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    • 44. 发明申请
    • Voltage Regulator Module with Power Gating and Bypass
    • 具有电源门控和旁路的稳压器模块
    • US20120119717A1
    • 2012-05-17
    • US12944392
    • 2010-11-11
    • Pradip BoseAlper BuyuktosunogluHans M. JocobsonSeongwon Kim
    • Pradip BoseAlper BuyuktosunogluHans M. JocobsonSeongwon Kim
    • G05F1/10
    • G05F1/575G05F1/565
    • Mechanisms are provided for either power gating or bypassing a voltage regulator. Responsive to receiving an asserted power gate signal to power gate the output voltage of the voltage regulator, at least one of first control circuitry power gates the output voltage of a first circuit or second control circuitry power gates the output voltage of a second circuit such that substantially no voltage to is output by the first circuit to a primary output node. Responsive to receiving an asserted bypass signal to bypass the output voltage of the voltage regulator, at least one of the first control circuitry bypasses the output voltage of the first circuit or the second control circuitry bypasses the output voltage of a second circuit such that substantially the voltage of a voltage source is output by the first circuit to the primary output node.
    • 提供电源门控或旁路电压调节器的机制。 响应于接收到被断言的电源门信号以对所述电压调节器的输出电压进行电源门控,第一控制电路电源的至少一个功率门是第一电路或第二控制电路电路的输出电压门控第二电路的输出电压,使得 基本上没有电压被第一电路输出到主输出节点。 响应于接收断言的旁路信号以绕过电压调节器的输出电压,第一控制电路中的至少一个旁路第一电路或第二控制电路的输出电压旁路第二电路的输出电压,使得基本上 电压源的电压由第一电路输出到主输出节点。
    • 49. 发明授权
    • Current-aware floorplanning to overcome current delivery limitations in integrated circuits
    • 电流识别布局规划,以克服集成电路中的当前传输限制
    • US08863068B2
    • 2014-10-14
    • US13526194
    • 2012-06-18
    • Pradip BoseAlper BuyuktosunogluJohn A. DarringerMoinuddin K. QureshiJeonghee Shin
    • Pradip BoseAlper BuyuktosunogluJohn A. DarringerMoinuddin K. QureshiJeonghee Shin
    • G06F17/50
    • G06F17/5072G06F17/50G06F2217/78
    • A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon” current optimizing programming methodologies to improve and optimize current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The mechanism consists of measuring or estimating power consumption at a certain granularity within a chip, converting the power information into C4 current information using a method, and triggering throttling mechanisms (including token based throttling) where applicable to limit the current delivery per C4 beyond pre-established limits or periods. Design aids are used to allocate C4s throughout the chip based on the current delivery requirements. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.
    • 与“前置硅”设计方法和“后硅”当前优化编程方法相结合的动态系统,以改进和优化当前传输到芯片的传输,这受到连接的物理特性的限制(例如,受控崩溃芯片连接或 C4s)。 该机制包括测量或估计芯片内特定粒度的功耗,使用一种方法将功率信息转换为C4当前信息,并在适用的情况下触发限流机制(包括基于令牌的限制),以限制每个C4超过预先的当前传输 - 建立的限制或期限。 设计辅助工具用于根据当前交付要求在整个芯片上分配C4。 该系统与设计和编程方法相结合,改进并优化电流传递可扩展到多层3D芯片堆叠中的层间连接。