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1. 发明申请

US20060118831A1 Semiconductor package and manufacturing method thereof 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20060118831A1
公开(公告)日：2006-06-08
申请号：US11268772
申请日：2005-11-08
申请人： Hyun-Ik Hwang , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Jun-Soo Han
发明人： Hyun-Ik Hwang , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Jun-Soo Han
IPC分类号： H01L27/148
CPC分类号： H01L24/85 , H01L23/13 , H01L23/49827 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/73215 , H01L2224/83192 , H01L2224/8385 , H01L2224/85 , H01L2224/92 , H01L2224/92147 , H01L2924/00014 , H01L2924/01006 , H01L2924/01024 , H01L2924/01028 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2224/83 , H01L2224/78 , H01L2924/00
摘要： A semiconductor package may include a substrate having a first major surface supporting a substrate pad and a bump pad electrically connected to the substrate pad. The substrate may have a second major surface with a concave part. A substrate window may extend through the substrate and open at the concave part. A semiconductor chip may be mounted on the substrate. The semiconductor chip may have a chip pad exposed through the substrate windows. Additionally, a method may involve forming a concave part in the substrate.
摘要翻译：半导体封装可以包括具有支撑衬底焊盘的第一主表面和电连接到衬底焊盘的凸块焊盘的衬底。衬底可以具有带凹部的第二主表面。衬底窗口可以延伸穿过衬底并在凹部处打开。半导体芯片可以安装在基板上。半导体芯片可以具有通过基板窗口暴露的芯片焊盘。另外，一种方法可以包括在衬底中形成凹部。

2. 发明授权

US07405105B2 Stack package using anisotropic conductive film (ACF) and method of making same 有权
公开(公告)号：US07405105B2
公开(公告)日：2008-07-29
申请号：US11905243
申请日：2007-09-28
申请人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
发明人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
IPC分类号： H01L21/00
CPC分类号： H01L25/105 , H01L2224/06136 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/01079 , H01L2924/3511 , H01L2924/00 , H01L2924/00012
摘要： Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.

3. 发明申请

US20080026507A1 Stack package using anisotropic conductive film (ACF) and method of making same 有权
标题翻译：使用各向异性导电膜（ACF）的堆叠封装及其制作方法
公开(公告)号：US20080026507A1
公开(公告)日：2008-01-31
申请号：US11905243
申请日：2007-09-28
申请人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
发明人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
IPC分类号： H01L21/60
CPC分类号： H01L25/105 , H01L2224/06136 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/01079 , H01L2924/3511 , H01L2924/00 , H01L2924/00012
摘要： Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.
摘要翻译：提供了一种使用各向异性导电膜（ACF）的堆叠封装，用于在从多个CSP初始制造堆叠封装期间减少施加在芯片级封装（CSP）上的热应力，并且用于促进堆叠封装的修复和/或返工， CSP同时减少对CSP的损害的可能性。在包括使用ACF堆叠的多个CSP的堆叠封装中，每个CSP通常将包括安装在电路板上并电连接到电路板的电路板，半导体芯片，以及将半导体芯片布置在外围设备上的焊球或其它导电结构电路板区域。还提供了用于初始生产这种堆叠包装的方法以及用于这种堆叠包装的修理和返工的补充方法。

4. 发明授权

US07291925B2 Stack package using anisotropic conductive film (ACF) and method of making same 有权
标题翻译：使用各向异性导电膜（ACF）的堆叠封装及其制作方法
公开(公告)号：US07291925B2
公开(公告)日：2007-11-06
申请号：US11133317
申请日：2005-05-20
申请人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
发明人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
IPC分类号： H01L23/48
CPC分类号： H01L25/105 , H01L2224/06136 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/01079 , H01L2924/3511 , H01L2924/00 , H01L2924/00012
摘要： Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.
摘要翻译：提供了一种使用各向异性导电膜（ACF）的堆叠封装，用于在从多个CSP初始制造堆叠封装期间减少施加在芯片级封装（CSP）上的热应力，并且用于促进堆叠封装的修复和/或返工， CSP同时减少对CSP的损害的可能性。在包括使用ACF堆叠的多个CSP的堆叠封装中，每个CSP通常将包括安装在电路板上并电连接到电路板的电路板，半导体芯片，以及将半导体芯片布置在外围设备上的焊球或其它导电结构电路板区域。还提供了用于初始生产这种堆叠包装的方法以及用于这种堆叠包装的修理和返工的补充方法。

