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    • 41. 发明申请
    • Optical pickup device
    • 光学拾取装置
    • US20070050799A1
    • 2007-03-01
    • US11455634
    • 2006-06-20
    • Seok KimYong YoonSoo ParkJung Pae
    • Seok KimYong YoonSoo ParkJung Pae
    • G11B7/00
    • G11B7/093G11B7/0933G11B7/0935G11B2007/0006
    • An optical pickup device is provided with a plurality of object lens corresponding to various kinds of optical discs having different recording densities, in which the structure of the optical pickup device is simplified and the size of the optical pickup device is minimized. The optical pickup device comprises a bobbin including an upper surface, at which first and second object lenses are mounted, an opened lower surface, and a first and second side surfaces supported by a supporting unit, the first and second side surfaces being opposite to each other, a first focus coil and a first tracking coil mounted at a third side surface of the bobbin, a second focus coil and a second tracking coil mounted at a fourth side surface of the bobbin, which is opposite to the third side surface, and magnets disposed opposite to the first and second focus coils and the first and second tracking coils.
    • 光拾取装置具有对应于具有不同记录密度的各种光盘的多个物镜,其中光拾取装置的结构被简化并且光拾取装置的尺寸最小化。 光学拾取装置包括一个线轴,该线轴包括安装有第一和第二物镜的上表面和一个开放的下表面,以及由支撑单元支撑的第一和第二侧表面,第一和第二侧表面与每个 另一方面,安装在线轴的第三侧面的第一聚焦线圈和第一跟踪线圈,安装在与第三侧面相对的线轴的第四侧面的第二聚焦线圈和第二跟踪线圈,以及 与第一和第二聚焦线圈以及第一和第二跟踪线圈相对设置的磁体。
    • 42. 发明申请
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US20070013034A1
    • 2007-01-18
    • US11484770
    • 2006-07-12
    • Seok Kim
    • Seok Kim
    • H01L23/544
    • H01L23/3192H01L2924/0002H01L2924/00
    • A semiconductor device consistent with the present invention includes a semiconductor substrate having a semiconductor chip region and a scribe region; a first insulating layer formed in the semiconductor chip region of the semiconductor substrate; a metal contact plug formed in the first insulating layer; a metal sidewall formed on a side of the first insulating layer in the scribe region; a metallization wiring electrically connected with the substrate via the metal contact plug; and a second insulating layer and a protective layer formed over the metal contact plug and the metal sidewall so as to cover the semiconductor chip region and the scribe region.
    • 符合本发明的半导体器件包括具有半导体芯片区域和划线区域的半导体衬底; 形成在半导体衬底的半导体芯片区域中的第一绝缘层; 形成在所述第一绝缘层中的金属接触插塞; 形成在划线区域中的第一绝缘层侧的金属侧壁; 通过所述金属接触插塞与所述基板电连接的金属化布线; 以及形成在金属接触插塞和金属侧壁上的第二绝缘层和保护层,以覆盖半导体芯片区域和划线区域。
    • 43. 发明申请
    • Dehumidifier
    • 除湿机
    • US20060278085A1
    • 2006-12-14
    • US11450414
    • 2006-06-12
    • Moon KimSeok Kim
    • Moon KimSeok Kim
    • F25D17/06B01D53/02
    • F24F3/1423B01D53/261B01D53/265F24F3/1405F24F11/52F24F2203/1012F24F2203/1032F24F2203/1056F24F2203/1068F24F2203/1084
    • The present invention relates to a dehumidifier for improving dehumidifying efficiency and easy draining of dehumidified water to an outside of the dehumidifier. The dehumidifier includes a case, an inlet passed through the case for introduction of air from an outside of the case to an inside of the case, an outlet formed to pass through a top of the case for discharging air dehumidified in the case to the outside of the case, a desiccant assembly for absorbing moisture from air drawn into the case, a blower assembly for drawing air through the inlets and blowing the air to the outlet, a regenerator assembly for blowing hot air to the desiccant assembly for drying the desiccant assembly, a heat exchanger for condensing high temperature, humid air blown by the regenerator assembly through the desiccant assembly, to separate the moisture from the air, and a filter assembly detachably mounted to the case for cleaning air drawn through the inlet.
    • 本发明涉及一种用于提高除湿效率并将除湿水容易地排入除湿器外部的除湿机。 除湿器包括壳体,通过壳体的入口,用于将空气从壳体的外部引入到壳体的内部,出口形成为穿过壳体的顶部,用于将外壳中除湿的空气排出到外部 一种用于从吸入壳体的空气吸收水分的干燥剂组件,用于通过入口抽吸空气并将空气吹送到出口的鼓风机组件,用于将热空气吹送到干燥剂组件以将干燥剂组件干燥的再生器组件 ,用于冷凝由再生器组件通过干燥剂组件吹送的高温湿空气,以将空气分离出来的热交换器,以及可拆卸地安装到壳体上用于清洁通过入口吸入的空气的过滤器组件。
    • 47. 发明申请
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US20050230718A1
    • 2005-10-20
    • US11156422
    • 2005-06-20
    • Seok Kim
    • Seok Kim
    • H01L21/336H01L21/8247H01L27/105
    • H01L27/105H01L27/11526H01L27/11536
    • A semiconductor device design is disclosed. An example semiconductor device comprises a semiconductor substrate comprising an active region and a non-active region. A first gate electrode comprising a gate oxide, a first conducting layer pattern, and an insulating layer that is configured to function as a normal gate electrode is disposed on the semiconductor substrate. Spacers are disposed on the sidewalls of the first gate electrode. A first dielectric layer is disposed on the entire surface of the semiconductor substrate except the region of the first gate electrode and the spacers. A second gate electrode comprising a portion of the first dielectric layer and a second conducting layer pattern that is configured to function as a flash memory is disposed on the semiconductor substrate.
    • 公开了半导体器件设计。 示例性半导体器件包括包含有源区和非有源区的半导体衬底。 包括栅极氧化物,第一导电层图案和被配置为用作普通栅电极的绝缘层的第一栅电极设置在半导体衬底上。 间隔件设置在第一栅电极的侧壁上。 除了第一栅电极和间隔物的区域之外,第一电介质层设置在半导体衬底的整个表面上。 包括第一电介质层的一部分的第二栅电极和被配置为用作闪存的第二导电层图案设置在半导体衬底上。
    • 48. 发明授权
    • Food cutting apparatus
    • US10953559B2
    • 2021-03-23
    • US16176129
    • 2018-10-31
    • Seok Kim
    • Seok Kim
    • B26B29/06A47J47/00B26B1/00B26B3/04B26B3/00
    • A food cutting apparatus includes first and second guide panels spaced apart from each other at a preset distance, the first and second guide panels each having a plurality of cutting slots formed downwardly at regular interval, defining a plurality of cutting guide paths to guide a cutting knife there-through to cut food products placed between the guide panels into pieces; a cutting board placed between the first and second guide panels, the cutting board having a predetermined width configured to preset the distance of the first and second guide panels by abutting the first and second guide panels against two opposing side faces of the cutting board placed there-between, thereby, enabling the user to slice the placed food products into multiple pieces using a cutting knife introduced to the plural pairs of corresponding cutting slots of the first and second guide panels; and first and second guide posts coupled perpendicularly to the first and second guide so as to guide and position the first and second guide panels at the preset distance there-between. Multiple cutting boards of different widths can be provided to place and cut different amount or rolls of the food products.