专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明授权

US07422516B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US07422516B2
公开(公告)日：2008-09-09
申请号：US11868829
申请日：2007-10-08
申请人： Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人： Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
IPC分类号： B24D11/02 , B23H5/06 , C25D5/22
CPC分类号： B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.
摘要翻译：提供了用于研磨衬底的抛光制品的实施例。在一个实施例中，抛光制品包括由与由导电材料制成的环形下层耦合的电介质材料制成的环形上层，以及夹在环形上层和环形下层之间的环形子垫，其与之形成可更换组件。

42. 发明授权

US07323416B2 Method and composition for polishing a substrate 失效
标题翻译：抛光基材的方法和组合物
公开(公告)号：US07323416B2
公开(公告)日：2008-01-29
申请号：US11196876
申请日：2005-08-04
申请人： Feng Q. Liu , Tianbao Du , Alain Duboust , Yan Wang , Yongqi Hu , Stan D. Tsai , Liang-Yuh Chen , Wen-Chiang Tu , Wei-Yung Hsu
发明人： Feng Q. Liu , Tianbao Du , Alain Duboust , Yan Wang , Yongqi Hu , Stan D. Tsai , Liang-Yuh Chen , Wen-Chiang Tu , Wei-Yung Hsu
IPC分类号： H01L21/302
CPC分类号： B23H5/08 , B24B37/042 , C25F3/02 , H01L21/32125 , H01L21/6875 , H01L21/7684
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率除去，以及然后用至少一种化学机械抛光技术研磨衬底。

43. 发明授权

US07285036B2 Pad assembly for electrochemical mechanical polishing 有权
标题翻译：焊接组件用于电化学机械抛光
公开(公告)号：US07285036B2
公开(公告)日：2007-10-23
申请号：US11562320
申请日：2006-11-21
申请人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
发明人： Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
IPC分类号： B24D11/02 , C25F3/00 , C25D17/00 , C25C7/04
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.
摘要翻译：提供了用于处理基板的垫组件的实施例。焊盘组件包括处理层，其具有适于处理衬底的工作表面，耦合到处理层的下层并设置在处理层下方的电极，以及具有设置在处理层的工作表面下方和下方的上表面的电极。电极的上表面通过多个孔至少部分地暴露于工作表面，以在电极的上表面和焊盘组件的工作表面之间提供电解质通路。

44. 发明授权

US07137879B2 Conductive polishing article for electrochemical mechanical polishing 有权
公开(公告)号：US07137879B2
公开(公告)日：2006-11-21
申请号：US11393220
申请日：2006-03-30
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D3/34 , B24D11/00 , B24D17/00
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

45. 发明授权

US07128825B2 Method and composition for polishing a substrate 有权
公开(公告)号：US07128825B2
公开(公告)日：2006-10-31
申请号：US10378097
申请日：2003-02-26
申请人： Feng Q. Liu , Stan D. Tsai , Yongqi Hu , Siew S. Neo , Yan Wang , Alain Duboust , Liang-Yuh Chen
发明人： Feng Q. Liu , Stan D. Tsai , Yongqi Hu , Siew S. Neo , Yan Wang , Alain Duboust , Liang-Yuh Chen
IPC分类号： C25F3/00
CPC分类号： H01L21/32125 , B23H3/08 , B23H5/08 , B24B37/0056 , B24B37/044 , B24B37/046 , C09G1/02 , C09G1/04 , C25F3/02 , H01L21/32134
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 3 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.

46. 发明授权

US07084064B2 Full sequence metal and barrier layer electrochemical mechanical processing 失效
标题翻译：全序列金属和阻隔层电化学机械加工
公开(公告)号：US07084064B2
公开(公告)日：2006-08-01
申请号：US10941060
申请日：2004-09-14
申请人： Feng Q. Liu , Liang-Yuh Chen , Stan D. Tsai , Yongqi Hu
发明人： Feng Q. Liu , Liang-Yuh Chen , Stan D. Tsai , Yongqi Hu
IPC分类号： H01L21/311
CPC分类号： B23H5/08 , C25F7/00
摘要： A method and apparatus for electrochemically processing metal and barrier materials is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, pressing the substrate against a processing pad assembly with a force less than about 2 psi, providing motion between the substrate and pad assembly in contact therewith and electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station.
摘要翻译：提供了一种用于电化学处理金属和阻隔材料的方法和装置。在一个实施例中，一种用于电化学处理衬底的方法包括以下步骤：在衬底上的暴露的阻挡材料层与电极之间建立通过电解质的导电路径，将衬底压在处理垫组件上，在约2psi之间提供与衬底和衬垫组件接触的运动，并在屏障处理站中的第一电化学处理步骤期间电化学去除暴露层的一部分。

