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41. 发明申请

US20120228014A1 CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD OF MAKING SAME 审中-公开
标题翻译：具有内薄膜电容器的电路衬底及其制造方法
公开(公告)号：US20120228014A1
公开(公告)日：2012-09-13
申请号：US13042578
申请日：2011-03-08
申请人： Rabindra N. Das , Mark D. Poliks , Voya R. Markovich , Peter A. Moschak
发明人： Rabindra N. Das , Mark D. Poliks , Voya R. Markovich , Peter A. Moschak
IPC分类号： H05K1/16 , B05D5/12
CPC分类号： H05K1/162 , H01G4/33 , H01G4/38 , H05K1/0231 , H05K3/4608 , H05K2201/017 , H05K2201/0179
摘要： A circuitized substrate for use in such electrical structures as information handling systems wherein the substrate includes a capacitive substrate as part thereof. The capacitive substrate includes a thin film layer of capacitive material strategically positioned on a conductive layer relative to added electrically conductive elements to in turn provide a plurality of internal capacitors within the final circuitized substrate during operation thereof. A method of making such a circuitized substrate is also provided.
摘要翻译：一种用于诸如信息处理系统的电气结构中的电路化基板，其中所述基板包括作为其一部分的电容基板。电容性衬底包括相对于添加的导电元件策略性地定位在导电层上的电容材料薄层，从而在其操作期间在最终电路化衬底内提供多个内部电容器。还提供了制造这种电路化基板的方法。

42. 发明申请

US20120068326A1 ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS 失效
标题翻译：基于热纳米脂或流体的防篡改微型包装
公开(公告)号：US20120068326A1
公开(公告)日：2012-03-22
申请号：US12884421
申请日：2010-09-17
申请人： Rabindra N. Das , Voya R. Markovich , James J. McNamara, JR. , Mark D. Poliks
发明人： Rabindra N. Das , Voya R. Markovich , James J. McNamara, JR. , Mark D. Poliks
IPC分类号： H01L23/22
CPC分类号： H01L23/42 , H01L23/573 , H01L24/13 , H01L24/16 , H01L24/29 , H01L2224/13101 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/29387 , H01L2224/29393 , H01L2224/73204 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00014
摘要： A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.
摘要翻译：防篡改微芯片封装包含流体或纳米流体填充的胶囊，通道或储存器，其中单独或组合的流体可以在尝试逆向工程化时通过蚀刻，烧结或热破坏来破坏电路。当流体填充的空腔被切掉以便对微芯片进行详细检查时，释放流体。可以将纳米流体用于烧结过程，并且还可以增加用于管芯热管理的流体的热导率。通孔和微通孔可以并入设计中以通过改善流体/芯片接触来增加电路破坏功效。也可以使用热界面材料来促进芯片冷却。

43. 发明申请

US20090258161A1 Circuitized substrate with P-aramid dielectric layers and method of making same 审中-公开
标题翻译：具有P型芳族聚酰胺介电层的电路基板及其制造方法
公开(公告)号：US20090258161A1
公开(公告)日：2009-10-15
申请号：US12380637
申请日：2009-03-02
申请人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
发明人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
IPC分类号： B05D5/12 , B05D3/06
CPC分类号： H01L23/145 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2924/12044 , H01L2924/15311 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4652 , H05K2201/0209 , H05K2201/0278
摘要： A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.
摘要翻译：一种电路化基板，包括具有浸渍有无卤低吸湿树脂的对芳族聚酰胺纸，并且不包括作为其一部分的连续或半连续玻璃纤维纤维的介电层和位于介电层上的第一电路层。还提供了制造该基板的方法。

