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    • 41. 发明授权
    • EEPROM with split gate source side injection
    • 带分流栅源的EEPROM注入
    • US5313421A
    • 1994-05-17
    • US820364
    • 1992-01-14
    • Daniel C. GutermanGheorghe SamachisaYupin K. FongEliyahou Harrai
    • Daniel C. GutermanGheorghe SamachisaYupin K. FongEliyahou Harrai
    • G11C17/00G11C11/56G11C16/02G11C16/04H01L21/8247H01L27/115H01L29/423H01L29/788H01L29/792H01L29/68H01L29/78
    • G11C11/5621G11C11/5628G11C11/5635G11C11/5642H01L27/115H01L29/42324H01L29/42328H01L29/7885G11C2211/5634
    • Novel memory cells utilize source-side injection, allowing very small programming currents. If desired, to-be-programmed cells are programmed simultaneously while not requiring an unacceptably large programming current for any given programming operation. In one embodiment, memory arrays are organized in sectors with each sector being formed of a single column or a group of columns having their control gates connected in common. In one embodiment, a high speed shift register is used in place of a row decoder to serially shift in data for the word lines, with all data for each word line of a sector being contained in the shift register on completion of its serial loading. In one embodiment, speed is improved by utilizing a parallel loaded buffer register which receives parallel data from the high speed shift register and holds that data during the write operation, allowing the shift register to receive serial loaded data during the write operation for use in a subsequent write operation. In one embodiment, a verification is performed in parallel on all to-be-programmed cells in a column and the bit line current monitored. If all of the to-be-programmed cells have been properly programmed, the bit line current will be substantially zero. If bit line current is detected, another write operation is performed on all cells of the sector, and another verify operation is performed. This write/verify procedure is repeated until verification is successful, as detected or substantially zero, bit line current.
    • 新型存储单元利用源侧注入,允许非常小的编程电流。 如果需要,对于任何给定的编程操作,被编程的单元被同时编程,而不需要不可接受的大的编程电流。 在一个实施例中,存储器阵列被组织在扇区中,其中每个扇区由单个列或一组具有共同连接的控制门的列组成。 在一个实施例中,代替行解码器来使用高速移位寄存器来对字线的数据进行串行移位,在其串行加载完成时扇区的每个字线的所有数据都包含在移位寄存器中。 在一个实施例中,通过利用并行加载的缓冲寄存器来提高速度,所述缓冲寄存器从高速移位寄存器接收并行数据,并且在写入操作期间保持该数据,从而允许移位寄存器在写操作期间接收串行加载的数据,以用于 后续写操作。 在一个实施例中,在列中的所有要编程的单元并行地执行验证,并监视位线电流。 如果所有待编程的单元都已被正确编程,则位线电流将基本为零。 如果检测到位线电流,则对扇区的所有单元执行另一写操作,并且执行另一验证操作。 重复此写/验证过程,直到验证成功,如检测到或基本为零,位线电流。
    • 42. 发明授权
    • MOS Random access memory cell with nonvolatile storage
    • MOS随机存取存储单元,具有非易失性存储
    • US4510584A
    • 1985-04-09
    • US454418
    • 1982-12-29
    • Donald R. DiasDaniel C. GutermanRobert J. ProebstingHorst Leuschner
    • Donald R. DiasDaniel C. GutermanRobert J. ProebstingHorst Leuschner
    • G11C14/00G11C11/40
    • G11C14/00
    • A nonvolatile random access memory cell (10) includes a static random access memory circuit and a corresponding nonvolatile memory circuit. The volatile memory circuit operates in a conventional manner and has first and second data states. Upon receipt of a store command signal a charge storage node is driven to either a first or a second charge state, depending upon the data state in the volatile memory circuit. For one charge state the charge storage signal is gated through a transistor (64) and a capacitor (68) to a floating gate node (44). Charge is transferred to and from the floating gate node (44) through current tunneling elements (48,50) which comprise a dielectric fabricated on a monocrystalline substrate. For the recall operation a recall command signal is applied to a transistor (52) which couples a transistor (42) to the DATA node (22) of the volatile memory circuit. If a positive charge state has been stored at the charge storage node (44) the transistor (42) is rendered conductive to pull the DATA node (22) to ground to restore the data state to the volatile memory circuit. If a negative charge state has been stored at the charge storage node (44) there is no load applied to either the DATA node (20) or the DATA node (22). The cross-couple transistors, (12,14) are fabricated to have different lengths such that the node (22) is driven to a high voltage state whenever a default condition is encountered, thereby restoring the original data state to the volatile memory circuit.