47. 发明授权

US06613200B2 Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform 失效
标题翻译：电化学镀层减薄，并与化学机械抛光机整合成单个平台
公开(公告)号：US06613200B2
公开(公告)日：2003-09-02
申请号：US09770559
申请日：2001-01-26
申请人： Shijian Li , Stan D. Tsai , Lizhong Sun
发明人： Shijian Li , Stan D. Tsai , Lizhong Sun
IPC分类号： C25D1700
CPC分类号： B24B37/32 , B24B37/046 , C25D17/001 , H01L21/2885 , H01L21/3212
摘要： An apparatus is provided for depositing and polishing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a basin, a cover, a permeable disc, an anode and a polishing head. The permeable disc is disposed in the basin between the cover and the basin's bottom. The cover has an aperture disposed therein that includes a plurality of pins. The pins extend radially into the aperture and are adapted to support the substrate. The anode is disposed in the basin between the disc and the bottom of the basin. The polishing head is adapted to retain the substrate during processing and includes a retaining ring. The retaining ring has a plurality of grooves disposed therein that mate with the pins when the polishing head is disposed in the aperture. When the substrate is biased via the pins, the potential between the substrate and the anode causes material to be deposited on the substrate's surface.
摘要翻译：提供了一种用于在衬底上沉积和抛光材料层的装置。在一个实施例中，提供了一种装置，其包括盆，盖，可渗透盘，阳极和抛光头。可渗透盘设置在盖和盆底之间的盆中。盖具有设置在其中的孔，其包括多个销。销钉径向延伸到孔中并且适于支撑基底。阳极设置在圆盘和盆底之间的盆中。抛光头适于在加工过程中保持基底并且包括保持环。保持环具有设置在其中的多个槽，当抛光头设置在孔中时与该销相配合。当衬底经由引脚偏置时，衬底和阳极之间的电势使材料沉积在衬底的表面上。

48. 发明授权

US09238293B2 Polishing pad edge extension 有权
标题翻译：抛光垫边缘延伸
公开(公告)号：US09238293B2
公开(公告)日：2016-01-19
申请号：US12253034
申请日：2008-10-16
申请人： Chih Hung Chen , Shou-Sung Chang , Stan D. Tsai
发明人： Chih Hung Chen , Shou-Sung Chang , Stan D. Tsai
IPC分类号： B24B37/20 , B24B37/34
CPC分类号： B24B37/20 , B24B37/34
摘要： A method and apparatus for providing a substantially uniform pressure to a polishing surface from a conditioning element is provided. The method includes urging a conditioning disk against a polishing surface of a rotating polishing pad, moving the conditioning disk across the polishing surface in a sweep pattern that includes at least a portion of the conditioning disk extending over a peripheral edge of the polishing surface, and maintaining a substantially uniform pressure to the polishing surface from the conditioning disk across the sweep pattern.
摘要翻译：提供了一种用于从调理元件向抛光表面提供基本均匀的压力的方法和装置。该方法包括将调节盘推压在旋转的抛光垫的抛光表面上，以调整图案的方式移动调节盘，该扫掠图案包括在抛光表面的周缘延伸的调理盘的至少一部分，以及在整个扫描图案上保持来自调节盘的抛光表面的基本均匀的压力。

49. 发明申请

US20100099339A1 POLISHING PAD EDGE EXTENSION 有权
标题翻译：抛光垫边缘延伸
公开(公告)号：US20100099339A1
公开(公告)日：2010-04-22
申请号：US12253034
申请日：2008-10-16
申请人： HUNG Cih CHEN , Shou-Sung Chang , Stan D. Tsai
发明人： HUNG Cih CHEN , Shou-Sung Chang , Stan D. Tsai
IPC分类号： B24B29/00 , B24B57/00
CPC分类号： B24B37/20 , B24B37/34
摘要： A method and apparatus for providing a substantially uniform pressure to a polishing surface from a conditioning element is provided. The method includes urging a conditioning disk against a polishing surface of a rotating polishing pad, moving the conditioning disk across the polishing surface in a sweep pattern that includes at least a portion of the conditioning disk extending over a peripheral edge of the polishing surface, and maintaining a substantially uniform pressure to the polishing surface from the conditioning disk across the sweep pattern.
摘要翻译：提供了一种用于从调理元件向抛光表面提供基本均匀的压力的方法和装置。该方法包括将调节盘推压在旋转的抛光垫的抛光表面上，以调整图案的方式移动调节盘，该扫掠图案包括在抛光表面的周缘延伸的调理盘的至少一部分，以及在整个扫描图案上保持来自调节盘的抛光表面的基本均匀的压力。

50. 发明申请

US20100035525A1 IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED LOOP TORQUE MONITORING 有权
标题翻译：通过闭环控制扭矩监测进行调节盘的现场性能预测
公开(公告)号：US20100035525A1
公开(公告)日：2010-02-11
申请号：US12187637
申请日：2008-08-07
申请人： SAMEER Deshpande , Shou-Sung Chang , Hung Chih Chen , Roy C. Nangoy , Stan D. Tsai
发明人： SAMEER Deshpande , Shou-Sung Chang , Hung Chih Chen , Roy C. Nangoy , Stan D. Tsai
IPC分类号： B24B53/02
CPC分类号： B24B49/18 , B24B37/005 , B24B49/16 , B24B53/017
摘要： Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioning disk. The conditioning disk removes enough material so the polishing surface can properly process the wafers but does not remove any excess material. Preventing excess material removal extends the life of the polishing pad. During CMP processing, the controller receives data concerning the torque applied to the conditioning disk and the torque applied to the arm to sweep the conditioning disk across the polishing pad. Based upon the detected operating conditions, the system can predict the rate of material removal and adjust the forces applied to the conditioning disk so that the life of the polishing pad is optimized.
摘要翻译：在CMP机器中使用的抛光垫是可消耗的部件，通常在处理特定数量的晶片之后被替换。抛光垫的寿命通过控制由调节盘从抛光垫去除的材料的速率被优化。调节盘移除足够的材料，因此抛光表面可以适当地处理晶片，但不会去除任何多余的材料。防止多余的材料去除延长了抛光垫的寿命。在CMP处理期间，控制器接收关于施加到调节盘的扭矩和施加到臂上的扭矩以扫掠经过抛光垫的调节盘的数据。基于检测到的操作条件，系统可以预测材料去除速率并调节施加到调节盘的力，以便抛光垫的寿命被优化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式