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41. 发明申请

US20110102972A1 Chip-type electric double layer capacitor cell and method of manufacturing the same 审中-公开
标题翻译：片式双电层电容器及其制造方法
公开(公告)号：US20110102972A1
公开(公告)日：2011-05-05
申请号：US12923950
申请日：2010-10-15
申请人： Chang Ryul Jung , Sung Ho Lee , Dong Sup Park , Hyun Chul Jung , Yeong Su Cho , Sang Kyun Lee
发明人： Chang Ryul Jung , Sung Ho Lee , Dong Sup Park , Hyun Chul Jung , Yeong Su Cho , Sang Kyun Lee
IPC分类号： H01G9/08 , H01G13/00 , B23K11/00 , B23K20/10
CPC分类号： H01G11/80 , H01G9/016 , H01G9/10 , H01G9/155 , H01G11/74 , H01G11/82 , H01G11/84 , Y02E60/13 , Y02T10/7022
摘要： There is provided a chip-type electric double layer capacitor comprising: a resin case having a housing space provided therein and formed of insulating resin and first and second external terminals inserted into the resin case by insert injection molding. Each of the external terminals has a first portion exposed to an outer surface of the resin case for external contact and a second portion exposed to an inner surface of the housing space for internal contact. a sealing portion includes a groove portion provided in the resin case along a circumference of at least one of the first and second external terminals and a resin filling the groove portion. An electric double layer capacitor cell is mounted in the housing space and electrically connected to the second portion of the first and second external terminals.
摘要翻译：提供了一种芯片式双电层电容器，包括：具有设置在其中的由绝缘树脂形成的容纳空间的树脂壳体和通过插入注射成型插入到树脂壳体中的第一和第二外部端子。每个外部端子具有暴露于用于外部接触的树脂壳体的外表面的第一部分和暴露于壳体空间的内表面以用于内部接触的第二部分。密封部分包括沿着第一和第二外部端子中的至少一个的圆周设置在树脂壳体中的凹槽部分和填充凹槽部分的树脂。电双层电容器电池安装在容纳空间中并电连接到第一和第二外部端子的第二部分。

42. 发明授权

US10003049B2 Secondary battery of improved safety 有权
公开(公告)号：US10003049B2
公开(公告)日：2018-06-19
申请号：US13812225
申请日：2011-08-02
申请人： Sungjin Kwon , Soonho Ahn , Hyun Chul Jung , Ki Woong Kim , Young Hun Kim
发明人： Sungjin Kwon , Soonho Ahn , Hyun Chul Jung , Ki Woong Kim , Young Hun Kim
IPC分类号： H01M2/08 , H01M2/02 , H01M2/22 , H01M2/26 , H01M10/04 , H01M10/0525
CPC分类号： H01M2/0202 , H01M2/021 , H01M2/08 , H01M2/22 , H01M2/26 , H01M10/0436 , H01M10/0525
摘要： Disclosed herein is a secondary battery having an electrode assembly mounted in a receiving part of a pouch-shaped battery case, wherein convex parts formed to protrude from the battery case upward are provided at the upper end of the receiving part of the battery case corresponding to electrode tabs of the electrode assembly so as to support coupling portions (V-form regions) between the electrode tabs and corresponding electrode leads against injection pressure of a holt melt resin during injection molding to form a pack case with respect to the secondary battery.

43. 发明申请

US20120297594A1 METHOD OF MANUFACTURING CHIP-TYPE ELECTRIC DOUBLE LAYER CAPACITOR 审中-公开
标题翻译：芯片型双电层电容器的制造方法
公开(公告)号：US20120297594A1
公开(公告)日：2012-11-29
申请号：US13568483
申请日：2012-08-07
申请人： Sang Kyun Lee , Chang Ryul Jung , Sung Ho Lee , Dong Sup Park , Yeong Su Cho , Hyun Chul Jung
发明人： Sang Kyun Lee , Chang Ryul Jung , Sung Ho Lee , Dong Sup Park , Yeong Su Cho , Hyun Chul Jung
IPC分类号： H01G9/155
CPC分类号： H01G9/155 , H01G9/016 , H01G9/10 , H01G11/74 , H01G11/80 , H01G11/82 , H01G11/84 , Y02E60/13 , Y02T10/7022 , Y10T29/417
摘要： A method of manufacturing a chip-type electric double layer capacitor, including: forming a lower case having an opened housing space and first and second external terminals buried therein, the first and second external terminals having first surfaces exposed to the housing space, respectively, and second surfaces exposed to an outer region of the lower case, respectively; mounting an electric double layer capacitor cell in the housing space such that the electric double layer capacitor cell is electrically connected to the first surfaces of the first and second external terminals exposed to the housing space; and mounting an upper cap on the lower case so as to cover the housing space.
摘要翻译：一种制造芯片式双电层电容器的方法，包括：形成具有开放的容纳空间的下壳体和埋入其中的第一和第二外部端子，第一和第二外部端子分别具有暴露于容纳空间的第一表面，以及分别暴露于所述下壳体的外部区域的第二表面; 将双电层电容器单元安装在容纳空间中，使得双电层电容器单元电连接到暴露于容纳空间的第一和第二外部端子的第一表面; 并将上盖安装在下壳体上以覆盖住容纳空间。

