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41. 发明授权

US06969425B2 Methods for reducing the curvature in boron-doped silicon micromachined structures 失效
公开(公告)号：US06969425B2
公开(公告)日：2005-11-29
申请号：US10346887
申请日：2003-01-17
申请人： Cleopatra Cabuz , Max C. Glenn , Francis M. Erdmann , Robert D. Horning
发明人： Cleopatra Cabuz , Max C. Glenn , Francis M. Erdmann , Robert D. Horning
IPC分类号： B81B3/00 , B81C1/00 , H01L21/308 , H01L29/84 , C30B1/10
CPC分类号： B81C1/00365 , B81C2201/0164 , Y10T428/21 , Y10T428/2495
摘要： Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.

42. 发明授权

US06912902B2 Bending beam accelerometer with differential capacitive pickoff 有权
标题翻译：具有差动电容式传感器的弯曲加速度计
公开(公告)号：US06912902B2
公开(公告)日：2005-07-05
申请号：US10400591
申请日：2003-03-26
申请人： David L. Malametz , Stephen F. Becka , Robert D. Horning
发明人： David L. Malametz , Stephen F. Becka , Robert D. Horning
IPC分类号： B81B3/00 , G01P15/08 , G01P15/125
CPC分类号： B81B3/0072 , B81B2201/0235 , G01P15/08 , G01P15/125 , G01P2015/0831
摘要： A low cost, pendulous, capacitive-sensing Micro Electro-Mechanical Systems (MEMS) accelerometer is provided. The accelerometer includes a pendulous proof mass, one or more securing pads, and one or more flexures coupled with the pendulous proof mass and the one or more securing pads. The flexures flex linearly with respect to motion of the pendulous proof mass. First and second capacitor plates are positioned relative to the pendulous proof mass for detecting motion of the proof mass according to a sensed difference in capacitance. One or more strain isolation beams are connected between the one or more flexures and the pendulous proof mass or the securing pads. The strain isolation beams protect the flexures from mechanical strain.
摘要翻译：提供了一种低成本，下摆的电容感应微机电系统（MEMS）加速度计。该加速度计包括防晕质量块，一个或多个固定垫，以及一个或多个弯曲件，其与防倒伏质量块和一个或多个固定垫结合。弯曲物相对于防倒体块的运动线性地弯曲。第一和第二电容器板相对于防倒伏质量定位，用于根据感测到的电容差来检测检验质量块的运动。一个或多个应变隔离梁连接在一个或多个挠曲件和防倒冲质量块或固定垫之间。应变隔离梁保护挠曲免受机械应变。

43. 发明授权

US06770504B2 Methods and structure for improving wafer bow control 有权
标题翻译：改善晶圆弓形控制的方法和结构
公开(公告)号：US06770504B2
公开(公告)日：2004-08-03
申请号：US10337011
申请日：2003-01-06
申请人： Robert D. Horning , McDonald Robinson , Timothy Louis Scullard
发明人： Robert D. Horning , McDonald Robinson , Timothy Louis Scullard
IPC分类号： H01L2100
CPC分类号： B81C1/00666 , B81C2201/0167 , Y10T74/12
摘要： A method for controlling bow in wafers which utilize doped layers is described. The method includes depositing a silicon-germanium layer onto a substrate, depositing an undoped buffer layer onto the silicon-germanium layer, and depositing a silicon-baron layer onto the undoped layer.
摘要翻译：描述了一种利用掺杂层在晶片中控制弓形的方法。该方法包括将硅 - 锗层沉积到衬底上，将未掺杂的缓冲层沉积到硅 - 锗层上，以及将硅 - 硅酮层沉积到未掺杂的层上。

