具有相应的环形或圆形导电焊盘，由由焊料和助熔剂构成的球形焊料化合物分开，可以在焊料化合物的熔化和随后的冷却期间产生焊料结构。所得中空焊料结构的可塑性/弹性特性吸收两个平面元件相对于彼此的横向移动，而不会降低焊接接头。

45. 发明申请

US20120083066A1 COMPLEMENTARY METAL OXIDE SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：补充金属氧化物半导体图像传感器及其制造方法
公开(公告)号：US20120083066A1
公开(公告)日：2012-04-05
申请号：US13323363
申请日：2011-12-12
申请人： Sang-Young Kim
发明人： Sang-Young Kim
IPC分类号： H01L31/02
CPC分类号： H01L27/14643 , H01L27/14601 , H01L27/14689
摘要： A complementary metal oxide semiconductor (CMOS) device and a method for fabricating the same are provided. The CMOS image sensor includes: a first conductive type substrate including a trench; a channel stop layer formed by using a first conductive type epitaxial layer over an inner surface of the trench; a device isolation layer formed on the channel stop layer to fill the trench; a second conductive type. photodiode formed in a portion of the substrate in one side of the channel stop layer; and a transfer gate structure formed on the substrate adjacent to the photodiode to transfer photo-electrons generated from the photodiode.
摘要翻译：提供互补金属氧化物半导体（CMOS）器件及其制造方法。 CMOS图像传感器包括：包括沟槽的第一导电型衬底; 通过在沟槽的内表面上使用第一导电型外延层形成的沟道阻挡层; 形成在沟道停止层上以填充沟槽的器件隔离层; 第二导电类型。光电二极管形成在通道停止层的一侧的基板的一部分中; 以及形成在与光电二极管相邻的衬底上的转移栅极结构，以转移由光电二极管产生的光电子。

46. 发明授权

US07923958B2 Apparatus and method for driving 2-phase SRM motor 有权
标题翻译：用于驱动两相SRM电机的装置和方法
公开(公告)号：US07923958B2
公开(公告)日：2011-04-12
申请号：US12088736
申请日：2006-10-25
申请人： Sang-Young Kim
发明人： Sang-Young Kim
IPC分类号： H02P25/08 , H02P6/20
CPC分类号： H02P25/08 , H02P1/163
摘要： An apparatus and method for driving a 2-phase SRM are provided. The method may include initializing 2-phase SRM based on a detected position of a rotor by an initializing sensor at a time of an initial driving, and normally driving the 2-phase SRM based on a detected position of the rotor by a driving sensor. With this method, a sufficient amount of torque is generated when the 2-phase SRM is driven at a high speed. The apparatus may include an initializing sensor that detects each position of each phase of a 2-phase SRM, and generates an initializing sensor signal based on the detected result; a driving sensor that detects each position of each phase of the 2-phase SRM, and generates a driving sensor signal based on the detected result; and a microprocessor that initially drives the 2-phase SRM based on the initializing sensor signal at the time of an initial driving, and normally drives the 2-phase SRM based on the driving sensor signal at the time of a normal driving.
摘要翻译：提供了一种用于驱动2相SRM的装置和方法。该方法可以包括基于初始化驱动时的初始化传感器的转子的检测位置来初始化2相SRM，并且通过驱动传感器基于检测到的转子位置来正常地驱动2相SRM。利用该方法，当以高速驱动2相SRM时，产生足够的转矩。该装置可以包括初始化传感器，其检测2相SRM的各相的各位置，并且基于检测结果生成初始化传感器信号; 驱动传感器，其检测2相SRM的各相的各位置，并根据检测结果生成驱动传感器信号; 以及初始驱动时基于初始化传感器信号驱动2相SRM的微处理器，通常在正常驱动时基于驱动传感器信号来驱动2相SRM。

47. 发明授权

US07923888B2 Switched reluctance motor 失效
标题翻译：开关磁阻电机
公开(公告)号：US07923888B2
公开(公告)日：2011-04-12
申请号：US12088248
申请日：2006-10-19
申请人： Sang-Young Kim , Jun-Young Lim
发明人： Sang-Young Kim , Jun-Young Lim
IPC分类号： H02K1/06
CPC分类号： H02K19/103 , H02K1/24 , H02K1/246
摘要： Disclosed is a switched reluctance motor which can reduce noise and prevent overheating in rotation of a rotor. The switched reluctance motor includes: a stator core having a plurality of inwardly protruded poles at predetermined intervals; coils wound around the protruded poles of the stator core; and a rotor core being rotatably housed inside the stator core with a predetermined gap, and having a plurality of outwardly protruded poles along the radial direction, and round units protruded from the front ends of each protruded pole of the rotor core starting to meet each protruded pole of the stator core, so that gaps between the protruded poles of the stator core and the protruded poles of the rotor core can be gradually reduced.
摘要翻译：公开了一种可以减少噪音并防止转子转动过热的开关磁阻电动机。开关磁阻电动机包括：定子铁心，其以预定间隔具有多个向内突出的磁极; 卷绕在定子铁心的突出极上的线圈; 并且转子铁芯以预定的间隙可旋转地容纳在定子铁心内部，并且沿着径向方向具有多个向外突出的极，并且从转子芯的每个突出极的前端突出的圆形单元开始与每个突出的定子铁心的突出极之间的间隙可以逐渐减小。

