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    • 7. 发明申请
    • DEFORMABLE INTEGRATED CIRCUIT DEVICE
    • 可变电容集成电路
    • US20100270640A1
    • 2010-10-28
    • US12377673
    • 2007-08-07
    • Ronald DekkerAntoon Marie Henrie TombeurTheodoros Zoumpoulidis
    • Ronald DekkerAntoon Marie Henrie TombeurTheodoros Zoumpoulidis
    • H01L23/52H01L21/98
    • H01L23/49833H01L23/5387H01L2924/0002H01L2924/00
    • An integrated-circuit device is provided, which comprises a rigid substrate island having a main substrate surface with a circuit region circuit elements and at least one fold structure. The fold structure is attached to the substrate island and is unfoldable from a relaxed, folded state to a strained unfolded state. The fold structure contains at least one passive electrical component. The fold structure further has in its folded state at least one surface with an area vector that includes a non-vanishing area-vector component in a direction parallel to the main substrate surface, which area-vector component is diminished or vanishes when deforming the fold structure from the folded into the unfolded state. The fold structure provided by the present invention allows fabricating the integrated-circuit device with small lateral extensions and thus takes up a particularly small amount of chip area, which reduces the cost per device.
    • 提供了一种集成电路器件,其包括具有主衬底表面的刚性衬底岛,其具有电路区域电路元件和至少一个折叠结构。 折叠结构附接到基底岛,并且可以从松弛的折叠状态展开到应变展开状态。 折叠结构包含至少一个无源电组件。 折叠结构在其折叠状态下进一步具有面向向的至少一个表面,该区域向量在平行于主衬底表面的方向上包括非消失的面积 - 矢量分量,该区域 - 矢量分量在折叠变形时减少或消失 结构从折叠到展开状态。 由本发明提供的折叠结构允许制造具有小横向延伸的集成电路器件,因此占据特别小量的芯片面积,这降低了每个器件的成本。