44. 发明申请

US20090093073A1 Method of making circuitized substrate with internal optical pathway using photolithography 失效
标题翻译：使用光刻法制造具有内部光学路径的电路化衬底的方法
公开(公告)号：US20090093073A1
公开(公告)日：2009-04-09
申请号：US11907004
申请日：2007-10-09
申请人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
发明人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
IPC分类号： H01L21/77
CPC分类号： G02B6/43 , G02B6/132 , G02B6/136 , H05K1/0274
摘要： A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The method involves forming at least one opening between a side of the optical core and an adjacent upstanding member such that the opening is defined by at least one angular sidewall. Light passing through the optical core material (or into the core from above) is reflected off this angular sidewall. The medium (e.g., air) within the opening thus also serves as a reflecting medium due to its own reflective index in comparison to that of the adjacent optical core material. The method utilizes many processes used in conventional PCB manufacturing, thereby keeping costs to a minimum. The formed substrate is capable of being both optically and electrically coupled to one or more other substrates possessing similar capabilities, thereby forming an electro-optical assembly of such substrates.
摘要翻译：一种制造电路化衬底（例如，PCB）的方法，其包括至少一个可能的几个内部光学路径作为其一部分，使得所得到的衬底将能够传输和/或接收电信号和光信号。该方法包括在光学核心的一侧和相邻的直立构件之间形成至少一个开口，使得开口由至少一个角形侧壁限定。通过光学芯材料（或从上方进入芯体）的光从该角形侧壁反射。因此，开口内的介质（例如空气）由于其相对于相邻的光学芯材料的反射率而与反射介质一样起作用。该方法利用了常规PCB制造中使用的许多工艺，从而将成本降至最低。所形成的基底能够光学和电耦合到具有相似能力的一个或多个其它基底，从而形成这种基底的电光学组件。

45. 发明申请

US20090092353A1 Method of making circuitized substrate with internal optical pathway 有权
标题翻译：制造具有内部光通路的电路化基板的方法
公开(公告)号：US20090092353A1
公开(公告)日：2009-04-09
申请号：US11907006
申请日：2007-10-09
申请人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
发明人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
IPC分类号： G02B6/122
CPC分类号： G02B6/1221 , G02B6/132 , G02B6/136 , G02B6/4214 , G02B6/4246 , H05K1/0274
摘要： A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.
摘要翻译：包括作为其一部分的内部光学路径的电路化衬底（例如，PCB），使得衬底能够传输和/或接收电信号和光信号。衬底包括在一个包覆层上的角反射器，使得穿过光学核心的光信号将撞击角形反射器的成角度的反射表面，并通过开口（包括其中具有光学透明材料的一个）反射，例如涉及另外还具有至少一个内部光学路径作为其一部分的第二电路化基板，从而光学地连接两个基板。还提供了制造基板的方法。

46. 发明授权

US06207595B1 Laminate and method of manufacture thereof 失效
标题翻译：层压板及其制造方法
公开(公告)号：US06207595B1
公开(公告)日：2001-03-27
申请号：US09033505
申请日：1998-03-02
申请人： Bernd K. Appelt , Lawrence R. Blumberg , William T. Fotorny , Ross D. Havens , Robert M. Japp , Kostas Papathomas , Jan Obrzut , Mark D. Poliks , Amarjit S. Rai
发明人： Bernd K. Appelt , Lawrence R. Blumberg , William T. Fotorny , Ross D. Havens , Robert M. Japp , Kostas Papathomas , Jan Obrzut , Mark D. Poliks , Amarjit S. Rai
IPC分类号： B32B2704
CPC分类号： H01L23/564 , H01L23/08 , H01L23/145 , H01L2924/0002 , H05K1/0366 , H05K2201/029 , H05K2201/0761 , Y10T442/2475 , Y10T442/2959 , Y10T442/2992 , H01L2924/00
摘要： A fabric material and method of its manufacture suitable for use in electronic packages including chip carriers. High insulation resistance is exhibited when subjected to high temperatures and humidity stress conditions.
摘要翻译：一种其制造的织物材料及其制造方法，其适用于包括芯片载体的电子封装。当受到高温和高湿度条件的影响时，表现出高的绝缘电阻。

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