48. 发明申请

US20100321961A1 INSULATION TRANSFORMER AND KEY INPUT CIRCUIT HAVING THE SAME 有权
标题翻译：绝缘变压器和具有该绝缘变压器的主输入电路
公开(公告)号：US20100321961A1
公开(公告)日：2010-12-23
申请号：US12446019
申请日：2007-10-17
申请人： Jun-Young Lim , Sang-Young Kim
发明人： Jun-Young Lim , Sang-Young Kim
IPC分类号： H02M3/335 , H01F27/28
CPC分类号： H01F3/14 , H01F19/04 , H01F27/292 , H01F41/069 , H01F2019/085
摘要： An insulation transformer and a key input circuit having the same are disclosed. The insulation transformer includes: a core having a certain gap; and primary and secondary coils wound on the core. According to the insulation transformer, the operation deficiency of the insulation transformer can be reduced and thus the signal transmission efficiency can be improved. Also, the key input circuit including: an insulation transformer includes a core having a certain gap, and primary and secondary coils wound on the core; a microcomputer connected with the primary coil; and a key input unit connected with the secondary coil and including multiple resistors and switches. According to the key input circuit having the insulation transformer, the reliability of the operation of the key input circuit can be improved and user inconvenience that may be caused by an operation error can be prevented.
摘要翻译：公开了一种绝缘变压器和具有该绝缘变压器的键输入电路。绝缘变压器包括：具有一定间隙的芯; 并且初级和次级线圈缠绕在芯上。根据绝缘变压器，可以降低绝缘变压器的工作不足，提高信号传输效率。此外，键输入电路包括：绝缘变压器包括具有一定间隙的芯，以及缠绕在芯上的初级和次级线圈; 与初级线圈连接的微型计算机; 以及与次级线圈连接并包括多个电阻和开关的键输入单元。根据具有绝缘变压器的键输入电路，可以提高键输入电路的操作的可靠性，并且可以防止可能由操作错误引起的用户不方便。

49. 发明申请

US20100156337A1 APPARATUS AND METHOD FOR DRIVING 2-PHASE SRM MOTOR 有权
标题翻译：用于驱动两相SRM电机的装置和方法
公开(公告)号：US20100156337A1
公开(公告)日：2010-06-24
申请号：US12088736
申请日：2006-10-25
申请人： Sang-Young Kim
发明人： Sang-Young Kim
IPC分类号： H02P6/20
CPC分类号： H02P25/08 , H02P1/163
摘要： Disclosed is an apparatus and method for driving a 2-phase SRM. The method comprises initializing 2-phase based on a detected position of a rotor by an initializing sensor at the time of an initial driving, and normally driving 2-phase based on a detected position of the rotor by a driving sensor. Accordingly, a sufficient amount of torque is generated when the 2-phase SRM is driven at a high speed. The apparatus comprises an initializing sensor which detects each position of each phase of a 2-phase SRM, and generates an initializing sensor signal based on the detected result; a driving sensor which detects each position of each phase of the 2-phase SRM, and generates a driving sensor signal based on the detected result; and a microprocessor which initially drives the 2-phase SRM based on the initializing sensor signal at the time of an initial driving, and normally drives the 2-phase SRM based on the driving sensor signal at the time of a normal driving.
摘要翻译：公开了用于驱动2相SRM的装置和方法。该方法包括在初始驱动时通过初始化传感器基于转子的检测位置初始化2相，并且通过驱动传感器基于转子的检测位置正常驱动2相。因此，当以高速驱动2相SRM时，产生足够的转矩。该装置包括：初始化传感器，其检测2相SRM的各相的各位置，并根据检测结果生成初始化传感器信号; 驱动传感器，其检测2相SRM的各相的各位置，并根据检测结果生成驱动传感器信号; 以及初始驱动时基于初始化传感器信号驱动2相SRM的微处理器，通常在正常驱动时基于驱动传感器信号驱动2相SRM。

50. 发明申请

US20100044764A1 COMPLEMENTARY METAL OXIDE SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME 有权
公开(公告)号：US20100044764A1
公开(公告)日：2010-02-25
申请号：US12606845
申请日：2009-10-27
申请人： Sang-Young Kim
发明人： Sang-Young Kim
IPC分类号： H01L31/112
CPC分类号： H01L27/14643 , H01L27/14601 , H01L27/14689
摘要： A complementary metal oxide semiconductor (CMOS) device and a method for fabricating the same are provided. The CMOS image sensor includes: a first conductive type substrate including a trench; a channel stop layer formed by using a first conductive type epitaxial layer over an inner surface of the trench; a device isolation layer formed on the channel stop layer to fill the trench; a second conductive type photodiode formed in a portion of the substrate in one side of the channel stop layer; and a transfer gate structure formed on the substrate adjacent to the photodiode to transfer photo-electrons generated from the photodiode.

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