专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明申请

US20100190285A1 MICROELETROMECHANICAL SYSTEMS HAVING STORED CHARGE AND METHODS FOR FABRICATING AND USING SAME 有权
标题翻译：具有储存电荷的微生物系统及其制造方法和使用方法
公开(公告)号：US20100190285A1
公开(公告)日：2010-07-29
申请号：US12269231
申请日：2008-11-12
申请人： Brian H. Stark , Markus Lutz , Aaron Partridge
发明人： Brian H. Stark , Markus Lutz , Aaron Partridge
IPC分类号： H01L21/20
CPC分类号： B81B3/0086 , B81B3/0021
摘要： Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and employed in supplying, storing and/or trapping charge on the mechanical structure. In some aspects, a breakable link, a thermionic electron source and/or a movable mechanical structure are employed. The breakable link may comprise a fuse. In one embodiment, the movable mechanical structure is driven to resonate. In some aspects, the electrical charge enables a transducer to convert vibrational energy to electrical energy, which may be used to power circuit(s), device(s) and/or other purpose(s). In some aspects, the electrical charge is employed in changing the resonant frequency of a mechanical structure and/or generating an electrostatic force, which may be repulsive.
摘要翻译：许多发明被公开。一些方面涉及用于和/或制造MEMS的MEMS，和/或用于在设置在室中的机械结构上提供，存储和/或捕获电荷的方法。各种结构可以设置在室中并用于在机械结构上供应，储存和/或捕集电荷。在一些方面，采用易碎连接件，热离子电子源和/或可移动机械结构。可破坏的连接件可以包括保险丝。在一个实施例中，可移动机械结构被驱动以共振。在一些方面，电荷使得换能器将振动能量转换成电能，其可用于为电路，设备和/或其他目的供电。在一些方面，电荷用于改变机械结构的谐振频率和/或产生可能是排斥性的静电力。

42. 发明授权

US07595708B2 MEMS resonator array structure 有权
标题翻译： MEMS谐振器阵列结构
公开(公告)号：US07595708B2
公开(公告)日：2009-09-29
申请号：US11809894
申请日：2007-06-01
申请人： Markus Lutz , Aaron Partridge , Zhiyu Pan
发明人： Markus Lutz , Aaron Partridge , Zhiyu Pan
IPC分类号： H03H9/46
CPC分类号： H03H9/2405 , H03H3/0076 , H03H9/02338 , H03H9/02448 , H03H9/2431 , H03H9/462 , H03H9/505 , H03H2009/02354 , H03H2009/0244 , H03H2009/02496 , H03H2009/02503 , H03H2009/02511 , H03H2009/02527
摘要： A MEMS array structure includes MEMS resonators that form an array. Each MEMS resonator includes beam sections. At least one of the beam sections of a first one of the MEMS resonators is a shared beam section that is also included in another of the MEMS resonators adjacent to the first MEMS resonator.
摘要翻译： MEMS阵列结构包括形成阵列的MEMS谐振器。每个MEMS谐振器包括梁部分。 MEMS谐振器中的第一个的至少一个光束部分是共享光束部分，其也包括在与第一MEMS谐振器相邻的另一个MEMS谐振器中。