5. 发明授权

US07288436B2 Semiconductor chip package manufacturing method including screen printing process 失效
标题翻译：半导体芯片封装制造方法包括丝网印刷工艺
公开(公告)号：US07288436B2
公开(公告)日：2007-10-30
申请号：US11003378
申请日：2004-12-06
申请人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han , Hyun-Ik Hwang
发明人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han , Hyun-Ik Hwang
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/52 , H01L23/48 , H01L21/20
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L2224/2919 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2224/92147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/30105 , H01L2924/00
摘要： A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.
摘要翻译：用于制造半导体芯片封装的方法可以包括使用丝网印刷掩模在基板上丝网印刷粘合剂。粘合剂可以在第一固化过程中被加热。半导体芯片可以附着在基板上的粘合剂上。粘合剂可以在第二固化过程中被加热。粘合剂的物理性能可以在丝网印刷过程之前和之后转化，以改善粘合剂的操作性能和/或质量。

6. 发明申请

US20060102996A1 Stack package using anisotropic conductive film (ACF) and method of making same 有权
标题翻译：使用各向异性导电膜（ACF）的堆叠封装及其制作方法
公开(公告)号：US20060102996A1
公开(公告)日：2006-05-18
申请号：US11133317
申请日：2005-05-20
申请人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
发明人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L2224/06136 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/01079 , H01L2924/3511 , H01L2924/00 , H01L2924/00012
摘要： Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.
摘要翻译：提供了一种使用各向异性导电膜（ACF）的堆叠封装，用于在从多个CSP初始制造堆叠封装期间减少施加在芯片级封装（CSP）上的热应力，并且用于促进堆叠封装的修复和/或返工， CSP同时减少对CSP的损害的可能性。在包括使用ACF堆叠的多个CSP的堆叠封装中，每个CSP通常将包括安装在电路板上并电连接到电路板的电路板，半导体芯片，以及将半导体芯片布置在外围设备上的焊球或其它导电结构电路板区域。还提供了用于初始生产这种堆叠包装的方法以及用于这种堆叠包装的修理和返工的补充方法。

7. 发明申请

US20050287708A1 Semiconductor chip package manufacturing method including screen printing process 失效
标题翻译：半导体芯片封装制造方法包括丝网印刷工艺
公开(公告)号：US20050287708A1
公开(公告)日：2005-12-29
申请号：US11003378
申请日：2004-12-06
申请人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han
发明人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han
IPC分类号： H05K3/34 , H01L21/44 , H01L21/52 , H01L21/58 , H05K3/12
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L2224/2919 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2224/92147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/30105 , H01L2924/00
摘要： A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.
摘要翻译：用于制造半导体芯片封装的方法可以包括使用丝网印刷掩模将粘合剂丝网印刷在基板上。粘合剂可以在第一固化过程中被加热。半导体芯片可以附着在基板上的粘合剂上。粘合剂可以在第二固化过程中被加热。粘合剂的物理性能可以在丝网印刷过程之前和之后转化，以改善粘合剂的操作性能和/或质量。