44. 发明授权

US5683594A Method for making diaphragm-based sensors and apparatus constructed therewith 失效
标题翻译：用于制造基于膜片的传感器的方法和由其构造的装置
公开(公告)号：US5683594A
公开(公告)日：1997-11-04
申请号：US217044
申请日：1994-03-24
申请人： G. Benjamin Hocker , David W. Burns , Akintunde I. Akinwande , Robert D. Horning , Amir R. Mirza , Thomas G. Stratton , Deidrich J. Saathoff , James K. Carney , Scott A. McPherson
发明人： G. Benjamin Hocker , David W. Burns , Akintunde I. Akinwande , Robert D. Horning , Amir R. Mirza , Thomas G. Stratton , Deidrich J. Saathoff , James K. Carney , Scott A. McPherson
IPC分类号： G01L9/04 , B81C1/00 , G01L9/00 , G01L9/12 , H01L21/02 , H01L21/20 , H01L21/306 , H01L29/84 , B32B31/00
CPC分类号： B81C1/00182 , G01L9/0042 , G01L9/0073 , H01L21/2007 , B81B2201/0292 , B81B2203/0127
摘要： This patent relates to the fabrication of diaphragm-based microstructures used primarily for sensing physical phenomena by detecting a change in deflection, resonance, or curvature of the diaphragm. The methods of fabrication described and claimed herein relate primarily to diaphragm-based diaphragms made of silicon, either single crystal or polycrystalline in form, although other materials may be used.
摘要翻译：该专利涉及通过检测隔膜的偏转，共振或曲率的变化来主要用于感测物理现象的基于隔膜的微结构的制造。本文所述和要求保护的制造方法主要涉及由硅制成的隔膜式隔膜，其形式为单晶或多晶，尽管可以使用其他材料。

45. 发明授权

US09493344B2 MEMS vertical comb structure with linear drive/pickoff 有权
标题翻译：具有线性驱动/拾取的MEMS垂直梳结构
公开(公告)号：US09493344B2
公开(公告)日：2016-11-15
申请号：US13301172
申请日：2011-11-21
申请人： Robert D. Horning , Ryan Supino
发明人： Robert D. Horning , Ryan Supino
IPC分类号： G06F15/00 , B81B3/00
CPC分类号： B81B3/0086 , B81B2201/025 , B81B2203/0136 , Y10T29/49117
摘要： A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs. The proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one anchor having a second plurality of combs. The anchor is coupled to the substrate such that the anchor and second plurality of combs are fixed in position relative to the substrate. The first plurality of combs are interleaved with the second plurality of combs. Each of the combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that capacitance between the combs varies approximately linearly with displacement of the movable combs in an out-of-plane direction.
摘要翻译： MEMS传感器包括基板和至少一个具有第一多个梳子的检测质量块。检测质量通过一个或多个悬架梁耦合到基板，使得检验质量块和第一组多个梳子可移动。 MEMS传感器还包括具有第二多个梳子的至少一个锚固件。锚固件联接到基板，使得锚固件和第二多个梳子相对于基板固定在适当位置。第一组多个梳子与第二组梳子交错。每个梳子包括通过一个或多个非导电层彼此电隔离的多个导电层。每个导电层单独地耦合到相应的电位，使得梳子之间的电容随着可移动梳状体在平面外方向上的位移而近似线性地变化。

46. 发明授权

US09227835B2 Vibration isolation interposer die 有权
标题翻译：振动隔离插入器模具
公开(公告)号：US09227835B2
公开(公告)日：2016-01-05
申请号：US13299485
申请日：2011-11-18
申请人： Robert D. Horning , Ryan Supino
发明人： Robert D. Horning , Ryan Supino
IPC分类号： B81B7/00
CPC分类号： B81B7/0016 , B81B2201/025 , B81B2207/07
摘要： In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.
摘要翻译：在一个示例中，提供了插入器芯片。插入片包括基部和芯片安装部。插入器芯片还包括将基部连接到芯片安装部分的一个或多个挠曲件。此外，第一多个突起从基部朝向芯片安装部分延伸，并且第二多个突起从芯片安装部分朝向基部延伸并延伸到由第一多个突起形成的间隙中。

47. 发明授权

US08776601B2 MEMS sensor using multi-layer movable combs 有权
标题翻译： MEMS传感器采用多层活动梳
公开(公告)号：US08776601B2
公开(公告)日：2014-07-15
申请号：US13301145
申请日：2011-11-21
申请人： Robert D. Horning , Ryan Supino
发明人： Robert D. Horning , Ryan Supino
IPC分类号： G01P15/125 , G01C19/56
CPC分类号： B81B3/0086 , B81B2201/025 , B81B2203/0136
摘要： A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs, wherein the proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one fixed anchor having a second plurality of combs. The first plurality of combs is interleaved with the second plurality of combs. Each of the combs in the first plurality of combs and the second plurality of combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that fringing electric fields are screened to reduce motion of the first plurality of combs along a sense axis due to the fringing electric fields.
摘要翻译： MEMS传感器包括基板和至少一个具有第一多个梳子的检测质量块，其中所述检测质量块经由一个或多个悬架梁耦合到所述基板，使得所述检验质量块和所述第一多个梳子是可移动的。 MEMS传感器还包括具有第二多个梳子的至少一个固定锚固件。第一组多个梳子与第二组梳子交错。第一多个梳子中的每个梳子和第二个多个梳子包括通过一个或多个非导电层彼此电隔离的多个导电层。每个导电层单独地耦合到相应的电位，使得边缘电场被屏蔽以由于边缘电场而沿着感测轴减小第一组多个梳的运动。