43. 发明授权

US07532081B2 Frequency and/or phase compensated microelectromechanical oscillator 有权
标题翻译：频率和/或相位补偿微机电振荡器
公开(公告)号：US07532081B2
公开(公告)日：2009-05-12
申请号：US11982084
申请日：2007-10-31
申请人： Aaron Partridge , Markus Lutz
发明人： Aaron Partridge , Markus Lutz
IPC分类号： H03B5/04 , H03B5/30 , H03L7/06
CPC分类号： H03L1/022 , H03B5/04 , H03B5/30 , H03L1/026 , H03L1/027 , H03L1/04 , H03L7/07 , H03L7/08 , H03L7/0812 , H03L7/1974
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a compensated microelectromechanical oscillator, having a microelectromechanical resonator that generates an output signal and frequency adjustment circuitry, coupled to the microelectromechanical resonator to receive the output signal of the microelectromechanical resonator and, in response to a set of values, to generate an output signal having second frequency. In one embodiment, the values may be determined using the frequency of the output signal of the microelectromechanical resonator, which depends on the operating temperature of the microelectromechanical resonator and/or manufacturing variations of the microelectromechanical resonator. In one embodiment, the frequency adjustment circuitry may include frequency multiplier circuitry, for example, PLLs, DLLs, digital/frequency synthesizers and/or FLLs, as well as any combinations and permutations thereof. The frequency adjustment circuitry, in addition or in lieu thereof, may include frequency divider circuitry, for example, DLLs, digital/frequency synthesizers (for example, DDS) and/or FLLs, as well as any combinations and permutations thereof.
摘要翻译：这里描述和说明了许多发明。在一个方面，本发明涉及一种补偿的微机电振荡器，其具有产生输出信号和频率调节电路的微机电谐振器，耦合到微机电谐振器以接收微机电谐振器的输出信号，并响应于一组以产生具有第二频率的输出信号。在一个实施例中，可以使用取决于微机电谐振器的操作温度和/或微机电谐振器的制造变化的微机电谐振器的输出信号的频率来确定值。在一个实施例中，频率调整电路可以包括倍频器电路，例如PLL，DLL，数字/频率合成器和/或FLL，以及它们的任何组合和排列。频率调节电路，除了或代替它，可以包括分频器电路，例如DLL，数字/频率合成器（例如，DDS）和/或FLL，以及它们的任何组合和排列。

44. 发明申请

US20090065928A1 Anti-stiction technique for electromechanical systems and electromechanical device employing same 有权
标题翻译：机电系统的抗静电技术和采用该机电系统的机电装置
公开(公告)号：US20090065928A1
公开(公告)日：2009-03-12
申请号：US12264774
申请日：2008-11-04
申请人： Markus Lutz , Aaron Partidge , Wilhelm Frey , Markus Ulm , Matthias Metz , Brian Stark , Gary Yama
发明人： Markus Lutz , Aaron Partidge , Wilhelm Frey , Markus Ulm , Matthias Metz , Brian Stark , Gary Yama
IPC分类号： H01L23/12
CPC分类号： B81C1/0096 , B81B3/0005 , B81C2201/112 , B82Y30/00 , H01L2224/13 , H01L2924/1461 , H01L2924/00
摘要： A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.
摘要翻译：机械结构设置在室中，其至少一部分由封装结构限定。第一种方法提供了通道盖，其具有至少部分地设置在防静电通道的上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。第二种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。该至少一个部分与机电装置分开制造，然后固定在机电装置上。第三种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。所述至少一个部分可以包括线球，螺柱，金属箔或焊料预制件。一种器件包括衬底，封装结构和机械结构。抗静电层设置在机械结构的至少一部分上。在基板和封装结构中的至少一个中形成抗静电通道。帽至少部分地具有设置在抗静电通道上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。

45. 发明申请

US20080290494A1 Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same 审中-公开
标题翻译：微机电结构的背面释放和/或封装及其制造方法
公开(公告)号：US20080290494A1
公开(公告)日：2008-11-27
申请号：US11804912
申请日：2007-05-21
申请人： Markus Lutz , Aaron Partridge , Paul Merritt Hagelin
发明人： Markus Lutz , Aaron Partridge , Paul Merritt Hagelin
IPC分类号： H01L23/12 , H01L21/64
CPC分类号： B81B7/0041 , B81B3/0005 , B81B2201/0235 , B81C1/00476 , B81C1/0096 , B81C2203/0145
摘要： There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ backside substrate release and/or seal or encapsulation techniques.
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及包封和制造机电结构或元件的装置，系统和/或方法，例如加速度计，陀螺仪或其他换能器（例如，压力传感器，应变传感器，触觉传感器，磁传感器和 /或温度传感器），滤波器或谐振器。本发明的制造或制造微机电系统及其制造的系统采用背面基板释放和/或密封或封装技术。