8. 发明授权

US07741803B2 Apparatus and method for driving 2-phase SRM 有权
标题翻译：用于驱动两相SRM的装置和方法
公开(公告)号：US07741803B2
公开(公告)日：2010-06-22
申请号：US12091492
申请日：2006-10-25
申请人： Sang-Young Kim , Yong-Won Choi
发明人： Sang-Young Kim , Yong-Won Choi
IPC分类号： H02P25/00
CPC分类号： H02P25/0925 , H02P6/15
摘要： Disclosed is an apparatus and method for driving a 2-phase SRM capable of individually performing an initial driving by an initializing sensor and a normal driving by a driving sensor, and capable of controlling a rotation speed of the SRM by delaying a phase signal by a half period and then generating a pulse width modulation signal based on the period. The apparatus comprises: a driving sensor which detects a position of a rotor thus to generate a driving sensor signal based on a result of the detection; a microprocessor which generates a 1-phase signal and a 2-phase signal based on a rising time and a falling time of the driving sensor signal at the time of a normal driving; an oscillator which generates first and second pulse width modulation signals delayed by a preset time; and a multiplying unit which multiplies the 1-phase and 2-phase signals with the first and second pulse width modulation signals, and generates 1-phase and 2-phase driving signals based on a result of the multiplication.
摘要翻译：公开了一种用于驱动能够通过初始化传感器单独执行初始驱动和由驱动传感器进行的正常驱动的两相SRM的装置和方法，并且能够通过将相位信号延迟一个相位信号来控制SRM的转速然后根据该周期产生脉冲宽度调制信号。该装置包括：驱动传感器，其基于检测结果检测转子的位置从而产生驱动传感器信号; 基于正常驱动时的驱动传感器信号的上升时间和下降时间生成1相信号和2相信号的微处理器; 产生延迟了预设时间的第一和第二脉冲宽度调制信号的振荡器; 以及乘法单元，其将1相和2相信号与第一和第二脉冲宽度调制信号相乘，并且基于乘法的结果产生1相和2相驱动信号。

9. 发明申请

US20070057147A1 Complementary metal oxide semiconductor image sensor and method for fabricating the same 有权
标题翻译：互补金属氧化物半导体图像传感器及其制造方法
公开(公告)号：US20070057147A1
公开(公告)日：2007-03-15
申请号：US11303059
申请日：2005-12-13
申请人： Sang-Young Kim
发明人： Sang-Young Kim
IPC分类号： H01L27/00
CPC分类号： H01L27/14643 , H01L27/14601 , H01L27/14689
摘要： A complementary metal oxide semiconductor (CMOS) device and a method for fabricating the same are provided. The CMOS image sensor includes: a first conductive type substrate including a trench; a channel stop layer formed by using a first conductive type epitaxial layer over an inner surface of the trench; a device isolation layer formed on the channel stop layer to fill the trench; a second conductive type photodiode formed in a portion of the substrate in one side of the channel stop layer; and a transfer gate structure formed on the substrate adjacent to the photodiode to transfer photo-electrons generated from the photodiode.
摘要翻译：提供互补金属氧化物半导体（CMOS）器件及其制造方法。 CMOS图像传感器包括：包括沟槽的第一导电型衬底; 通过在沟槽的内表面上使用第一导电型外延层形成的沟道阻挡层; 形成在沟道停止层上以填充沟槽的器件隔离层; 形成在所述通道停止层的一侧的所述基板的一部分中的第二导电型光电二极管; 以及形成在与光电二极管相邻的衬底上的转移栅极结构，以转移由光电二极管产生的光电子。

10. 发明申请

US20060021182A1 Traveling equipment for cleaner 有权
公开(公告)号：US20060021182A1
公开(公告)日：2006-02-02
申请号：US11068796
申请日：2005-03-02
申请人： Sang-Young Kim , Jun-Young Lim , Yong-Won Choi
发明人： Sang-Young Kim , Jun-Young Lim , Yong-Won Choi
IPC分类号： A47L5/28
CPC分类号： A47L9/2857 , A47L5/28 , A47L9/009 , A47L9/2842 , A47L9/325 , Y10S15/10
摘要： Traveling equipment for a cleaner comprises: a traveling motor mounted to a cleaner head part and for generating a normal torque and a reverse torque; a traveling shaft penetrated and coupled to the traveling motor and supplied with the torque of the traveling motor; traveling wheels coupled to both sides of the traveling shaft; an operation mode selection means for selectively regulating the automatic back and forth operation function and manual function; a control means for outputting a control signal upon receiving a signal selected by the operation mode selection means; and a driving means for driving the traveling motor upon receiving the control signal of the control means. By this, the user's convenience is raised and the simplicity of the components is acquired.

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