    • 非易失性随机存取存储器单元(10)包括静态随机存取存储器电路和相应的非易失性存储器电路。 易失性存储器电路以常规方式工作并具有第一和第二数据状态。 在接收到存储命令信号时,根据易失性存储器电路中的数据状态,电荷存储节点被驱动到第一或第二充电状态。 对于一个充电状态,电荷存储信号通过晶体管(64)和电容器(68)被选通到浮动栅极节点(44)。 电荷通过包括在单晶衬底上制造的电介质的电流隧穿元件(48,50)传送到浮栅节点(44)。 对于调用操作,将调用命令信号施加到将晶体管(42)耦合到易失性存储器电路的& D&D节点(22)的晶体管(52)。 如果正电荷状态已经存储在电荷存储节点(44)处,晶体管(42)被导通以将&上升&D节点(22)拉到地,以将数据状态恢复到易失性存储器电路。 如果在电荷存储节点(44)处存储了负电荷状态,则没有负载施加到DATA节点(20)或者& Upbar&D节点(22)上。 交叉耦合晶体管(12,14)被制造成具有不同的长度,使得每当遇到默认条件时,节点(22)被驱动到高电压状态,从而将原始数据状态恢复到易失性存储器电路。
    • 43. 发明授权
    • Directly-coupled and capacitively coupled nonvolatile static RAM cell
    • 直接耦合和电容耦合的非易失性静态RAM单元
    • US4408303A
    • 1983-10-04
    • US335160
    • 1981-12-28
    • Daniel C. GutermanJames D. Kupec
    • Daniel C. GutermanJames D. Kupec
    • G11C14/00G11C11/24G11C11/40
    • G11C14/00
    • A nonvolatile static random access memory cell (10) for storing data in a nonvolative state and recalling the data in its true state is disclosed. Cross-coupled transistors (12, 14) are provided having respective first and second nodes (16, 18) which are maintained at complementary logic states for volatile data storage. At least one tunnel capacitor (34), each having a floating node (36) is operatively coupled to the gate and drain terminals of one of said cross-coupled transistors (12, 14). At least one switch transistor (48) is operatively coupled to one of the first and second nodes (16, 18) and to one tunnel capacitor floating node (36). The at least one tunnel capacitor (34) and the at least one switch transistor (48) operatively coact for nonvolatile saving of volatile data stored in the cross-coupled transistors (12, 14), for recalling nonvolatile stored data in its true state to the cross-coupled transistors (12, 14), by the capacitive imbalance on the first and second nodes (16, 18). Coupling means (50, 54) operatively connected between the switch transistors (48, 52) and the first and second nodes (16, 18) are coupled to one supply (V.sub.cc or V.sub.SS) in such fashion as to prevent interference between volatile and nonvolative data storage.
    • 公开了一种非易失性静态随机存取存储器单元(10),用于存储处于非旋转状态的数据并且调用其真实状态的数据。 提供交叉耦合晶体管(12,14),其具有相应的第一和第二节点(16,18),其维持在用于易失性数据存储的互补逻辑状态。 每个具有浮动节点(36)的至少一个隧道电容器(34)可操作地耦合到所述交叉耦合晶体管(12,14)之一的栅极和漏极端子。 至少一个开关晶体管(48)可操作地耦合到第一和第二节点(16,18)中的一个以及一个隧道电容器浮动节点(36)。 所述至少一个隧道电容器(34)和所述至少一个开关晶体管(48)可操作地共同用于非易失性地保存存储在交叉耦合晶体管(12,14)中的易失性数据,用于将其处于其真实状态的非易失性存储数据调回到 交叉耦合晶体管(12,14),通过第一和第二节点(16,18)上的电容性不平衡。 可操作地连接在开关晶体管(48,52)与第一和第二节点(16,18)之间的耦合装置(50,54)以这样的方式耦合到一个电源(Vcc或VSS),以防止在易失性和非旋转之间的干扰 数据存储。
    • 49. 发明授权
    • System and method for programming cells in non-volatile integrated memory devices
    • 用于在非易失性集成存储器件中编程单元的系统和方法
    • US07630237B2
    • 2009-12-08
    • US11196547
    • 2005-08-02
    • Nima MokhlesiDaniel C. Guterman
    • Nima MokhlesiDaniel C. Guterman
    • G11C11/34
    • G11C16/12G11C11/5628G11C11/5671G11C16/3459G11C16/3468G11C16/3481G11C2211/5621
    • A system and method for quickly and efficiently programming hard-to-program storage elements in non-volatile integrated memory devices is presented. A number of storage elements are simultaneously subjected to a programming process with the current flowing through the storage elements limited to a first level. As a portion of these storage elements reach a prescribed state, they are removed from the set of cells being programmed and the current limit on the elements that continue to be programmed is raised. The current level in these hard-to-program cells can be raised to a second, higher limit or unregulated. According to another aspect, during a program operation the current limit allowed for a cell depends upon the target state to which it is to be programmed.
    • 提出了一种用于在非易失性集成存储器件中快速高效地编程难编程存储元件的系统和方法。 多个存储元件同时进行编程处理,其中流过存储元件的电流限于第一级。 随着这些存储元件的一部分达到规定的状态,它们被从被编程的单元组移除,并且提高了继续编程的元件上的电流限制。 这些难以编程的单元格中的当前级别可以提高到第二个,更高的限制或不受管制。 根据另一方面,在程序操作期间,允许单元的电流限制取决于要被编程的目标状态。