46. 发明授权

US07456042B2 Microelectromechanical systems having stored charge and methods for fabricating and using same 有权
标题翻译：具有储存电荷的微机电系统及其制造和使用方法
公开(公告)号：US07456042B2
公开(公告)日：2008-11-25
申请号：US11446850
申请日：2006-06-04
申请人： Brian H. Stark , Markus Lutz , Aaron Partridge
发明人： Brian H. Stark , Markus Lutz , Aaron Partridge
IPC分类号： H01L21/00
CPC分类号： B81B3/0086 , B81B3/0021
摘要： Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and employed in supplying, storing and/or trapping charge on the mechanical structure. In some aspects, a breakable link, a thermionic electron source and/or a movable mechanical structure are employed. The breakable link may comprise a fuse. In one embodiment, the movable mechanical structure is driven to resonate. In some aspects, the electrical charge enables a transducer to convert vibrational energy to electrical energy, which may be used to power circuit(s), device(s) and/or other purpose(s). In some aspects, the electrical charge is employed in changing the resonant frequency of a mechanical structure and/or generating an electrostatic force, which may be repulsive.
摘要翻译：许多发明被公开。一些方面涉及用于和/或制造MEMS的MEMS，和/或用于在设置在室中的机械结构上提供，存储和/或捕获电荷的方法。各种结构可以设置在室中并用于在机械结构上供应，储存和/或捕集电荷。在一些方面，采用易碎连接件，热离子电子源和/或可移动机械结构。可破坏的连接件可以包括保险丝。在一个实施例中，可移动机械结构被驱动以共振。在一些方面，电荷使得换能器将振动能量转换成电能，其可用于为电路，设备和/或其他目的供电。在一些方面，电荷用于改变机械结构的谐振频率和/或产生可能是排斥性的静电力。

47. 发明授权

US07446619B2 Temperature measurement system having a plurality of microelectromechanical resonators and method of operating same 有权
标题翻译：具有多个微机电谐振器的温度测量系统及其操作方法
公开(公告)号：US07446619B2
公开(公告)日：2008-11-04
申请号：US11453314
申请日：2006-06-14
申请人： Aaron Partridge , Bernhard E. Boser , Crist Y. Lu , Markus Lutz
发明人： Aaron Partridge , Bernhard E. Boser , Crist Y. Lu , Markus Lutz
IPC分类号： H03B5/32
CPC分类号： H03L1/022 , G01K7/32 , H03B5/04 , H03B5/30 , H03H9/02448 , H03H9/2405 , H03H2009/02527
摘要： There are many inventions described and illustrated herein. In one aspect, the present inventions relate to a temperature measurement system comprising (1) a first microelectromechanical resonator to generate a first output signal having a frequency that varies with operating temperature, wherein the first microelectromechanical resonator includes a frequency function of temperature; (2) a second microelectromechanical resonator to generate a second output signal having a frequency that varies with operating temperature, wherein the second microelectromechanical resonator includes a frequency function of temperature; and (3) frequency division circuitry, coupled to the first and second microelectromechanical resonators, to determine data which is representative of the operating temperature of the first and/or second microelectromechanical resonator using (i) data which is representative of the frequency of the first output signal and (ii) data which is representative of the frequency of the second output signal. The frequency division circuitry may include circuitry to divide the frequency of the first output signal by the frequency of the second output signal (whether in digital or analog domain).
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及一种温度测量系统，包括：（1）第一微机电谐振器，用于产生具有随工作温度变化的频率的第一输出信号，其中第一微机电谐振器包括温度的频率函数; （2）第二微机电谐振器，以产生具有随着工作温度变化的频率的第二输出信号，其中所述第二微机电谐振器包括温度的频率函数; 和（3）耦合到第一和第二微机电谐振器的分频电路，使用（i）表示第一和/或第二微机电谐振器的频率的数据来确定表示第一和/或第二微机电谐振器的操作温度的数据输出信号和（ii）表示第二输出信号的频率的数据。分频电路可以包括将第一输出信号的频率除以第二输出信号的频率（无论是在数字还是模拟域）的电路。

