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    • 44. 发明授权
    • Cardiomyocytes-containing device and method for manufacturing and using the same
    • 含有心肌细胞的装置及其制造和使用方法
    • US08506793B2
    • 2013-08-13
    • US13147607
    • 2010-02-02
    • Ronald DekkerAnja Van De Stolpe
    • Ronald DekkerAnja Van De Stolpe
    • G01N27/327
    • G01N1/30C12N5/0657C12N2503/02C12N2535/10G01N33/5061
    • Disclosed is a device for determining the cardiotoxicity of a chemical compound, comprising a substrate (10) carrying a deformable stack (34), said stack being partially detached from the substrate by a cavity (32) allowing an out-of-plane deformation of the stack, said stack comprising a first deformable layer (16), a second deformable layer (20) and a multi-electrode structure (18) sandwiched between the first and second deformable layers, the second deformable layer carrying a pattern of cardiomyocytes (28) adhered thereto; and a liquid container (26) mounted on the substrate for exposing the cardiomyocytes to the chemical compound. A method of manufacturing such a device is also disclosed. The present invention further relates to the use of the device for drug target discovery and/or drug development and a method for developing a disease model for a disease that is caused by or modified by stretching of cells, in particular a cardiac disease model.
    • 公开了一种用于确定化合物的心脏毒性的装置,包括承载可变形叠层(34)的基底(10),所述叠层通过空腔(32)部分地从基底分离, 所述堆叠包括夹在所述第一和第二可变形层之间的第一可变形层(16),第二可变形层(20)和多电极结构(18),所述第二可变形层承载心肌细胞图案(28 ) 和安装在基板上的用于将心肌细胞暴露于化合物的液体容器(26)。 还公开了制造这种装置的方法。 本发明还涉及该装置用于药物靶发现和/或药物开发的用途,以及用于开发由细胞拉伸,特别是心脏疾病模型引起或改变的疾病的疾病模型的方法。
    • 50. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • US20100078795A1
    • 2010-04-01
    • US11993516
    • 2006-06-28
    • Ronald DekkerFreddy RoozeboomPeter NottenAntonius Lucien Adrianus Maria Kemmeren
    • Ronald DekkerFreddy RoozeboomPeter NottenAntonius Lucien Adrianus Maria Kemmeren
    • H01L23/538H01L23/482
    • H03H9/0547H01L25/16H01L27/14618H01L31/0203H01L2924/0002H03H9/105H01L2924/00
    • The electronic device comprises a semiconductor substrate (10) with at a first side (1) a circuit of semiconductor elements (20). The substrate (10) is present between a carrier (40) and an encapsulation (70), so that the first side (1) of the substrate (10) faces the carrier (40). The circuit of semiconductor elements (20) is coupled with conductor tracks (25) to a metallization (82) in a groove (80) in the encapsulation (70), which metallization (82) extends to terminals (90) at an outside of the encapsulation (70). At least one further electrical element (120) is defined between the first side (1) of the semiconductor substrate (10) and the encapsulation (70). This further element (120) is provided with at least one conductor track (65) extending to the metallization (82) in the groove (80) so as to incorporate the further element (120) in the circuit of semiconductor elements (20) on the first side (1) of the substrate (10).
    • 电子器件包括半导体衬底(10),在半导体元件(20)的第一侧(1)具有电路。 衬底(10)存在于载体(40)和封装(70)之间,使得衬底(10)的第一侧(1)面向载体(40)。 半导体元件(20)的电路与导体轨道(25)耦合到封装(70)中的凹槽(80)中的金属化(82),该金属化(82)延伸到端子(90)的外部 封装(70)。 在半导体衬底(10)的第一侧(1)和封装(70)之间限定至少一个另外的电元件(120)。 这个另外的元件(120)设置有至少一个延伸到凹槽(80)中的金属化(82)的导体轨道(65),以便在半导体元件(20)的电路中并入另外的元件(120) 衬底(10)的第一侧(1)。