44. 发明申请

US20100214721A1 Electric double layer capacitor package 审中-公开
标题翻译：电双层电容器封装
公开(公告)号：US20100214721A1
公开(公告)日：2010-08-26
申请号：US12585154
申请日：2009-09-04
申请人： Sang Kyun Lee , Gi Rak Lee , Ho Joo Lee , Hyun Chul Jung
发明人： Sang Kyun Lee , Gi Rak Lee , Ho Joo Lee , Hyun Chul Jung
IPC分类号： H01G9/08 , H01G9/155
CPC分类号： H01G9/155 , H01G9/016 , H01G9/10 , H01G11/12 , H01G11/82 , Y02E60/13 , Y02T10/7022
摘要： An electric double layer capacitor package includes a package body including a groove region formed by removing a portion from a surface thereof, an electric double layer capacitor disposed in the groove region of the package body, and including first and second electrodes and an ion permeable separator disposed between the first and second electrodes, and first and second conductive vias each disposed in an inner portion of the package body and each having one end connected to one of the first and second electrodes, respectively and the other end extending from the one end toward a bottom surface of the package body in the case that the surface is defined as an upper region of the package body. The electric double layer capacitor package can be surface-mounted without using an additional structure. The use of the electric double layer capacitor package achieves a reduction in thickness and mounting area, thereby contributing to the production of lighter and smaller products.
摘要翻译：一种双电层电容器封装，包括：封装体，包括通过从其表面除去一部分而形成的沟槽区;布置在封装体的沟槽区域中的双电层电容器，并且包括第一和第二电极和离子可渗透分离器设置在第一和第二电极之间，以及第一和第二导电通孔，每个导电通孔分别设置在封装体的内部部分中，并且每个具有一端分别连接到第一和第二电极中的一个，另一端从一端朝向在表面被限定为包装体的上部区域的情况下，包装体的底面。电双层电容器封装可以在不使用附加结构的情况下进行表面安装。使用双电层电容器封装实现了厚度和安装面积的减小，从而有助于生产更轻和更小的产品。

45. 发明申请

US20130330606A1 SECONDARY BATTERY OF IMPROVED SAFETY 有权
标题翻译：改进安全的二次电池
公开(公告)号：US20130330606A1
公开(公告)日：2013-12-12
申请号：US13812225
申请日：2011-08-02
申请人： Sungjin Kwon , Soonho Ahn , Hyun Chul Jung , Ki Woong Kim , Young Hun Kim
发明人： Sungjin Kwon , Soonho Ahn , Hyun Chul Jung , Ki Woong Kim , Young Hun Kim
IPC分类号： H01M2/02 , H01M10/0525
CPC分类号： H01M2/0202 , H01M2/021 , H01M2/08 , H01M2/22 , H01M2/26 , H01M10/0436 , H01M10/0525
摘要： Disclosed herein is a secondary battery having an electrode assembly mounted in a receiving part of a pouch-shaped battery case, wherein convex parts formed to protrude from the battery case upward are provided at the upper end of the receiving part of the battery case corresponding to electrode tabs of the electrode assembly so as to support coupling portions (V-form regions) between the electrode tabs and corresponding electrode leads against injection pressure of a holt melt resin during injection molding to form a pack case with respect to the secondary battery.
摘要翻译：这里公开了一种二次电池，其具有安装在袋状电池壳体的容纳部分中的电极组件，其中形成为从电池壳体向上突出的凸部设置在电池壳体的接收部分的上端，电极组件的电极片，以便在注射模制期间支撑电极片和相应的电极引线之间的耦合部分（V形区域），以抵抗注射成型时的电荷熔融树脂的注射压力，从而形成相对于二次电池的包装盒。