48. 发明申请

US20080150642A1 Frequency and/or phase compensated microelectromechanical oscillator 有权
公开(公告)号：US20080150642A1
公开(公告)日：2008-06-26
申请号：US11796990
申请日：2007-04-30
申请人： Aaron Partridge , Markus Lutz
发明人： Aaron Partridge , Markus Lutz
IPC分类号： H03B5/04 , H03B5/30
CPC分类号： H03L1/022 , H03B5/04 , H03B5/30 , H03L1/026 , H03L1/027 , H03L1/04 , H03L7/07 , H03L7/08 , H03L7/0812 , H03L7/1974
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a compensated microelectromechanical oscillator, having a microelectromechanical resonator that generates an output signal and frequency adjustment circuitry, coupled to the microelectromechanical resonator to receive the output signal of the microelectromechanical resonator and, in response to a set of values, to generate an output signal having second frequency. In one embodiment, the values may be determined using the frequency of the output signal of the microelectromechanical resonator, which depends on the operating temperature of the microelectromechanical resonator and/or manufacturing variations of the microelectromechanical resonator. In one embodiment, the frequency adjustment circuitry may include frequency multiplier circuitry, for example, PLLs, DLLs, digital/frequency synthesizers and/or FLLs, as well as any combinations and permutations thereof. The frequency adjustment circuitry, in addition or in lieu thereof, may include frequency divider circuitry, for example, DLLs, digital/frequency synthesizers (for example, DDS) and/or FLLs, as well as any combinations and permutations thereof.

49. 发明授权

US07352040B2 Microelectromechanical systems having trench isolated contacts, and methods for fabricating same 有权
标题翻译：具有沟槽隔离触点的微机电系统及其制造方法
公开(公告)号：US07352040B2
公开(公告)日：2008-04-01
申请号：US11078253
申请日：2005-03-11
申请人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
发明人： Aaron Partridge , Markus Lutz , Silvia Kronmueller
IPC分类号： H01L29/84
CPC分类号： B81C1/00301 , B81B2207/015 , B81B2207/095 , B81C2201/0176 , B81C2203/0136
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging and a contact area disposed at least partially outside the chamber. The contact area is electrically isolated from nearby electrically conducting regions by way of dielectric isolation trench that is disposed around the contact area. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构以及至少部分地设置在腔室外部的接触区域。接触区域通过设置在接触区域周围的绝缘隔离沟槽与附近的导电区域电隔离。当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。

50. 发明申请

US20070296526A1 Microelectromechanical resonator structure, and method of designing, operating and using same 有权
标题翻译：微机电谐振器结构及其设计，操作和使用方法
公开(公告)号：US20070296526A1
公开(公告)日：2007-12-27
申请号：US11731480
申请日：2007-03-30
申请人： Markus Lutz , Aaron Partridge
发明人： Markus Lutz , Aaron Partridge
IPC分类号： H03H9/46
CPC分类号： H03H9/2431 , H03H9/02259 , H03H9/02338 , H03H9/02448 , H03H9/2405 , H03H2009/02354 , H03H2009/02496 , H03H2009/02503 , H03H2009/02511 , H03H2009/02527
摘要： A micromechanical resonator structure including a plurality of straight or substantially straight beam sections that are connected by curved or rounded sections. Each elongated beam section is connected to another elongated beam section at a distal end via the curved or rounded sections thereby forming a geometric shape having at least two elongated beam sections that are interconnected via curved or rounded sections (for example, a rounded triangle shape, rounded square or rectangle shape). The structure includes one or more nodal points or areas (i.e., portions of the resonator structure that are stationary, experience little movement, and/or are substantially stationary during oscillation of the resonator structure) in one or more portions or areas of the curved sections of the structure. The nodal points are suitable and/or preferable locations to anchor the resonator structure to the substrate. In operation, the resonator structure oscillates in a combined elongating (or breathing) mode and bending mode; that is, the beam sections (which oscillate or vibrate at the same frequency) exhibit an elongating-like (or breathing-like) motion and a bending-like motion.
摘要翻译：微机械谐振器结构包括通过弯曲或圆形部分连接的多个直的或基本上直的梁部分。每个细长梁部分经由弯曲或圆形部分在远端处连接到另一个细长梁部分，从而形成具有至少两个细长梁部分的几何形状，所述细长梁部分经由弯曲或圆形部分（例如，圆形三角形形状，圆形正方形或矩形）。该结构包括在弯曲部分的一个或多个部分或区域中的一个或多个节点或区域（即，谐振器结构的静止的部分，经历少量运动和/或在谐振器结构的振荡期间基本静止）的结构。节点是合适的和/或优选的位置以将谐振器结构锚固到基底。在操作中，谐振器结构以组合延长（或呼吸）模式和弯曲模式振荡; 也就是说，以相同频率振荡或振动的光束部分呈现伸长状（或呼吸状）运动和弯曲状运动。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式