48. 发明授权

US08363303B2 Photonic structures and photonic devices 失效
标题翻译：光子结构和光子器件
公开(公告)号：US08363303B2
公开(公告)日：2013-01-29
申请号：US12750383
申请日：2010-03-30
申请人： Robert D. Horning , Robert Compton
发明人： Robert D. Horning , Robert Compton
IPC分类号： G02B26/00
CPC分类号： B82Y20/00 , G02B1/005 , G02F1/0131 , G02F2202/32
摘要： Photonic structures and photonic devices are provided. A photonic structure includes a three-dimensional photonic crystal and an actuator. The three-dimensional photonic crystal comprises an elastomeric, auxetic material and configured to provide a predetermined optical bandgap. The actuator is coupled to the three-dimensional photonic crystal and is configured to compress the three-dimensional photonic crystal. When the actuator compresses the three-dimensional photonic crystal, the three-dimensional photonic crystal shifts from reflecting light in a first wavelength range to light in a second wavelength range.
摘要翻译：提供光子结构和光子器件。光子结构包括三维光子晶体和致动器。三维光子晶体包括弹性材料，并且被配置为提供预定的光学带隙。致动器耦合到三维光子晶体并被配置为压缩三维光子晶体。当致动器压缩三维光子晶体时，三维光子晶体从第一波长范围内的反射光移动到第二波长范围内的光。

49. 发明申请

US20120126349A1 SYSTEMS AND METHODS FOR A THREE-LAYER CHIP-SCALE MEMS DEVICE 有权
标题翻译：用于三层芯片尺寸MEMS器件的系统和方法
公开(公告)号：US20120126349A1
公开(公告)日：2012-05-24
申请号：US13296642
申请日：2011-11-15
申请人： Robert D. Horning , Ryan Supino
发明人： Robert D. Horning , Ryan Supino
IPC分类号： H01L29/84 , H01L21/78
CPC分类号： H01L29/84 , B81B7/0032 , B81B7/0038 , B81B7/0074 , B81B7/0077 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81C2201/019 , H01L2224/48091 , H01L2924/00014
摘要： Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.
摘要翻译：提供了一种用于微机电系统（MEMS）装置的系统和方法。在一个实施例中，系统包括第一外层和包括第一组MEMS器件的第一器件层，其中第一器件层接合到第一外层。该系统还包括第二外层和包括第二组MEMS器件的第二器件层，其中第二器件层结合到第二外层。此外，该系统包括具有第一侧和与第一侧相反的第二侧的中心层，其中第一侧接合到第一器件层，第二侧接合到第二器件层。

50. 发明授权

US07977786B2 Saw debris reduction in MEMS devices 有权
标题翻译：在MEMS器件中锯屑减少
公开(公告)号：US07977786B2
公开(公告)日：2011-07-12
申请号：US12180320
申请日：2008-07-25
申请人： Jeff A. Ridley , Max Glenn , James C. Nohava , Robert D. Horning , Jane Rekstad
发明人： Jeff A. Ridley , Max Glenn , James C. Nohava , Robert D. Horning , Jane Rekstad
IPC分类号： H01L21/00 , H01L23/04
CPC分类号： B81C1/00896 , B81B2207/07 , B81C2203/0118 , B81C2203/019
摘要： An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area.
摘要翻译：改进的MEMS器件及其制造方法。通道形成在第一基板周围围绕先前形成在第一基板上的多个MEMS器件区域。然后，多个密封环被施加在多个MEMS器件区域周围并且在形成的通道的至少一部分上。第二基板附接到第一基板，然后密封环包围的MEMS器件区域彼此分离。通道包括第一和第二截面区域。第一横截面面积的大小用于保持锯屑颗粒进入MEMS器件区域。

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