46. 发明授权

US08266355B2 Electronic apparatus transmitting and receiving signal through single wire 失效
标题翻译：电子设备通过单线发送和接收信号
公开(公告)号：US08266355B2
公开(公告)日：2012-09-11
申请号：US12618254
申请日：2009-11-13
申请人： Hee Bum Lee , Hyun Chul Jung , Kyoung Soo Chae
发明人： Hee Bum Lee , Hyun Chul Jung , Kyoung Soo Chae
IPC分类号： G06F3/00 , G06F13/00 , G06F13/42
CPC分类号： G08C19/00 , B41J2/17546
摘要： There is provided an electronic apparatus transmitting and receiving a signal through a single wire that that has a main electronic apparatus and a sub-electronic apparatus connected through a single wire, transmits status information and performs control and communication through the single wire. The electronic apparatus transmitting and receiving a signal through a single wire may include: a sub-electronic apparatus transmitting a detection signal containing status information through a single wire, and performing a predetermined operation upon receiving a response signal to the detection signal; and a main electronic apparatus receiving the detection signal through the single wire and transmitting the response signal having a different signal format from the detection signal to the sub-electronic apparatus.
摘要翻译：提供了通过单线发送和接收信号的电子设备，该单线具有通过单线连接的主电子设备和子电子设备，通过单线传输状态信息并进行控制和通信。通过单线发送和接收信号的电子设备可以包括：子电子设备，其通过单线发送包含状态信息的检测信号，并且在接收到对检测信号的响应信号时执行预定操作; 以及主电子设备，通过单线接收检测信号，并将具有不同信号格式的响应信号从检测信号发送到子电子设备。

47. 发明申请

US20110133757A1 Apparatus and method for evaluating capacitor 审中-公开
标题翻译：电容器评估装置及方法
公开(公告)号：US20110133757A1
公开(公告)日：2011-06-09
申请号：US12662717
申请日：2010-04-29
申请人： Kyoung Soo Chae , Hyun Chul Jung , Hee Bum Lee
发明人： Kyoung Soo Chae , Hyun Chul Jung , Hee Bum Lee
IPC分类号： G01R27/26
CPC分类号： G01R31/028 , G01R27/2605
摘要： There is provided an apparatus for evaluating a capacitor, including: a charge/discharge control unit 100 that controls charge and discharge, a charge/discharge switch 200 that selects a connection between a capacitor CSP to be measured and a power supply unit 50 or a connection between the capacitor CSP and a discharge path DP, a discharge unit 300 that is connected to the discharge path DP and provides discharge resistance for the discharge of the capacitor CSP, a voltage measuring unit 400 that measures the voltage of the capacitor CSP, a current measuring unit 500 that measures the charge current or discharge current of the capacitor CSP, and a main control unit 600 that controls the charge and discharge through the charge/discharge control unit 100 and obtains equivalent series resistance Res, capacitance C and self discharge resistance Rsd during the charge and discharge.
摘要翻译：提供了一种用于评估电容器的装置，包括：充电/放电控制单元100，其控制充放电;充电/放电开关200，其选择要测量的电容器CSP与电源单元50或电容器CSP和放电路径DP之间的连接，连接到放电路径DP并且提供用于放电电容器CSP的放电电阻的放电单元300，测量电容器CSP的电压的电压测量单元400，测量电容器CSP的充电电流或放电电流的电流测量单元500以及通过充放电控制单元100控制充放电的主控制单元600，并获得等效串联电阻Res，电容C和自放电电阻 Rsd在充放电期间。

48. 发明申请

US20110058307A1 Chip-type electric double layer capacitor and method for manufacturing the same 审中-公开
标题翻译：片式双电层电容器及其制造方法
公开(公告)号：US20110058307A1
公开(公告)日：2011-03-10
申请号：US12591410
申请日：2009-11-18
申请人： Sung Ho Lee , Seung Hyun Ra , Dong Sup Park , Yeong Su Cho , Sang Kyun Lee , Hyun Chul Jung , Chang Ryul Jung
发明人： Sung Ho Lee , Seung Hyun Ra , Dong Sup Park , Yeong Su Cho , Sang Kyun Lee , Hyun Chul Jung , Chang Ryul Jung
IPC分类号： H01G9/155
CPC分类号： H01G9/155 , H01G9/016 , H01G9/10 , H01G11/52 , H01G11/74 , H01G11/80 , H01G11/82 , H01G11/84 , Y02E60/13
摘要： The present invention relates to a chip-type electric double layer capacitor and a method for manufacturing a method for manufacturing the same. The chip-type electric double layer capacitor includes an electric double layer element including two electrodes that include two different polarities and electrode terminals protruded on sides opposite to each other, a first separator that prevents the two electrodes from being short-circuited, and a second separator that is disposed at a position opposed to the first separator on the basis of one electrode of the two electrodes; and a package including package terminals attached to the protruded electrode terminals of the two electrodes, which are formed on the bottom thereof and housing the electric double layer element, wherein the electric double layer element is wound on the basis of the protruded electrode terminals opposite to the two electrodes as a reference axis and the electrode terminals are attached to the package terminals, respectively.
摘要翻译：芯片型双电层电容器及其制造方法技术领域本发明涉及芯片式双电层电容器及其制造方法。芯片式双电层电容器包括双电层元件，其包括两个电极，其包括两个不同的极性，并且在彼此相反的一侧突出的电极端子，防止两个电极短路的第一隔板，以及第二隔离件分离器，其基于两个电极的一个电极设置在与第一分离器相对的位置处; 以及包括安装在两个电极的突出电极端子上的封装端子的封装，它们形成在其底部并容纳双电层元件，其中基于与第二电极相对的突出电极端子缠绕双电层元件作为参考轴的两个电极和电极端子分别附接到封装端子。

49. 发明申请

US20110058306A1 Chip-type electric double layer capacitor and package structure thereof 审中-公开
标题翻译：片式双电层电容器及其封装结构
公开(公告)号：US20110058306A1
公开(公告)日：2011-03-10
申请号：US12591010
申请日：2009-11-04
申请人： Sung Ho Lee , Seung Hyun Ra , Dong Sup Park , Yeong Su Cho , Sang Kyun Lee , Hyun Chul Jung , Chang Ryul Jung
发明人： Sung Ho Lee , Seung Hyun Ra , Dong Sup Park , Yeong Su Cho , Sang Kyun Lee , Hyun Chul Jung , Chang Ryul Jung
IPC分类号： H01G9/155 , H01G9/08
CPC分类号： H01G9/155 , H01G9/016 , H01G9/10 , H01G11/74 , H01G11/80 , H01G11/82 , Y02E60/13
摘要： Disclosed is a package structure of a chip-type electric double layer capacitor which includes a lower package, which houses an electric double layer element and has a package terminal formed thereon to be electrically connected to the electric double layer element, and an upper package which is disposed on a top part of the lower package and seals the electric double layer element from the outside, wherein the package terminals are formed to be protruded from an internal bottom surface and an external bottom surface of the lower package, and the external bottom surface of the lower package has at least two pairs of protrusions formed thereon.
摘要翻译：公开了芯片型双电层电容器的封装结构，其包括下封装，其容纳双电层元件并且具有形成在其上的封装端子以电连接到双电层元件，以及上封装设置在下封装的顶部，并将双电层元件从外部密封，其中封装端子形成为从下封装的内底表面和外底表面突出，外表面的下部封装具有形成在其上的至少两对突起。

50. 发明申请

US20090322152A1 ISOLATION CONTROL HIGH SPEED TRANSFER SWITCH FOR UNINTERRUPTIBLE POWER SUPPLY, POWER SUPPLY SYSTEM USING THE SWITCH AND ISOLATION CONTROL HIGH SPEED TRANSFER SWITCHING METHOD 有权
标题翻译：用于不间断电源的隔离控制高速转换开关，使用开关和隔离控制高速传输切换方式的电源系统
公开(公告)号：US20090322152A1
公开(公告)日：2009-12-31
申请号：US12392014
申请日：2009-02-24
申请人： Hyun Chul Jung , Byoung Sam Kim
发明人： Hyun Chul Jung , Byoung Sam Kim
IPC分类号： H02J9/06
CPC分类号： H02J9/062 , H02J2009/068 , Y10T307/615 , Y10T307/625
摘要： Disclosed is a UPS isolation control high speed transfer switch for switching a power supply path of a UPS to a bypass line and a power supply system equipped with the high speed transfer switch. The switch is isolated from the UPS and detects the output power of UPS, and switches a power supply path from a normal power line to the bypass line, by turning off the transfer switch of the bypass line after turning off an output breaker of a normal power line when the output power is deviated from a preset normal range. Furthermore, the switch performs a switching to the bypass line only when the output breaker of the UPS is actually turned off, after confirming the turn-off of the output breaker when switching the power supply path to the bypass line.
摘要翻译：公开了一种UPS隔离控制高速转换开关，用于将UPS的电源路径切换到旁路线路，以及配备有高速转换开关的电源系统。开关与UPS隔离，并检测UPS的输出功率，并将电源路径从正常电源线路切换到旁路线路，通过关闭旁路线路的转换开关，关闭正常的输出断路器当输出功率偏离预设的正常范围时，电源线。此外，只有当UPS的输出断路器实际关断时，在将电源路径切换到旁路线路之后，确认关闭输出断路器之后，开关才切换到旁路线路。

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